Abstract:
A method and system for testing the individual memory cells of a volatile memory cell array (e.g., SRAM) for data retention faults are described. In one embodiment of the invention, adjacent memory cells connected by a pair of common bit-lines are written with opposite, or complementary, data, for example, logical “0” and logical “1”. Next, the two memory cells are subjected to a stress condition by pre-charging the common bit-lines connecting the two adjacent memory cells, and then simultaneously asserting the word-line of each memory cell. Finally, the data in each cell is read and compared with the data written to the cell prior to generating the stress condition.
Abstract:
A 2T dual-port dynamic random access memory (DRAM) that can be fabricated using a pure logic process. Write/Refresh port is independent for any DRAM cell of the DRAM. Sense amplifier is built into each DRAM cell.
Abstract:
Apparatus, methods, and systems are disclosed for providing a memory device, such as a SDRAM, having distributed memory bank segments logically coupled to form a virtual memory bank. Each of the virtual memory banks has coupled to it an associated segmented sense amp which responds to an appropriate bank select signal by sensing data stored in a selected memory bank segment. The segmented sense amp uses a segmented bit line to reduce bit sense latency without decreasing bit density or increasing chip size.
Abstract:
A load-less 12-T TCAM wherein a TCAM cell uses two 1-bit 4-T SRAM storage cells that are scalable with technology. The TCAM has a TCAM cell that comprises two 1-bit 4-T SRAM data storage cells and a comparator. Within the TCAM cell, each of the two 1-bit 4-T SRAM storage cells is coupled to a BL by a pass-gate PMOS transistor that has a NP drain diode section. This NP drain diode section has a reverse-biased leakage current that is adapted to keep a dynamic node of the SRAM storage cell high without relying on any resistive-load element. The comparator is coupled to these two 1-bit 4-T SRAM storage cells. The comparator is adapted for matching a reference data with data communicated to the comparator from the two SRAM storage cells. The comparator is a 4-T comparator coupled to these two 4-T SRAM storage cells, thereby making the TCAM a 12-T load-less static TCAM.
Abstract:
The invention discloses a low-power ternary CAM by utilizing four encoded comparand datalines, C0, C1, C2, and C3 in a twin ternary cell. The twin ternary cell is a composite of two ternary CAM bits. The two binary CAM bits are coded so that only one of four comparand datalines is toggled during a compare operation. The encoded data is stored and used for comparison. In one embodiment, the four possible states for the 2 bit comparands are coded as 0001, 0010, 0100, and 1000.
Abstract:
A high speed process for determining whether an externally applied address points to a memory cell or a redundant memory cell in a memory is disclosed. Identification information associated with redundant memory rows and columns is stored and compared with decoded information based upon a decoded externally applied address. This comparison determines if a memory cell of a redundant memory cell is addressed.
Abstract:
A semiconductor device includes a substrate with first and second transistors disposed thereon and including sources, drains, and gates, wherein the first and second gates extend longitudinally as part of linear strips that are parallel to and spaced apart. The device further includes a first CB layer forming a local interconnect electrically connected to the first gate, a second CB layer forming a local interconnect electrically connected to the second gate, and a CA layer forming a local interconnect extending longitudinally between first and second ends of the CA layer. The first and second CB layers and the CA layer are disposed between a first metal layer and the substrate. The first metal layer is disposed above each source, drain, and gate of the transistors, The CA layer extends parallel to the first and second linear strips and is substantially perpendicular to the first and second CB layers.
Abstract:
Methodology enabling selectively connecting fin structures using a segmented trench salicide layer, and the resulting device are disclosed. Embodiments include: providing on a substrate at least one gate structure; providing first and second fin structures in a vertical direction intersecting with the at least one gate structure; and providing a first segment of a salicide layer, the first segment being formed along a horizontal direction and being connected with the second fin structure and separated from the first fin structure.
Abstract:
An approach for providing timing-closed FinFET designs from planar designs is disclosed. Embodiments include: receiving one or more planar cells associated with a planar design; generating an initial FinFET design corresponding to the planar design based on the planar cells and a FinFET model; and processing the initial FinFET design to provide a timing-closed FinFET design. Other embodiments include: determining a race condition associated with a path of the initial FinFET design based on a timing analysis of the initial FinFET design; and increasing delay associated with the path to resolve hold violations associated with the race condition, wherein the processing of the initial FinFET design is based on the delay increase.
Abstract:
The memory building blocks can be used in conjunction with ASIC automatic design tools to generate a memory macro (e.g., a memory array) using a known ASIC design flow including, for example, register transfer level (RTL), synthesis, automatic place and route (APR) and timing analysis.