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公开(公告)号：US07170188B2
公开(公告)日：2007-01-30
申请号：US10882783
申请日：2004-06-30
Applicant: James C. Matayabas, Jr. , Gudbjorg H. Oskarsdottir , Mitesh C. Patel
Inventor： James C. Matayabas, Jr. , Gudbjorg H. Oskarsdottir , Mitesh C. Patel
IPC: H01L23/28
CPC classification number: H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.
Abstract translation: 描述了半导体封装的应力和翘曲的装置和方法的许多实施例。 在一个实施例中，半导体管芯设置在衬底之上。 封装材料设置在基板和半导体管芯上方，其中封装材料具有低热膨胀系数和高热膨胀系数的组合。
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公开(公告)号：US5393867A
公开(公告)日：1995-02-28
申请号：US181735
申请日：1994-01-18
Applicant: James C. Matayabas, Jr. , Falling: Stephen N.
Inventor： James C. Matayabas, Jr. , Falling: Stephen N.
CPC classification number: C08G65/266 , C08G65/14
Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of a palladium(O) catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.30 and up to 0.75, and residues (1) and (2) have the structures: ##STR1##
Abstract translation: 公开了在钯（O）催化剂和亲核引发剂化合物存在下，通过3,4-环氧-1-丁烯的反应或聚合得到的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2至70，m /（n + m）大于0.30且至多为0.75，以及 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）
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公开(公告)号：US20140148557A1
公开(公告)日：2014-05-29
申请号：US14171707
申请日：2014-02-03
Applicant: Stephen E. Lehman, JR. , James C. Matayabas, JR. , Saikumar Jayaraman
Inventor： Stephen E. Lehman, JR. , James C. Matayabas, JR. , Saikumar Jayaraman
IPC: H01L23/24
CPC classification number: H01L23/24 , C08G73/10 , C08L79/08 , C08L2203/20 , C08L2205/02 , H01L21/563 , H01L21/566 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
Abstract translation: 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。
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公开(公告)号：US08643199B2
公开(公告)日：2014-02-04
申请号：US12361485
申请日：2009-01-28
Applicant: Stephen E. Lehman, Jr. , James C. Matayabas, Jr. , Saikumar Jayaraman
Inventor： Stephen E. Lehman, Jr. , James C. Matayabas, Jr. , Saikumar Jayaraman
IPC: H01L23/29
CPC classification number: H01L23/24 , C08G73/10 , C08L79/08 , C08L2203/20 , C08L2205/02 , H01L21/563 , H01L21/566 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
Abstract translation: 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。
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公开(公告)号：US08431673B2
公开(公告)日：2013-04-30
申请号：US12743657
申请日：2008-11-07
Applicant: Zhikai Jeffrey Wang , Christopher Wayne Miller , Marcus Lee Hutchins , James C. Matayabas, Jr.
Inventor： Zhikai Jeffrey Wang , Christopher Wayne Miller , Marcus Lee Hutchins , James C. Matayabas, Jr.
IPC: C08G18/00
CPC classification number: C08L33/08 , C08G18/672 , C08G18/7671 , C08L2205/02 , C08L2312/06 , C09D133/08 , C09D175/16 , G02F2201/50 , C08L2666/04
Abstract: The present invention relates to composition comprising at least one compound obtained from the reaction of at least one compound (i) having a refractive index nD20 of at least 1.50 comprising at least one isocyanate-reactable functional group —XH, wherein each of X is, independently, O or NR, at least one polyisocyanate (ii), and, optionally, at least one compound (iii) comprising at least one isocyanate-reactable functional group —YH and at least one curable functional group Q, wherein each of Y is, independently, O, NR or S, and its use for making high refractive index coatings and films.
Abstract translation: 本发明涉及包含至少一种由至少一种折射率nD20至少为1.50的化合物（i）与至少一种异氰酸酯可反应的官能团-XH的反应得到的化合物的组合物，其中X是， 独立地是O或NR，至少一种多异氰酸酯（ii）和任选的至少一种包含至少一种异氰酸酯可反应官能团-YH和至少一个可固化官能团Q的化合物（iii），其中Y为 ，独立地是O，NR或S，以及其用于制备高折射率涂层和膜的用途。
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Patent Agency Ranking
46.发明授权Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications 有权用于集成电路应用的低热膨胀系数（CTE）热固性树脂公开(公告)号：US08431223B2
公开(公告)日：2013-04-30
申请号：US13550526
申请日：2012-07-16
Applicant: James C. Matayabas, Jr. , Tian-An Chen
Inventor： James C. Matayabas, Jr. , Tian-An Chen
CPC classification number: C08G59/18 , C08G59/20 , H01L2224/16245 , H01L2224/32245 , H01L2224/40245 , H01L2924/181 , Y10T428/2848 , Y10T428/31511 , Y10T428/31515 , H01L2924/00012
Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。
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47.发明申请DIELECTRIC FILM WITH LOW COEFFICIENT OF THERMAL EXPANSION (CTE) USING LIQUID CRYSTALLINE RESIN 审中-公开使用液晶树脂的低膨胀系数（CTE）的电介质膜公开(公告)号：US20100213581A1
公开(公告)日：2010-08-26
申请号：US12774681
申请日：2010-05-05
Applicant: James C. Matayabas, JR.
