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公开(公告)号：US5393867A
公开(公告)日：1995-02-28
申请号：US181735
申请日：1994-01-18
Applicant: James C. Matayabas, Jr. , Falling: Stephen N.
Inventor： James C. Matayabas, Jr. , Falling: Stephen N.
CPC classification number: C08G65/266 , C08G65/14
Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of a palladium(O) catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.30 and up to 0.75, and residues (1) and (2) have the structures: ##STR1##
Abstract translation: 公开了在钯（O）催化剂和亲核引发剂化合物存在下，通过3,4-环氧-1-丁烯的反应或聚合得到的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2至70，m /（n + m）大于0.30且至多为0.75，以及 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）
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2.发明授权Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications 有权用于集成电路应用的低热膨胀系数（CTE）热固性树脂公开(公告)号：US08242216B2
公开(公告)日：2012-08-14
申请号：US13169784
申请日：2011-06-27
Applicant: James C. Matayabas, Jr. , Tian-An Chen
Inventor： James C. Matayabas, Jr. , Tian-An Chen
IPC: C08L63/00
CPC classification number: C08G59/18 , C08G59/20 , H01L2224/16245 , H01L2224/32245 , H01L2224/40245 , H01L2924/181 , Y10T428/2848 , Y10T428/31511 , Y10T428/31515 , H01L2924/00012
Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶，羟基，胺和酸酐之一。
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3.发明授权Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications 有权用于集成电路应用的低热膨胀系数（CTE）热固性树脂公开(公告)号：US07999042B2
公开(公告)日：2011-08-16
申请号：US10876444
申请日：2004-06-25
Applicant: James C. Matayabas, Jr. , Tian-An Chen
Inventor： James C. Matayabas, Jr. , Tian-An Chen
IPC: C08L63/00
CPC classification number: C08G59/18 , C08G59/20 , H01L2224/16245 , H01L2224/32245 , H01L2224/40245 , H01L2924/181 , Y10T428/2848 , Y10T428/31511 , Y10T428/31515 , H01L2924/00012
Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.
Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。
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4.发明授权Process for producing saturated polyether glycols and alcohols derived from 3, 4-epoxy-1-butene 失效制备由3,4-环氧-1-丁烯衍生的饱和聚醚二醇和醇的方法
公开(公告)号：US5608117A
公开(公告)日：1997-03-04
申请号：US520356
申请日：1995-08-28
Applicant: James C. Matayabas, Jr. , Stephen N. Falling
Inventor： James C. Matayabas, Jr. , Stephen N. Falling
IPC: C08G65/32 , C08G65/14 , C08G65/322 , C08G65/20
CPC classification number: C08G65/14 , C08G65/322
Abstract: Disclosed are novel saturated polyether compounds comprised of n units of residue (1) and m units of residue (2), wherein (i) residues (1) and (2) have the structures: ##STR1## (ii) the total value of n+m is 2 to 70 and m/(n+m) is 0.05 to 0.98; (ii) at least 98 percent of the terminal hydroxyl groups of the polyether have the structure: ##STR2## The polyethers are obtained by first polymerizing 3,4-epoxy-l-butene to produce unsaturated polyether precursors comprising residues (1A) and (2A) having the structures: ##STR3## and then hydrogenating the unsaturated polyether precursors. The hydrogenation advantageously is performed in the presence of a nickel hydrogenation catalyst.
Abstract translation: 公开了由n个残基（1）和m个残基（2）组成的新型饱和聚醚化合物，其中（i）残基（1）和（2）具有以下结构：（1）和OCH 2 CH 2 CH 2 CH 2 ）（ii）n + m的总值为2〜70，m /（n + m）为0.05〜0.98; （ii）聚醚的末端羟基的至少98％具有以下结构：聚醚是通过首先聚合3,4-环氧-1-丁烯制备不饱和聚醚前体而得到的，其包含残基（1A）和（ 2A），其结构如下：（1A）OCH2CHCHCH2（2A），然后氢化不饱和聚醚前体。 氢化有利地在镍氢化催化剂存在下进行。
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公开(公告)号：US20170176496A1
公开(公告)日：2017-06-22
申请号：US14975386
申请日：2015-12-18
Applicant: Akshay Mathkar , Nachiket R. Raravikar , James C. Matayabas, Jr. , Jin Yang
Inventor： Akshay Mathkar , Nachiket R. Raravikar , James C. Matayabas, Jr. , Jin Yang
CPC classification number: H01R43/24 , G01R1/07378
Abstract: Prober space transformer to interface an E-testing apparatus to an unpackaged die. The space transformer may include a substrate and a perforated cover plate disposed on the substrate. The substrate may include conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as a prober interface between an E-testing apparatus and a DUT. The cover plate may be affixed to a surface of the substrate and includes an array of perforations through which the array of conductive pins may pass. The cover plate may be synthetic polymer resin or a polymer-based composite, fabricated, for example by perforating a mold preform.
