公开(公告)号：US09188214B2

公开(公告)日：2015-11-17

申请号：US13824249

申请日：2011-08-22

Applicant: Masashi Suto ,  Yuichi Takamura ,  Masaki Mita ,  Hiroyuki Uchimura ,  Isao Abe ,  Makoto Ogiwara ,  Naruhito Ogino ,  Yukio Okada ,  Junichi Sekiguchi

Inventor： Masashi Suto ,  Yuichi Takamura ,  Masaki Mita ,  Hiroyuki Uchimura ,  Isao Abe ,  Makoto Ogiwara ,  Naruhito Ogino ,  Yukio Okada ,  Junichi Sekiguchi

IPC: F16H57/029 ,  F16H1/16 ,  F16H57/031 ,  F16H57/039 ,  H02K5/10 ,  H02K7/116 ,  B29C70/00 ,  F16H57/02

CPC classification number: F16H57/029 ,  B29C70/00 ,  F16H1/16 ,  F16H57/031 ,  F16H57/039 ,  F16H2057/02082 ,  H02K5/10 ,  H02K7/1166 ,  Y10T74/2186

Abstract: A seal member is attached to a cover which occludes a gear case as a housing unit. The seal member is formed of elastomer and integrally formed with: a plate-shaped portion formed into a disc shape which covers the inner surface of the cover; an inner seal portion which is positioned on the inner peripheral edge of a through-hole, and comes into sliding contact with the outer peripheral surface of an output member; an outer seal portion which is positioned on the periphery of the cover, and comes into contact with the opening end of the housing unit; and anchor portions which latch onto the front surface of the cover via mounting holes provided to the cover. The boundary between the seal member and the cover extends only to the outside of the gear case, and does not extend to the inside of the gear case.

Abstract translation: 密封构件附接到封闭作为壳体单元的齿轮箱的盖。 密封部件由弹性体形成，一体地形成有：形成为覆盖盖的内表面的盘状的板状部分; 内密封部，其位于通孔的内周缘部，与输出部件的外周面滑动接触; 外密封部，其位于所述盖的周围，并与所述壳体单元的开口端接触; 以及通过设置在所述盖上的安装孔将所述固定部分锁定在所述盖的前表面上。 密封构件和盖之间的边界仅延伸到齿轮箱的外部，并且不延伸到齿轮箱的内部。

公开(公告)号：US09107323B2

公开(公告)日：2015-08-11

申请号：US13811528

申请日：2011-07-21

Applicant: Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

Inventor： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01P1/203 ,  H05K1/02 ,  H03H7/01 ,  H03H1/00

CPC classification number: H05K1/18 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181

Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

Abstract translation: 带通滤波器模块包括安装板和安装在其表面上的BPF芯片。 BPF芯片包括三个或更多个谐振器; 位于最靠近输入端子的第一级谐振器，最靠近输出端子的最后级谐振器，以及连接在第一级谐振器和最后级谐振器之间并位于芯片中间区域的中间级谐振器。 安装板包括与平面图中的芯片中间区域重叠的区域，限定没有设置接地电极的无地空间。 至少从安装板的表面至最内部布线层所在的深度位置形成无地空间。 防止中间级谐振器耦合到安装板上的接地电极和较低的Q值以及增加的插入损耗。

公开(公告)号：US08952767B2

公开(公告)日：2015-02-10

申请号：US13429982

申请日：2012-03-26

Applicant: Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

Inventor： Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

IPC: H03H7/12 ,  H01P1/203 ,  H03H1/00

CPC classification number: H01P1/20345 ,  H03H7/12 ,  H03H2001/0085

Abstract: A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.

