公开(公告)号：US20080231665A1

公开(公告)日：2008-09-25

申请号：US11859885

申请日：2007-09-24

Applicant: Moon-chul Lee ,  Myong-jong Kwon ,  Yong-seop Yoon ,  Jin-wook Lee ,  Yong-won Jeong ,  Donk-sik Shim

Inventor： Moon-chul Lee ,  Myong-jong Kwon ,  Yong-seop Yoon ,  Jin-wook Lee ,  Yong-won Jeong ,  Donk-sik Shim

IPC: B41J2/05

CPC classification number: B41J2/1404 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/2139 ,  B41J2/515

Abstract: The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.

Abstract translation: 喷墨打印头包括具有形成为供墨的供墨孔的基板，层叠在基板上的室层，并且在其间形成有供墨孔的多个主墨室和在其间形成的多个补偿墨室， 相互面对的主墨室; 以及层叠在所述室层上的喷嘴层，并且包括对应于所述主油墨室的多个主喷嘴和对应于所述补偿油墨室的多个补偿喷嘴。

公开(公告)号：US20080072416A1

公开(公告)日：2008-03-27

申请号：US11712526

申请日：2007-03-01

Applicant: Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

Inventor： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

IPC: H01P11/00 ,  H01Q13/00

CPC classification number: H01Q1/2283 ,  H01F17/0033 ,  H01F41/041 ,  H01Q1/362 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A micro antenna and a method of manufacturing the micro antenna are provided. A plurality of holes are formed to penetrate a first substrate. A plurality of vertical conducting parts are formed in the plurality of holes using a conductive material. Horizontal conducting parts are formed on upper and lower surfaces of the first substrate to be electrically connected to the plurality of vertical conducting parts so as to form a 3-dimensional (3-D) coil structure. The first substrate including the 3-D coil structure is bonded to a second substrate and then removed so as to realize the micro antenna.

Abstract translation: 提供微型天线和制造微型天线的方法。 形成多个孔以穿透第一基板。 使用导电材料在多个孔中形成多个垂直导电部件。 水平导电部分形成在第一基板的上表面和下表面上以与多个垂直导电部分电连接，以形成三维（3-D）线圈结构。 将包括3-D线圈结构的第一基板接合到第二基板，然后移除以实现微天线。

公开(公告)号：US20070176250A1

公开(公告)日：2007-08-02

申请号：US11447969

申请日：2006-06-07

Applicant: Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

Inventor： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

IPC: H01L29/84

CPC classification number: H03H9/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.

Abstract translation: 一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及 用于填充通孔的一部分的导电构件。 通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分 直到盖晶片的顶表面。

公开(公告)号：US20070115702A1

公开(公告)日：2007-05-24

申请号：US11655915

申请日：2007-01-22

Applicant: Moon-chul Lee ,  In-sang Song ,  Young-tack Hong ,  Sung-hye Jeong ,  Jeong-yoo Hong ,  Byung-yoo Hong

Inventor： Moon-chul Lee ,  In-sang Song ,  Young-tack Hong ,  Sung-hye Jeong ,  Jeong-yoo Hong ,  Byung-yoo Hong

IPC: H02M1/14

CPC classification number: H01L27/016 ,  H01L23/5223 ,  H01L23/5227 ,  H01L27/0744 ,  H01L28/10 ,  H01L28/40 ,  H01L2924/0002 ,  H03H7/00 ,  H03H7/0115 ,  H03H2001/0078 ,  H03H2001/0085 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/1006 ,  H05K2201/10545 ,  Y10S438/977 ,  H01L2924/00

Abstract: An LC device having a substrate, a support layer having upper and lower sides formed on the substrate, inductors formed on either the upper or lower side of the support layer, and capacitors formed in the opposite side of the support layer. The support layer may be formed of a low-k dielectric material, and a connection portion may be provided to connect the inductors and capacitors in the support layer. The inductors and capacitors are disposed in a stacked structure on the upper and lower sides of the low-k dielectric support layer on the substrate, so that space efficiency may be maximized on the substrate. The low-k dielectric support layer provides support between the inductors and capacitors so that substrate loss is minimized and a Q factor of the inductors is enhanced.

