OPTICAL LENS, OPTICAL SYSTEM UNIT AND IMAGING APPARATUS
    41.
    发明申请
    OPTICAL LENS, OPTICAL SYSTEM UNIT AND IMAGING APPARATUS 审中-公开
    光学透镜,光学系统单元和成像设备

    公开(公告)号:US20110026109A1

    公开(公告)日:2011-02-03

    申请号:US12673909

    申请日:2008-08-14

    IPC分类号: G02B5/20 G02B1/04

    CPC分类号: G02B13/06 G02B1/041

    摘要: In a surveillance camera 2, an optical system unit for use in imaging is provided with a first lens 7, a second lens 8, a third lens 9, and a fourth lens 10, and a subject image is formed on a photoelectric surface 12 of an imaging element through a cover glass 11. The third lens 9 is an optical lens made of a nanocomposite material of the invention in which inorganic fine particles are dispersed. A thin film layer 15 that blocks UV rays is formed on a light incident surface of the third lens 9. After passing through the first lens 7 and the second lens 8, UV rays contained in subject light are blocked by the thin film layer 15 and therefore cannot enter the third lens 9.

    摘要翻译: 在监视摄像机2中,用于成像的光学系统单元设置有第一透镜7,第二透镜8,第三透镜​​9和第四透镜10,并且在光电表面12上形成被摄体图像 通过盖玻璃11的成像元件。第三透镜9是由无机细颗粒分散的本发明的纳米复合材料制成的光学透镜。 在第三透镜9的光入射面上形成阻挡紫外线的薄膜层15.在通过第一透镜7和第二透镜8之后,包含在被摄体光中的紫外线被薄膜层15阻挡, 因此不能进入第三透镜9。

    Mold and molding method
    42.
    发明授权
    Mold and molding method 失效
    模具和成型方法

    公开(公告)号:US07833451B2

    公开(公告)日:2010-11-16

    申请号:US11656942

    申请日:2007-01-24

    IPC分类号: B29C41/00

    摘要: In a mold, at least a first half includes an insert member forming a cavity surface on one end side; a body member having an insertion part into which the insert member is inserted; and an insert member fixer interposed between the insert member and the insertion part, for holding the insert member. The insert member fixer is made of a shape memory alloy, and presses and holds the insert member when the insert member fixer restores its memorized shape, to make a center axis alignment of the insert member with respect to the body member.

    摘要翻译: 在模具中,至少第一半部包括在一端侧形成空腔表面的插入件; 具有插入部件的主体部件,插入部件插入其中; 以及插入部件固定器,其插入在所述插入部件和所述插入部之间,用于保持所述插入部件。 插入构件固定器由形状记忆合金制成,并且当插入构件固定器恢复其记忆形状时按压并保持插入构件,以使插入构件相对于主体构件的中心轴对准。

    METHOD OF SMELTING COPPER
    43.
    发明申请
    METHOD OF SMELTING COPPER 有权
    铜冶炼方法

    公开(公告)号:US20100050813A1

    公开(公告)日:2010-03-04

    申请号:US12502780

    申请日:2009-07-14

    IPC分类号: C22B15/00

    摘要: A method of smelting copper includes: a generating step of generating blister and slag from copper matte by charging the copper matte into a smelting furnace and oxidizing the copper matte; a first refining step of refining another blister from the slag by reduction in an electrical furnace; and a charging step of charging the slag into one of the smelting furnace or another smelting furnace for treating copper concentrate and generating matte as repeating flux if copper grade of slag generated in the first refining step is higher than 0.8 weight %.

    摘要翻译: 一种熔炼铜的方法包括:通过将铜锍装入冶炼炉中并氧化铜锍而产生铜锍产生气泡和炉渣的产生步骤; 第一精炼步骤,通过在电炉中的还原从炉渣中除去另一个气泡; 以及在第一精炼步骤中产生的铜等级的渣高于0.8重量%的情况下,将炉渣装入冶炼炉或另一熔炼炉中的处理铜精矿并产生锍作为重复焊剂的充电步骤。

    PLASMA PROCESSING APPARATUS AND METHOD WITH CONTROLLED BIASING FUNCTIONS
    44.
    发明申请
    PLASMA PROCESSING APPARATUS AND METHOD WITH CONTROLLED BIASING FUNCTIONS 审中-公开
    等离子体处理装置和具有控制偏心函数的方法

    公开(公告)号:US20090165955A1

    公开(公告)日:2009-07-02

    申请号:US12400095

    申请日:2009-03-09

    IPC分类号: C23F1/00

    摘要: A plasma processing apparatus including: a phase controller for controlling a phase difference between biasing power supplied to the antenna biasing electrode and biasing power supplied to the substrate electrode to have a difference of 180°±45°; wherein the biasing power supplied to the antenna biasing electrode and the biasing power supplied to the substrate electrode have a same frequency, which same frequency is lower than a frequency of the RF power for plasma generation. A plurality of filters is included, to perform a variety of filtering.