Abstract translation: 带通滤波器包括层叠结构，其包括多层堆叠介质层，以及设置在分层结构内的第一至第三谐振器。 在电路结构方面，第二谐振器位于第一和第三谐振器之间。 第一谐振器包括第一电感器和第一电容器。 第二谐振器包括第二电感器和第二电容器。 第三谐振器包括第三电感器和第三电容器。 第二电感器设置在与电介质层的层叠方向上的第一和第三电感器的位置不同的位置处。 第二电感器的电感比第一和第三电感器低。 第二电容器的电容高于第一和第三电容器。

公开(公告)号：US08922304B2

公开(公告)日：2014-12-30

申请号：US13280734

申请日：2011-10-25

Applicant: Kazunari Kimura ,  Junichi Nakamura ,  Takeshi Kijima ,  Isao Abe ,  Takahiro Suzuki ,  Toshiaki Araki

Inventor： Kazunari Kimura ,  Junichi Nakamura ,  Takeshi Kijima ,  Isao Abe ,  Takahiro Suzuki ,  Toshiaki Araki

IPC: H01P1/203 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4061 ,  H01P1/20345 ,  H05K3/4629 ,  Y10T29/49165

Abstract: A laminated electronic device comprises two or more wiring layers including a first wiring layer and a second wiring layer, an insulating layer interposed between the first wiring layer and second wiring layer, and a through conductor extending through the insulating layer for electrically connecting a first conductor disposed on the first wiring layer to a second conductor disposed on the second wiring layer. The through conductor includes divergent sections at both ends, which have a diameter gradually increased toward the first conductor or second conductor.

Abstract translation: 层叠电子器件包括两个或更多个布线层，包括第一布线层和第二布线层，插入在第一布线层和第二布线层之间的绝缘层，以及穿过绝缘层的贯通导体，用于将第一布线 布置在第一布线层上的布置在第二布线层上的第二导体。 贯通导体包括两端的发散部分，其具有朝向第一导体或第二导体逐渐增加的直径。

公开(公告)号：US08544055B2

公开(公告)日：2013-09-24

申请号：US12970507

申请日：2010-12-16

Applicant: Tatsuya Kimoto ,  Isao Abe

Inventor： Tatsuya Kimoto ,  Isao Abe

IPC: H04N5/44 ,  H04N7/16 ,  H04N7/173 ,  G06F15/16

CPC classification number: H04L25/0272 ,  H04N5/775

Abstract: A communication apparatus includes a transmission unit, a command processing unit, an acquisition unit, a first determination unit, a second determination unit, and a control unit. The second determination unit determines whether a first physical address acquired from the external apparatus by the acquisition unit matches a second physical address included in a second command received by the command processing unit. The control unit controls the command processing unit to transmit the first command including the first physical address to the external apparatus if it is determined that the first physical address matches the second physical address.

Abstract translation: 通信装置包括发送单元，命令处理单元，获取单元，第一确定单元，第二确定单元和控制单元。 第二确定单元确定由获取单元从外部设备获取的第一物理地址是否匹配由命令处理单元接收的第二命令中包括的第二物理地址。 如果确定第一物理地址与第二物理地址匹配，则控制单元控制命令处理单元将包括第一物理地址的第一命令发送到外部设备。

公开(公告)号：US08302838B2

公开(公告)日：2012-11-06

申请号：US13111252

申请日：2011-05-19

Applicant: Noriaki Mukai ,  Isao Abe

Inventor： Noriaki Mukai ,  Isao Abe

IPC: B23K3/00

CPC classification number: H01L24/742 ,  H01L24/11 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014

Abstract: A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.

Abstract translation: 微凸块形成装置包括：膜附着机构，其将膜附着在基板的表面上; 曝光和显影机构，其在形成在基板上的电极上的膜中提供开口; 将焊球加载到开口中的焊球加载机构，通过装载有焊料球的开口打印焊剂的焊剂打印机构; 回流部，其加热焊球以形成焊料凸块; 以及将膜从基板的表面分离的膜分离机构。 在加载头将焊球加载到膜的开口中之后，焊球加载机构的控制器允许线传感器操作以检查焊球的负载状态，并且基于检查结果确定是否 重新加载焊球。

公开(公告)号：US20120212409A1

公开(公告)日：2012-08-23

申请号：US13458829

申请日：2012-04-27

Applicant: Isao Abe

Inventor： Isao Abe

IPC: G09G5/00

CPC classification number: H04N5/23203 ,  H04N7/183

Abstract: A communication apparatus includes a display unit, a communication unit, and a control unit. The display unit displays video data. The communication unit communicates with an external apparatus. The control unit controls the communication apparatus in accordance with a command received by the communication unit. If the display unit is in a mute state and the communication unit is sending the external apparatus the data for placing the external apparatus in a mute state, the control unit determines not to control the communication apparatus in accordance with the command.

