公开(公告)号：US20120039015A1

公开(公告)日：2012-02-16

申请号：US13208416

申请日：2011-08-12

Applicant: Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Takehisa SASABAYASHI ,  Takayuki KAYATANI

Inventor： Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Takehisa SASABAYASHI ,  Takayuki KAYATANI

IPC: H01G4/30 ,  H01G7/00

CPC classification number: H01G4/005 ,  H01G4/30 ,  Y10T29/43 ,  Y10T29/435

Abstract: In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Abstract translation: 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

公开(公告)号：US08102640B2

公开(公告)日：2012-01-24

申请号：US12405405

申请日：2009-03-17

Applicant: Makoto Ogawa ,  Akihiro Motoki ,  Tatsuo Kunishi ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

Inventor： Makoto Ogawa ,  Akihiro Motoki ,  Tatsuo Kunishi ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

IPC: H01G4/228 ,  H01G4/06

CPC classification number: H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/435

Abstract: A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.

Abstract translation: 单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。 内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。 外部电极包括第一镀层和第二镀层。 第一镀层与内部电极直接接触。 第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。

公开(公告)号：US08094432B2

公开(公告)日：2012-01-10

申请号：US12356648

申请日：2009-01-21

Applicant: Akihiro Motoki ,  Makoto Ogawa ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

Inventor： Akihiro Motoki ,  Makoto Ogawa ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

IPC: H01G4/06

CPC classification number: H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006

Abstract: A method for manufacturing a multilayer ceramic electronic component includes a first substep of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated sublayer, and a second substep of heat-treating the laminate including the plated sublayer at a temperature of at least about 800° C., wherein a plated layer including a plurality of plated sublayers is formed by continuously performing at least two cycles of the first substep and the second substep.

Abstract translation: 一种多层陶瓷电子部件的制造方法，其特征在于，在层叠体的规定表面露出的内部电极的一端形成沉积有特定金属的析出物的第一子步骤，使析出物凝集成连续的镀层， 以及第二子步骤，其在至少约800℃的温度下对包含所述镀层的层压板进行热处理，其中通过连续地执行所述第一子步骤和所述第一子步骤的至少两个循环来形成包括多个电镀子层的镀层， 第二子步。

公开(公告)号：US20110271927A1

公开(公告)日：2011-11-10

申请号：US13099000

申请日：2011-05-02

Applicant: Masanori Ueno ,  Makoto Ogawa

Inventor： Masanori Ueno ,  Makoto Ogawa

IPC: F02N11/08

CPC classification number: F02D29/06 ,  F02N11/0818 ,  H02J3/381 ,  H02J9/08 ,  H02P9/08 ,  H02P2101/45 ,  Y02T10/48

Abstract: Starting and stopping an engine is automatically controlled based on a load without using a relay. An inverter engine-driven power generator has an alternator, a rectifying circuit, a DC/DC converter, and an inverter circuit. A load detection circuit is connected to an output of the inverter circuit in parallel. A load detection line of the load detection circuit is connected to an output line of the inverter circuit in parallel via resistors. A power supply formed of a battery is connected to the load detection line. A decision circuit outputs a load detection signal when a current having a preset value or more flows through the load detection line. A drive/stop CPU starts the engine in response to the load detection. The resistors are set at a resistance value which does not influence a load to which a generator output is supplied.

Abstract translation: 启动和停止发动机将根据负载自动控制，而不使用继电器。 逆变器发动机驱动的发电机具有交流发电机，整流电路，DC / DC转换器和逆变器电路。 负载检测电路并联连接到逆变器电路的输出。 负载检测电路的负载检测线通过电阻并联连接到逆变器电路的输出线。 由电池形成的电源连接到负载检测线。 当具有预设值以上的电流流过负载检测线时，判定电路输出负载检测信号。 驱动/停止CPU响应于负载检测启动引擎。 电阻器被设定为不影响发电机输出的负载的电阻值。

公开(公告)号：US20110255257A1

公开(公告)日：2011-10-20

申请号：US13074847

申请日：2011-03-29

Applicant: Makoto Ogawa ,  Masanori Ueno

Inventor： Makoto Ogawa ,  Masanori Ueno

IPC: H05K7/00 ,  H05K1/14

CPC classification number: H05K3/363 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The auxiliary board joining structure further includes a plurality of positioning holes 6 formed in the main board 1, a plurality of positioning pins 20 formed on the main board 1, wherein the plurality of positioning pins 20 extend through the corresponding positioning holes 6 so as to be oriented parallel to the axial direction of the joint pins 17. Each of the positioning pins 20 has a height regulating face 23 for regulating a distance that the positioning pins are extended through the corresponding positioning hole 6. Each of the positioning pins 20 is formed long enough to be extended through the corresponding positioning hole 6 before the joint pins 17 are extended through the corresponding through-holes 5, when the main board 1 and the auxiliary board 10 are engaged.