    摘要翻译: 一种等离子体处理装置,包括:相位控制器,用于控制提供给天线偏置电极的偏置功率与提供给基板电极的偏置功率之间的相位差具有180°±45°的差; 其中提供给天线偏置电极的偏置功率和提供给基板电极的偏置功率具有相同的频率,其频率低于用于等离子体产生的RF功率的频率。 包括多个滤波器,以执行各种滤波。

    PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
    45.
    发明申请
    PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD 有权
    等离子体加工设备和等离子体处理方法

    公开(公告)号:US20080217295A1

    公开(公告)日:2008-09-11

    申请号:US11683014

    申请日:2007-03-07

    IPC分类号: C23F1/00

    摘要: The present invention provides a plasma processing apparatus or a plasma processing method that can etch a multilayer film structure for constituting a gate structure with high accuracy and high efficiency. A plasma processing method of, on processing a sample on a sample stage 112 in a depressurized discharge room 117, etching a multilayer film (including a high-k and a metal gate) at 0.1 Pa or less and with the sample stage 112 temperature-regulated by using a pressure gauge 133 to be used for pressure regulation and connected to the processing room and a main pump for exhaustion 130.

    摘要翻译: 本发明提供等离子体处理装置或等离子体处理方法,其可以以高精度和高效率蚀刻用于构成栅极结构的多层膜结构。 一种等离子体处理方法,在对减压排出室117中的样品台112上的样品进行处理时,蚀刻0.1Pa以下的多层膜(包括高k和金属栅极),并且在样品台112中, 通过使用用于压力调节并连接到处理室的压力计133和用于耗尽的主泵130进行调节。

    Plasma processing apparatus using active matching
    46.
    发明授权
    Plasma processing apparatus using active matching 有权
    等离子体处理装置采用主动匹配

    公开(公告)号:US07373899B2

    公开(公告)日:2008-05-20

    申请号:US10954074

    申请日:2004-09-30

    IPC分类号: H01L21/00

    摘要: A plasma processing apparatus having a processing chamber connected to a vacuum exhauster so that its inside pressure can be reduced by the vacuum exhauster, a gas feed unit for supplying gas into the processing chamber, a substrate electrode provided in the processing chamber and on which a sample can be placed, an RF power supply connected through a matching circuit to the substrate electrode, plasma generating means for generating plasma within the processing chamber and a voltage waveform control circuit provided within the matching circuit or between the substrate electrode and the matching circuit to flatten the voltage waveform from the RF power supply.

    摘要翻译: 一种等离子体处理装置,其具有连接到真空排气器的处理室,使得其内部压力可以通过真空排气器减少;气体供给单元,用于将气体供应到处理室中;基板电极,设置在处理室中, 可以放置样品,通过匹配电路连接到基板电极的RF电源,用于在处理室内产生等离子体的等离子体产生装置和设置在匹配电路内或者在基板电极和匹配电路之间的电压波形控制电路, 平坦化RF电源的电压波形。

    Motor controller
    47.
    发明授权

    公开(公告)号:US07304447B2

    公开(公告)日:2007-12-04

    申请号:US11498252

    申请日:2006-08-03

    IPC分类号: H02H5/04 H02H7/08

    CPC分类号: H02H7/0852 H02H6/005

    摘要: A motor controller includes: a motor control part for driving and controlling a motor; an estimated temperature computing part for computing an estimated temperature of a winding of the motor; and a motor protecting part for protecting the motor from being burned when the estimated temperature becomes larger than a predetermined temperature. A temperature rise value of the estimated temperature is computed according to operating conditions of the motor at the time of passing electric current through the winding. This temperature rise value is added to an estimated temperature stored in the estimated temperature storing part to update the estimate temperature. To compute the temperature rise value, an optimum temperature rise value is computed by the use of a plurality of temperature-rise value computing expressions.