Inventor： James C. Matayabas, JR.
CPC classification number: H01L23/53295 , H01L21/563 , H01L21/76828 , H01L23/5329 , H01L2924/0002 , H05K3/4626 , H05K2201/0141 , H05K2201/068 , H05K2203/104 , Y10T428/25 , H01L2924/00
Abstract: An embodiment of the present invention is a technique to provide a dielectric film material with controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.
Abstract translation: 本发明的一个实施方案是提供具有可控制的热膨胀系数（CTE）的电介质膜材料的技术。 形成含有第一液晶成分的第一化合物。 第一种化合物被铸成第一片。 第一膜在第一方向上的磁场或电磁场中取向。 第一个膜在第一个温度下固化。
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公开(公告)号：US20090146289A1
公开(公告)日：2009-06-11
申请号：US12361485
申请日：2009-01-28
Applicant: Stephen E. Lehman, JR. , James C. Matayabas, JR. , Saikumar Jayaraman
Inventor： Stephen E. Lehman, JR. , James C. Matayabas, JR. , Saikumar Jayaraman
CPC classification number: H01L23/24 , C08G73/10 , C08L79/08 , C08L2203/20 , C08L2205/02 , H01L21/563 , H01L21/566 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
Abstract translation: 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。
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公开(公告)号：US07446360B2
公开(公告)日：2008-11-04
申请号：US10914862
申请日：2004-08-09
Applicant: James C. Matayabas, Jr. , Gudbjorg H. Oskarsdottir
Inventor： James C. Matayabas, Jr. , Gudbjorg H. Oskarsdottir
CPC classification number: G11C11/22 , B82Y10/00 , Y10T428/3154 , Y10T428/31544 , Y10T428/31699
Abstract: According to one aspect of the invention, a polymer device and a method of constructing a polymer device are provided. The polymer device includes a first conductor, a second conductor, and a polymeric body between the first and second conductors. The polymeric body includes a polymer material and a phyllosilicate material.
Abstract translation: 根据本发明的一个方面，提供了一种聚合物装置和一种构建聚合物装置的方法。 聚合物装置包括第一导体，第二导体和在第一和第二导体之间的聚合体。 聚合物主体包括聚合物材料和页硅酸盐材料。
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公开(公告)号：US07421780B2
公开(公告)日：2008-09-09
申请号：US11326942
申请日：2006-01-06
Applicant: Sabina Houle , James C. Matayabas, Jr.
Inventor： Sabina Houle , James C. Matayabas, Jr.
IPC: H05K3/30
CPC classification number: H01L23/473 , H01L21/4878 , H01L2224/16 , H01L2224/73253 , H01L2924/16152 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/4935 , Y10T29/53109
Abstract: Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet form, and stamping a microchannel structure having a plurality of outer walls enclosing a predefined area from the blank. The microchannel structure may then be bonded to a heat dissipating side opposite from a micro-component device facing side of a first substrate, the micro-component device facing side of the first substrate being adapted to thermally engage with the micro-component device. The microchannel structure may then be bonded to a second substrate opposite the first substrate, resulting in a closed volume microchannel being defined. Finally, the defined microchannel may then be substantially filled with a fluid thermal interface material.
Abstract translation: 本文描述了用于制造微组件装置的热管理系统的方法。 所述方法可以包括首先用具有片状形式的坯料覆盖目标衬底，以及冲压具有从坯件包围预定区域的多个外壁的微通道结构。 然后，微通道结构可以结合到与面向第一基板的微组件装置相对的散热侧，第一基板的面向微面的侧面适于与微组件装置热接合。 然后可以将微通道结构结合到与第一基板相对的第二基板，从而限定封闭体积的微通道。 最后，所定义的微通道然后可以基本上用流体热界面材料填充。
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