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Patent Agency Ranking
公开(公告)号：US09613933B2
公开(公告)日：2017-04-04
申请号：US14198479
申请日：2014-03-05
Applicant: Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
Inventor： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC: H01L23/12 , H01L25/065 , H01L25/10 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
Abstract: An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
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7.发明授权Thermal interface material composition including polymeric matrix and carbon filler 有权热界面材料组成包括聚合物基质和碳填料公开(公告)号：US08920919B2
公开(公告)日：2014-12-30
申请号：US13625612
申请日：2012-09-24
Applicant: Hitesh Arora , James C. Matayabas, Jr.
Inventor： Hitesh Arora , James C. Matayabas, Jr.
IPC: B32B27/32
CPC classification number: C08L25/06 , B82Y30/00 , C08K3/04 , C08K3/041 , C08K3/042 , C08K7/24 , C08K2201/011 , C08L23/02 , C08L23/20 , C08L53/00 , Y10T428/25 , Y10T428/31938 , C08L9/00 , C08L53/025
Abstract: Certain embodiments relate to compositions that may be used as thermal interface materials in electronic assemblies. One such composition includes a block copolymer matrix comprising polystyrene and polybutene. The composition also includes a filler positioned in the copolymer matrix, the filler comprising carbon. The filler may in certain embodiments be a material selected from the group consisting of graphite, graphene, and carbon nanotubes. composition may include routing structures and their formation. Assemblies may include the composition positioned between a die and a heat spreader. Other embodiments are described and claimed.
Abstract translation: 某些实施方案涉及可用作电子组件中的热界面材料的组合物。 一种这样的组合物包括包含聚苯乙烯和聚丁烯的嵌段共聚物基体。 组合物还包括位于共聚物基质中的填料，填料包含碳。 在某些实施方案中，填料可以是选自石墨，石墨烯和碳纳米管的材料。 组成可以包括路由结构及其形成。 组件可以包括定位在模具和散热器之间的组合物。 描述和要求保护其他实施例。
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公开(公告)号：US07060747B2
公开(公告)日：2006-06-13
申请号：US10034699
申请日：2001-12-27
Applicant: James C. Matayabas, Jr.
Inventor： James C. Matayabas, Jr.
IPC: C08K3/08
CPC classification number: H01L23/3737 , C08G77/12 , C08G77/20 , C08K3/013 , C08K3/08 , C08K3/22 , C08K3/28 , C08K9/02 , C08K2201/001 , C08L83/00 , C08L83/04 , H01L23/36 , H01L23/42 , H01L23/49833 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2224/0401
Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.
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公开(公告)号：US5608034A
公开(公告)日：1997-03-04
申请号：US532044
申请日：1995-09-22
Applicant: Stephen N. Falling , Stephen A. Godleski , Patricia Lopez-Maldonado , Peter B. MacKenzie , Laughlin G. McCullough , James C. Matayabas, Jr.
Inventor： Stephen N. Falling , Stephen A. Godleski , Patricia Lopez-Maldonado , Peter B. MacKenzie , Laughlin G. McCullough , James C. Matayabas, Jr.
CPC classification number: C08G65/269 , C08G65/12 , C08G65/14
Abstract: Polyether polymers obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an onium iodide compound such as an ammonium or phosphonium iodide, an organotin compound such as a trihydrocarbyltin iodide, and a nucleophilic hydroxyl initiator compound. The polyether polymers comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.75 and up to 0.98, and residues (1) and (2) have the structures: ##STR1##
Abstract translation: 通过在碘鎓化合物如碘化铵或碘化鏻，有机锡化合物如三烃基碘化物和亲核羟基引发剂化合物的存在下，通过3,4-环氧-1-丁烯的反应或聚合获得的聚醚聚合物。 聚醚聚合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2-70，m /（n + m）大于0.75，最高为0.98， 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）
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10.发明授权Preparation of polyether glycols and alcohols by the polymerization 3,4-epoxy-1-butene 失效通过聚合3,4-环氧-1-丁烯制备聚醚二醇和醇
公开(公告)号：US5536882A
公开(公告)日：1996-07-16
申请号：US398245
申请日：1995-03-03
Applicant: James C. Matayabas, Jr. , Stephen N. Falling
Inventor： James C. Matayabas, Jr. , Stephen N. Falling
CPC classification number: C07C43/178 , C08G65/14 , C08G65/26
Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, n/(n+m) is a value in the range of 0.70 to 0.95, and residues (1) and (2) have the structures: ##STR1##
Abstract translation: 公开了在酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2〜70，n /（n + m）为0.70〜0.95的范围内的值 ，残基（1）和（2）具有以下结构：（1）OCH 2 CHCHCH 2。 （2）
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