    Plasma processing apparatus and plasma processing method
    48.
    发明申请
    Plasma processing apparatus and plasma processing method 审中-公开
    等离子体处理装置和等离子体处理方法

    公开(公告)号:US20070193976A1

    公开(公告)日:2007-08-23

    申请号:US11506788

    申请日:2006-08-21

    IPC分类号: G01L21/30 C23F1/00 H01L21/306

    CPC分类号: H01L21/6833 H01J37/32706

    摘要: The invention provides a plasma processing apparatus and a plasma processing method capable of controlling the voltage of the processing substrate with high accuracy, thereby enabling a highly accurate plasma processing. According to the invention, a voltage Vw of the processing substrate is measured using a processing substrate with a voltage probe prepared in advance, and based on a bias voltage Vesc applied to an electrostatic chuck mechanism 200 and a bias current Iesc flowing through the electrostatic chuck mechanism 200, a capacity component Cesc which is an impedance representing the electric property of the electrostatic chuck mechanism 200 is computed numerically. Then, based on a predetermined expression, the voltage Vw of the processing substrate 102 is estimated using the bias voltage Vesc of the processing substrate 102 to be measured, the bias current Iesc flowing through the electrostatic chuck mechanism 200 and the capacity component Cesc which is the impedance acquired in advance.

    摘要翻译: 本发明提供一种能够高精度地控制处理基板的电压的等离子体处理装置和等离子体处理方法,能够进行高精度的等离子体处理。 根据本发明,使用具有预先制备的电压探针的处理基板,并且基于施加到静电卡盘机构200的偏置电压Vesc和流过静电卡盘的偏置电流Iesc来测量处理基板的电压Vw 机构200,以数值方式计算作为代表静电卡盘机构200的电气特性的阻抗的电容分量Cesc。 然后,基于规定的表达式,使用待测量的处理基板102的偏置电压Vesc,流过静电卡盘机构200的偏置电流Iesc和电容成分Cesc来估计处理基板102的电压Vw 预先获得的阻抗。

    Sheet light guide and communication system using the same
    49.
    发明授权
    Sheet light guide and communication system using the same 有权
    片材光导和通讯系统使用相同

    公开(公告)号:US07224876B2

    公开(公告)日:2007-05-29

    申请号:US11044078

    申请日:2005-01-28

    IPC分类号: G02B6/10 G02B6/04

    摘要: In a communication system using a sheet light guide 100 which is formed by containing light-scattering particles in a sheet optical medium and propagates signal light incident from one end surface 100a to the other end surface 100a side while scattering the signal light by the particles, and using a plurality of optical fibers 21, 22, 23 and 24 or 31, 32, 33 and 34 coupled to the other end surface 100a in a state of being provided in parallel, each of the end surfaces 100a of the sheet light guide 100 is adapted to have an outer edge shape in which at least a part substantially coincides with an outer edge shape of the plurality of optical fibers 21 to 24 or 31 to 34.

    摘要翻译: 在使用片材光导100的通信系统中,通过在片状光学介质中含有光散射粒子而形成,并将从一个端面100a入射的信号光传播到另一个端面100a侧,同时使信号光散射 并且使用在平行设置的状态下联接到另一端面100a的多个光纤21,22,23和24或31,32,33和34,每个端面100a 片状光导100适于具有至少一部分与多根光纤21〜24或31〜34的外缘形状基本一致的外缘形状。

    Injection molding method and injection mold
    50.
    发明申请
    Injection molding method and injection mold 审中-公开
    注塑法和注塑模具

    公开(公告)号:US20070031533A1

    公开(公告)日:2007-02-08

    申请号:US11544580

    申请日:2006-10-10

    IPC分类号: B29C45/44 B29C45/38

    CPC分类号: B29C45/38 B29C2045/386

    摘要: An injection molding method and an injection mold used therefor are provided, in which a molded product free from burrs, whitening and gate marks can be obtained with a simple structure mold, and it can adequately serve the needs for multicavity molding as well. The injection molding method comprises the steps of: introducing and charging a molten resin material into a resin reservoir and a molding cavity of an injection mold, a depth of the resin reservoir being larger than a thickness of a communicating portion; and moving a cut punch, when a portion of the resin material in the resin reservoir is still molten, to push the molten resin in the resin reservoir back from a gate into a runner so that the cut punch not only closes the communicating portion but also cuts a resin solidified portion in the resin reservoir away from a resin molded product in the molding cavity at the communicating portion.

    摘要翻译: 提供了一种注射成型方法和用于其的注射模具,其中可以用简单的结构模具获得没有毛刺,美白和浇口痕迹的模制品,并且还可以充分满足多腔模塑的需要。 注射成型方法包括以下步骤:将熔融树脂材料引入树脂储存器和注射模具的模腔中,树脂储存器的深度大于连通部分的厚度; 并且当树脂储存器中的树脂材料的一部分仍然熔融时,移动切割冲头,将树脂储存器中的熔融树脂从浇口向后移动到流道中,使得切割冲头不仅封闭连通部分,而且还 在树脂储存器中将树脂固化部分从连通部分的模制腔中的树脂模制产品上切下。