Abstract translation: 辅助板接合结构还包括形成在主板1中的多个定位孔6，形成在主板1上的多个定位销20，其中多个定位销20延伸通过相应的定位孔6，以便 定位销20均具有用于调节定位销延伸穿过相应定位孔6的距离的高度调节面23。每个定位销20形成 当主板1和辅助板10接合时，足够长的延伸通过相应的定位孔6，在接头销17延伸穿过对应的通孔5之前。

公开(公告)号：US20110193448A1

公开(公告)日：2011-08-11

申请号：US13020886

申请日：2011-02-04

Applicant: Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Kiyoyasu SAKURADA

Inventor： Masahito SARUBAN ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Kiyoyasu SAKURADA

IPC: H01L41/00 ,  H01G4/30 ,  H01F5/00 ,  H01C7/13 ,  B05D5/12

CPC classification number: H01G4/30 ,  H01F17/0013 ,  H01G4/005 ,  H01G13/00 ,  H01L41/293

Abstract: A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.

Abstract translation: 一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体 在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。 在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。

公开(公告)号：US07765661B2

公开(公告)日：2010-08-03

申请号：US11909736

申请日：2006-02-01

Applicant: Akihiro Motoki ,  Makoto Ogawa ,  Seiichi Matsumoto ,  Yoshihiko Takano ,  Tatsuo Kunishi

Inventor： Akihiro Motoki ,  Makoto Ogawa ,  Seiichi Matsumoto ,  Yoshihiko Takano ,  Tatsuo Kunishi

IPC: H01G7/00 ,  C25D5/00 ,  H01G4/008

CPC classification number: C25D5/54 ,  C25D3/30 ,  C25D11/34 ,  H01G4/005 ,  H01G4/1227 ,  H01G13/00 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4902

Abstract: A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.

Abstract translation: 提供了具有优异的可焊性的陶瓷电子部件的制造方法。 在该方法中，钡从陶瓷电子部件的洗脱以及陶瓷电子部件在镀锡中的粘附性降低。 制造陶瓷电子部件的方法包括以下步骤：提供含钡陶瓷的电子部件，并在电子部件的外表面上形成电极，电极用锡电镀。 在该方法中，镀锡中使用的镀浴的锡离子浓度A为0.03〜0.51mol / L，硫酸根离子浓度B为0.005〜0.31mol / L，摩尔比B / A小于1，pH范围为6.1至10.5。

公开(公告)号：US07719819B2

公开(公告)日：2010-05-18

申请号：US12043225

申请日：2008-03-06

Applicant: Akihiro Motoki ,  Makoto Ogawa ,  Tatsuo Kunishi ,  Jun Nishikawa ,  Yoshihiko Takano ,  Shigeyuki Kuroda

Inventor： Akihiro Motoki ,  Makoto Ogawa ,  Tatsuo Kunishi ,  Jun Nishikawa ,  Yoshihiko Takano ,  Shigeyuki Kuroda

IPC: H01G4/06 ,  H01G7/00

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

Abstract: A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.

Abstract translation: 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。

公开(公告)号：US20100118467A1

公开(公告)日：2010-05-13

申请号：US12616844

申请日：2009-11-12

Applicant: Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

Inventor： Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

IPC: H01G4/228

CPC classification number: H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.

Abstract translation: 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

公开(公告)号：US20100091426A1

公开(公告)日：2010-04-15

申请号：US12543549

申请日：2009-08-19

Applicant: Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Akihiro YOSHIDA ,  Takayuki KAYATANI

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Akihiro YOSHIDA ,  Takayuki KAYATANI

IPC: H01G4/30 ,  H01G7/00 ,  H01G4/005

CPC classification number: H01G4/2325 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30 ,  Y10T29/435

Abstract: A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.

Abstract translation: 一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。 在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将 在含有金属离子或金属络合物的液体中的多层复合材料。 然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。 因此，内部电极的露出端彼此电连接。