Abstract translation: 具有衬底的LC器件，在衬底上形成有上下侧的支撑层，形成在支撑层的上侧或下侧的电感器以及形成在支撑层的相对侧的电容器。 支撑层可以由低k介电材料形成，并且可以提供连接部分来连接支撑层中的电感器和电容器。 电感器和电容器以堆叠的结构设置在衬底上的低k电介质支撑层的上侧和下侧，使得在衬底上空间效率最大化。 低k电介质支撑层提供电感器和电容器之间的支撑，使得衬底损耗最小化并且电感器的Q因数增强。

公开(公告)号：US20060286798A1

公开(公告)日：2006-12-21

申请号：US11412900

申请日：2006-04-28

Applicant: Moon-chul Lee ,  Jong-oh Kwon ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

Inventor： Moon-chul Lee ,  Jong-oh Kwon ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

IPC: H01L21/44

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.

公开(公告)号：US20060175707A1

公开(公告)日：2006-08-10

申请号：US11339500

申请日：2006-01-26

Applicant: Moon-chul Lee ,  Woon-bae Kim ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

Inventor： Moon-chul Lee ,  Woon-bae Kim ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

IPC: H01L23/52

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L21/76898 ,  H01L23/04 ,  H01L23/10 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

公开(公告)号：US20060094158A1

公开(公告)日：2006-05-04

申请号：US11240771

申请日：2005-10-03

Applicant: Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

Inventor： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

IPC: H01L21/50

CPC classification number: B81C1/00301 ,  Y10T29/49117

Abstract: A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

Abstract translation: 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。

公开(公告)号：US20060017539A1

公开(公告)日：2006-01-26

申请号：US11184999

申请日：2005-07-20

Applicant: Moon-chul Lee ,  Hyung Choi

Inventor： Moon-chul Lee ,  Hyung Choi

IPC: H01F5/00

CPC classification number: H01L27/08 ,  H01F17/0006 ,  H01F17/02 ,  H01F27/027 ,  H01F2017/002 ,  H01F2017/008

Abstract: An inductor device having an improved quality factor is provided. To obtain the improved quality factor, the inductor device includes a substrate etched away at predetermined intervals; first and second inductors formed on the top and bottom of the substrate, respectively; and first and second protection packages for shielding the first and second inductors, respectively, from outside. The first and second inductors are formed in a symmetrical structure with respect to the substrate, and the inductor device further includes connection parts for electrically connecting the first and second inductors. Further, the inductor device has air gaps between the substrate, first inductor, and second inductor in order for the first and second inductors to be exposed in the air, and the first protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.

Abstract translation: 提供了具有改进的品质因数的电感器件。 为了获得改进的品质因数，电感器件包括以预定间隔蚀刻掉的衬底; 分别形成在基板的顶部和底部的第一和第二电感器; 以及分别从外部屏蔽第一和第二电感器的第一和第二保护封装。 第一和第二电感器相对于衬底形成对称的结构，并且电感器件还包括用于电连接第一和第二电感器的连接部件。 此外，电感器件在衬底，第一电感器和第二电感器之间具有空气间隙，以便使第一和第二电感器暴露在空气中，并且第一保护封装具有在预定位置形成在其上的电极层以供应电 电流到电感器件。

公开(公告)号：US20060017125A1

公开(公告)日：2006-01-26

申请号：US11182775

申请日：2005-07-18

Applicant: Moon-chul Lee ,  Tae-sik Park ,  Hee-moon Jeong

Inventor： Moon-chul Lee ,  Tae-sik Park ,  Hee-moon Jeong

IPC: H01L29/84

CPC classification number: H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

Abstract: A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating body along a vibration direction of the vibrating body. When a direct current voltage with a predetermined magnitude is applied to the stationary contact point, a vibration margin of the vibrating body is increased, the vibrating body contacts the stationary contact point and the vibration type MEMS switch is turned on. A first substrate is bonded to a second substrate to isolate the vibrating body in a sealed vacuum space. The vibration type MEMS switch is turned on and/off by a resonance.

公开(公告)号：US20050262941A1

公开(公告)日：2005-12-01

申请号：US11141054

申请日：2005-06-01

Applicant: Tae-sik Park ,  Moon-chul Lee ,  Chang-youl Moon

Inventor： Tae-sik Park ,  Moon-chul Lee ,  Chang-youl Moon

IPC: G01C19/56 ,  B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  G01C19/00 ,  G01C19/5769 ,  G01P15/08

CPC classification number: B81C1/0023 ,  B81B2207/07 ,  G01C19/56 ,  H01L2224/16225

Abstract: Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.

Abstract translation: 提供了包括多个部件单元的陀螺仪传感器和制造陀螺仪传感器的方法。 陀螺传感器包括：基板; 微电子机械系统结构，其包括包括形成空腔的预定区域的表面并且连接到所述基板的上表面以输出与外部旋转力成比例的振动信号; 以及位于所述空腔中的电路单元，将所述振动信号转换为与圆形角速度成比例的预定电信号，并输出所述预定电信号。