Abstract translation: 通信装置包括显示单元，通信单元和控制单元。 显示单元显示视频数据。 通信单元与外部设备通信。 控制单元根据由通信单元接收到的命令控制通信装置。 如果显示单元处于静音状态，并且通信单元向外部设备发送用于将外部设备置于静音状态的数据，则控制单元根据该命令确定不控制通信设备。

公开(公告)号：US08187747B2

公开(公告)日：2012-05-29

申请号：US11727389

申请日：2007-03-26

Applicant: Isao Abe ,  Satoshi Matsumoto ,  Shuji Tsutsumi ,  Takashi Takeuchi

Inventor： Isao Abe ,  Satoshi Matsumoto ,  Shuji Tsutsumi ,  Takashi Takeuchi

IPC: H01M4/00

CPC classification number: H01M4/525 ,  C01G51/42 ,  C01G53/00 ,  C01G53/42 ,  C01P2002/52 ,  C01P2002/54 ,  C01P2002/88 ,  C01P2006/12 ,  C01P2006/40

Abstract: The present invention provides a positive electrode active material for a non-aqueous electrolyte-based secondary battery, composed of a lithium/nickel composite oxide with high capacity, low cost and excellent heat stability, an industrially suitable production method therefor, and a high safety non-aqueous electrolyte-based secondary battery. A lithium/nickel composite oxide is produced by the following steps (a) to (c): (a) Nickel hydroxide or nickel oxyhydroxide having a specified component is prepared at a temperature of 600 to 1100° C., under air atmosphere. (b) Fired powders are prepared after mixing said nickel oxide and a lithium compound, and then by firing at a maximal temperature range of 650 to 850° C., under oxygen atmosphere. (c) Obtained fired powders are washed with water within a time satisfying the following equation (2) and then filtered and dried. A≦B/40   (2) wherein, A represents washing time represented by unit of minute; and B represents slurry concentration represented by unit of g/L).

Abstract translation: 本发明提供一种非水电解质型二次电池用正极活性物质，由具有高容量，低成本，优异的热稳定性的锂/镍复合氧化物构成，其工业上合适的制造方法，高安全性 非水电解质二次电池。 通过以下步骤（a）至（c）制备锂/镍复合氧化物：（a）在空气气氛下，在600〜1100℃的温度下制备具有规定成分的氢氧化镍或氢氧化正镍。 （b）在氧化镍和锂化合物混合之后，然后在氧气氛下在最高温度范围650〜850℃下进行烧成，制备烧成粉末。 （c）获得的发泡粉末在满足下述式（2）的时间内用水洗涤，然后过滤并干燥。 A＆nlE; B / 40（2）其中，A表示以分钟为单位表示的洗涤时间; B表示以g / L为单位表示的浆料浓度）。

公开(公告)号：USD651542S1

公开(公告)日：2012-01-03

申请号：US29391729

申请日：2011-05-12

Applicant: Yuuki Nagasawa ,  Isao Abe

Designer： Yuuki Nagasawa ,  Isao Abe

公开(公告)号：US20110284618A1

公开(公告)日：2011-11-24

申请号：US13111252

申请日：2011-05-19

Applicant: Noriaki MUKAI ,  Isao Abe

Inventor： Noriaki MUKAI ,  Isao Abe

IPC: B23Q15/20

CPC classification number: H01L24/742 ,  H01L24/11 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014

Abstract: A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.

Abstract translation: 微凸块形成装置包括：膜附着机构，其将膜附着在基板的表面上; 曝光和显影机构，其在形成在基板上的电极上的膜中提供开口; 将焊球加载到开口中的焊球加载机构，通过装载有焊料球的开口打印焊剂的焊剂打印机构; 回流部，其加热焊球以形成焊料凸块; 以及将膜从基板的表面分离的膜分离机构。 在加载头将焊球加载到膜的开口中之后，焊球加载机构的控制器允许线传感器操作以检查焊球的负载状态，并且基于检查结果确定是否 重新加载焊球。