Abstract:
A processing system connected to an apparatus includes a non-volatile memory (NVM) for storing firmware needed by the processing system; and an NVM control interface capable of writing and reading data stored in the NVM; wherein the NVM control interface reads a previous piece of data being already written into the NVM prior to a current piece of data and transmits the previous piece of data to the apparatus for comparison with original data that was previously written into the NVM, and the NVM control interface writes the current piece of data into the NVM.
Abstract:
This invention provides a method for production of AlN powder. An Al powder was poured into a refractory container having an opening end. If the packing density of the Al powder was less than 0.8 g/cm3, the container containing the Al powder was placed in a reaction chamber filled with nitrogen. If the packing density was larger than 0.8 g/cm3, porous aluminum tubes were placed vertically in Al powder or an initiator was placed on top of the Al powder or both were taken. The container was then placed in the reaction chamber filled with nitrogen. A nitrogen stream was allowed to flow through the Al powder from the bottom to the top and the combustion synthesis reaction was ignited by heating the top surface of the reactant powder.
Abstract translation:本发明提供一种生产AlN粉末的方法。 将Al粉末倒入具有开口端的耐火容器中。 如果Al粉末的填充密度小于0.8g / cm 3,则将含有Al粉末的容器放入填充有氮气的反应室中。 如果填充密度大于0.8g / cm 3,则将多孔铝管垂直放置在Al粉末中,或者将引发剂置于Al粉末的顶部或两者。 然后将容器放置在填充有氮气的反应室中。 使氮气流从底部向顶部流过Al粉末,通过加热反应物粉末的顶部表面燃烧合成反应。
Abstract:
Compounds of general Formula I in which the substituents of R.sub.1 -R.sub.7 are hydrogen, hydroxy group, C.sub.1-6 alkyl group, C.sub.1-6 alkoxy group, or epoxypropoxy, but at the most, six of the substituents can simultaneously be hydrogen, methoxy group, or hydroxy group, or epoxypropoxy group for activity against hepatoma. There are also described processes for the preparation of the novel compounds and useful intermediates. Substitute benzophenones are described.
Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a gate, a channel layer, a gate insulation layer, a source, a drain and a silicon-aluminum-oxide layer. The gate is disposed on a substrate. The channel layer is disposed on the substrate. The channel layer overlaps the gate. The gate insulation layer is disposed between the gate and the channel layer. The source and the drain are disposed on two sides of the channel layer. The silicon-aluminum-oxide layer is disposed on the substrate and covers the source, the drain and the channel layer.
Abstract:
Disclosed are a serious of 2′,5′-dimethoxychalcone derivatives for treating cancer, wherein 2,5-dimethoxyacetophenone and methyl 4-formylbenzoate are condensed to form 4-carboxyl-2′,5′-dimethoxychalcone (compound 1), which is further reacted with alkyl halides or amines to synthesize the chalcone derivatives of compounds 2-17. In addition, 2,5-dimethoxyacetophenone is reacted with 5-formyl-2-thiophenecarboxylic acid to form compound 18 (3-(3-thiophene)carboxyl-1-(2,5-dimethoxyphenyl)prop-2-en-1-one). The synthesized 2′,5′-dimethoxychalcone derivatives can be acted as microtubule-targeted tubulin-polymerizing agents.
Abstract:
A display panel structure having a circuit element disposed thereon and method of manufacture are provided. The display panel includes a substrate and the circuit element disposed on the substrate. The circuit element has a first interface layer and a first conductive layer. Both the first interface layer and the first conductive layer have cooper materials. The material which makes the first interface layer includes a reactant or a compound of the material which makes the first conductive layer. The method for manufacturing includes the following steps: forming a first interface layer on the substrate; forming a first conductive layer on the first interface layer; and etching the first conductive and interface layers to form a pattern. The existence of the first interface reduces the penetration of the first conductive layer on the substrate and improves the adhesive force between the first conductive layer and the substrate.
Abstract:
The present invention provides a chemical compound having the structure being one selected from a group consisting of wherein R1 is one selected from a group consisting of COOCH3, COOCH2Ph, CONHCH(CH3)2 and CONHC6H5, R2 is one selected from a group consisting of H, CH3 and CH(CH3)2, R3 is one selected from a group consisting of H, CH3, CH(CH3)2 and CH2Ph, and R4 is one of CH(CH3)2 and C6H5.
Abstract:
A display element and a method of manufacturing the same are provided. The method comprises the following steps: forming a first patterned conducting layer with a gate on a substrate and a dielectric layer thereon; forming a patterned semiconductor layer on the dielectric layer, wherein the patterned semiconductor layer has a channel region, a source and a drain, and wherein the source and the drain lie on the opposite sides of the channel region; selectively depositing a barrier layer, which only wraps the patterned semiconductor layer; forming a second patterned conducting layer on the barrier layer and above the source and the drain. In the display element manufactured by the method, the barrier layer only wraps the patterned semiconductor layer.
Abstract:
A thin film transistor (TFT) includes a substrate, a gate, a gate dielectric layer, a channel layer, a source and a drain. The gate and the gate dielectric layer are disposed on the substrate and the gate dielectric layer covers the gate. The channel layer is disposed on the gate dielectric layer over the gate, and the source and the drain are respectively disposed on a portion of the channel layer at both sides of the gate. At least one of the gate, the source and the drain has a lower conductive layer, an upper conductive layer and an intermediate conductive layer located between the lower conductive layer and the upper conductive layer. The material of the lower conductive layer is different from the material of the intermediate conductive layer, and the thickness of the lower conductive layer is less than or equal to about 150 Å.
Abstract:
A pixel structure disposed on a substrate including a thin film transistor (TFT), a bottom capacitor electrode, a dielectric layer, an upper capacitor electrode, a passivation layer, and a pixel electrode is provided. The TFT having a source/drain and the bottom capacitor electrode are disposed on the substrate. The dielectric layer is disposed on the bottom capacitor electrode. The upper capacitor electrode has a semiconductor layer, a barrier layer, and a metal layer. The semiconductor layer is disposed on the dielectric layer above the bottom capacitor electrode. The barrier layer is disposed on the semiconductor layer. The metal layer whose material includes copper, a copper alloy, or a combination thereof is disposed on the barrier layer. The passivation layer covers the TFT and the upper capacitor electrode and has a first opening exposing the source/drain. The pixel electrode is electrically connected to the TFT through the first opening.