MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
    44.
    发明申请
    MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME 有权
    多层相变记忆体装置及其制造方法

    公开(公告)号:US20070215853A1

    公开(公告)日:2007-09-20

    申请号:US11627775

    申请日:2007-01-26

    Abstract: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    Abstract translation: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    METHOD OF FORMING A PHASE-CHANGEABLE STRUCTURE
    45.
    发明申请
    METHOD OF FORMING A PHASE-CHANGEABLE STRUCTURE 审中-公开
    形成相变结构的方法

    公开(公告)号:US20070166870A1

    公开(公告)日:2007-07-19

    申请号:US11623890

    申请日:2007-01-17

    CPC classification number: H01L45/1233 H01L45/06 H01L45/144 H01L45/1675

    Abstract: In one embodiment, a phase-changeable structure can be formed by forming a phase-changeable layer on the lower electrode, forming a conductive layer on the phase-changeable layer, etching the conductive layer using a first etching material to form an upper electrode and etching the phase-changeable layer using a second etching material to form a phase-changeable pattern. The first etching material can include a first component containing fluorine. The second etching material does not contain chlorine.

    Abstract translation: 在一个实施例中,可以通过在下电极上形成相变层,在相变层上形成导电层,使用第一蚀刻材料蚀刻导电层以形成上电极和 使用第二蚀刻材料蚀刻相变层以形成相变图案。 第一蚀刻材料可以包括含氟的第一成分。 第二蚀刻材料不含氯。

    Method of writing to MRAM devices
    47.
    发明申请
    Method of writing to MRAM devices 有权
    写入MRAM设备的方法

    公开(公告)号:US20060039190A1

    公开(公告)日:2006-02-23

    申请号:US11097495

    申请日:2005-04-01

    CPC classification number: G11C11/16

    Abstract: A method of writing to magnetic random access memory (MRAM) devices is provided. The method includes preparing a digit line disposed on a semiconductor substrate, a bit line crossing over the digit line, and a magnetic tunnel junction (MTJ) interposed between the digit line and the bit line. The MTJ has a pinned layer, a tunneling insulating layer, and a synthetic anti-ferromagnetic (SAF) free layer which are sequentially stacked. In addition, the SAF free layer has a bottom free layer and a top free layer which are separated by an exchange spacer layer. An initial magnetization state of the MTJ is read and compared with a desired magnetization state. When the initial magnetization state is different from the desired magnetization state, a first write line pulse is applied to one of the digit line and the bit line, and a second write line pulse is applied to the other of the digit line and the bit line, thereby changing the magnetization state of the MTJ. The MTJ may be disposed at an angle equal to or greater than 0° and less than 90° to a line to which the second write line pulse is applied.

    Abstract translation: 提供了一种写入磁性随机存取存储器(MRAM)器件的方法。 该方法包括准备设置在半导体衬底上的数字线,与数字线交叉的位线以及置于数字线和位线之间的磁性隧道结(MTJ)。 MTJ具有钉扎层,隧道绝缘层和顺序层叠的合成反铁磁(SAF)层。 此外,SAF自由层具有由交换间隔层隔开的无底层和顶部自由层。 读取MTJ的初始磁化状态并与期望的磁化状态进行比较。 当初始磁化状态不同于期望的磁化状态时,第一写入线脉冲被施加到数字线和位线之一,并且第二写入线脉冲被施加到数字线和位线中的另一个 ,从而改变MTJ的磁化状态。 MTJ可以以与第二写入线脉冲施加的线等于或大于0°且小于90°的角度布置。

    Method fabricating semiconductor device using multiple polishing processes
    50.
    发明授权
    Method fabricating semiconductor device using multiple polishing processes 有权
    使用多次抛光工艺制造半导体器件的方法

    公开(公告)号:US08168535B2

    公开(公告)日:2012-05-01

    申请号:US13084657

    申请日:2011-04-12

    CPC classification number: H01L45/1683 H01L45/06 H01L45/141

    Abstract: A method of fabricating a phase change memory device includes the use of first, second and third polishing processes. The first polishing process forms a first contact portion using a first sacrificial layer and the second polishing process forms a phase change material pattern using a second sacrificial layer. After removing the first and second sacrificial layers to expose resultant protruding structures of the first contact portion and the phase change material pattern, a third polishing process is used to polish the resultant protruding structures using an insulation layer as a polishing stopper layer.

    Abstract translation: 制造相变存储器件的方法包括使用第一,第二和第三抛光工艺。 第一抛光工艺使用第一牺牲层形成第一接触部分,并且第二抛光工艺使用第二牺牲层形成相变材料图案。 在去除第一和第二牺牲层以暴露第一接触部分的相应突出结构和相变材料图案之后,使用第三抛光工艺来使用绝缘层作为抛光停止层来抛光所得的突出结构。

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