Abstract:
A process for the definition of integrated circuits on a wafer having at least one silicon semiconductor layer includes masking the wafer with a photoresist layer. The process includes a development step of the photoresist with definition of a lithographic pattern, a hardening step of the photoresist with a plasma of inert gas, and a dry etching step with a plasma of reactive gas for transferring the lithographic pattern on the wafer. The dry etching step includes at least an initial step, or breakthrough, with a plasma of a chlorinated gas and of an inert gas for removal of a silicon native oxide grown on the wafer.
Abstract:
Color image signals, as derived, e.g., by interpolating the output from a color filter array are arranged in pixels, each pixel having associated detected color information for a first color as well as undetected filled-in color information for at least a second and a third color. The images are thus exposed to false color and zipper effect artifacts, and are subject to processing preferably including the steps of: checking the images for the presence of zipper effect artifacts, and i) if said checking reveals the presence of zipper effect artifacts, applying a zipper effect removal process to said image signals; ii) if said checking fails to reveal the presence of zipper effect artifacts, applying a false color removal process to said image signals. False color and zipper effect artifacts are thus preferably both reduced by adaptively using the zipper effect removal process and the false color removal process.
Abstract:
A vertical conduction electronic power device includes respective gate, source and drain areas, realized in an epitaxial layer arranged on a semiconductor substrate. The respective gate, source and drain metallizations may be realized by a first metallization level. The gate, source and drain terminals or pads may be realized by a second metallization level. The device is configured as a set of modular areas extending parallel to each other, each having a rectangular elongate source area perimetrically surrounded by a narrow gate area, and separated from each other by regions with the drain area extending parallel and connected at the opposite ends thereof to a second closed region with the drain area forming a device outer peripheral edge. A sinker structure extends perpendicularly to the substrate and may be formed by a grid of sinkers located below both the first parallel regions and the second closed region to favor a conductive channel for a current coming from the source area and directed towards the drain area across the substrate.
Abstract:
A self diagnosis (BISD) device for a random memory array, preferably integrated with the random access memory, executes a certain number of predefined test algorithms and identifies addresses of faulty locations. The BISD device recognizes certain fail patterns of interest and generates bit-strings corresponding to them. In practice, the BISD device may diagnose memory arrays and allow the identification of defects in the production process that affect a new technology during its learning phase, thus accelerating its maturation.
Abstract:
A sensing circuit is provided for sensing semiconductor memory cells. The sensing circuit includes at least one first circuit branch, a feedback-controlled circuit element in the first circuit branch, a current-to-voltage conversion circuit in the first branch, and at least one comparator. The first circuit branch is coupled to a memory cell to be sensed so as to be run through by a current corresponding to a memory cell state. The feedback-controlled circuit element controls a memory cell access voltage, and the current-to-voltage conversion circuit converts the current into a corresponding converted voltage signal that is indicative of the memory cell state. The comparator compares the converted voltage signal with a comparison voltage for discriminating among at least two different states of the memory cell. The converted voltage signal corresponds to a control signal of the feedback-controlled circuit element. Also provided is a method of sensing a memory cell.
Abstract:
An electrically programmable memory including: an array of a plurality of memory cells arranged accordingly to a NAND architecture, said memory cells grouped into a plurality of memory blocks and each memory block including a plurality of memory pages; means for receiving an address corresponding to a respective memory block; selecting means for selecting the addressed memory block; and means for detecting a failure of the addressed memory block, wherein the means for detecting a failure includes: a plurality of registers, each register corresponding to a respective memory block and storing an indication of the failure of the respective memory block; and means for reading the register corresponding to the addressed memory block in response to the receiving of the address, and wherein the programmable memory further includes at least one redundant memory block of memory cells including a plurality of redundant memory pages, the selecting means selecting the at least one redundant memory block in place of the addressed memory block in response to the reading of the indication of the failure.
Abstract:
A method and an element for ciphering with an integrated processor data to be stored in a memory, including applying to each data block to be ciphered a ciphering algorithm which is a function of at least one key specific to the integrated circuit, and before applying the ciphering algorithm thereto, combining the data block to be ciphered with the result of a function of the storage address of the ciphered block in the memory, and/or of combining the key with the result of a function of the storage address of the ciphered block in the memory and of a digital quantity different from the ciphering key.
Abstract:
The method is directed to encoding/decoding a video signal sequence by generating therefrom multiple description subsequences wherein the subsequences are produced by a plurality of parallel video encoding processes based on respective encoding parameters. The method includes the step of commonly controlling the encoding/decoding parameters for the plurality of video encoding/decoding processes.
Abstract:
Transmitter device including a modulator apparatus for the generation of a modulated digital signal in a remote control system. The modulated signal is defined by at least one characteristic quantity correlated to an information to transmit. The modulator apparatus is characterized by including a finite states machine for generating a modulating digital signal to combine with a carrier signal and obtain the modulated signal. The finite states machine generates the modulating signal on the basis of digital data corresponding to said at least one characteristic quantity.
Abstract:
A memory device formed by an array of memory cells extending in rows and columns. The device is formed by a plurality of N-type wells extending parallel to the rows; each N-type well houses a plurality of P-type wells extending in a direction transverse to the rows. A plurality of main bitlines extend along the columns. Each P-type well is associated to a set of local bitlines that extend along the respective P-type well and are coupled to the drain terminals of the cells accommodated in the respective P-type well. Local-bitlines managing circuits are provided for each P-type well and are located between the main bitlines and a respective set of local bitlines for controllably connecting each local bitline to a respective main bitline.