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公开(公告)号：US07426023B2
公开(公告)日：2008-09-16
申请号：US11296290
申请日：2005-12-08
Applicant: Yoshimasa Ohshima , Hisafumi Iwata , Hiroyuki Nakano
Inventor： Yoshimasa Ohshima , Hisafumi Iwata , Hiroyuki Nakano
IPC: G01N21/00
CPC classification number: G01N21/47 , G01N21/21 , G01N21/94 , G01N21/9501 , G01N2021/8825
Abstract: There is disclosed a defect detecting apparatus that focuses a laser beam, irradiates it onto the surface of a sample to be examined, and detects a foreign substance/defect existing on the surface from the scattered light as a result of the irradiation of the beam onto the sample surface. In order to stably detect defects such as foreign substance, the defect detecting apparatus according to the invention is constructed to use a beam shape optical system by which the laser beam emitted from a laser source is shaped to change the illumination intensity from its Gauss distribution to a flat distribution so that the detected signal can be stably produced even if the relative position of a defect/foreign substance to the laser beam irradiation position is changed.
Abstract translation: 公开了一种将激光束聚焦并将其照射到待检查样品的表面上的缺陷检测装置，并且由于将光束照射到散射光上而检测存在于表面上的异物/缺陷 样品表面。 为了稳定地检测异物等缺陷，根据本发明的缺陷检测装置的结构是使用光束形状光学系统，通过该光束系统将从激光源发射的激光束成形为将照射强度从其高斯分布改变为 平坦分布，使得即使改变了缺陷/异物与激光束照射位置的相对位置，也能够稳定地产生检测信号。
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公开(公告)号：US07369223B2
公开(公告)日：2008-05-06
申请号：US11086442
申请日：2005-03-23
Applicant: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
Inventor： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
IPC: G01N21/00
CPC classification number: G01N21/956
Abstract: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.
Abstract translation: 用于检查图案以检测小图案缺陷的装置具有照明光源，作为具有多个照明部的照明光学系统，所述照明光学系统具有多个照明部分，用于将照明光束的光路从多个照明部分切换到构成被检查物体的板的表面 方向不同的检测光学系统，使用用于聚焦来自照明板的反射衍射光的物镜具有可变放大倍数的检测光学系统，具有可变倍率的聚焦光学系统，其能够通过会聚的反射衍射光聚焦光学图像，具有期望的 聚焦放大率和用于检测由聚焦光学系统聚焦的光学图像以将其转换成图像信号的光学检测器，用于将图像信号转换为数字图像信号的A / D转换器和用于处理数字图像信号的图像信号处理器 图像信号来检测缺陷。
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公开(公告)号：US20070247616A1
公开(公告)日：2007-10-25
申请号：US11770217
申请日：2007-06-28
Applicant: AKIRA HAMAMATSU , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
Inventor： AKIRA HAMAMATSU , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
CPC classification number: G01N21/8806 , G01N21/94 , G01N21/9501 , G01N21/95623
Abstract: The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.
Abstract translation: 本发明是用于检查异物的缺陷的装置，包括照明光学系统，检测光学系统，屏蔽单元，其设置在所述检测光学系统中，以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统，其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶，或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜，或通过加热，突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板或圆柱形的屏蔽板或 板形。
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公开(公告)号：US07248352B2
公开(公告)日：2007-07-24
申请号：US10724750
申请日：2003-12-02
Applicant: Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
Inventor： Akira Hamamatsu , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Takahiro Jingu , Sachio Uto
IPC: G01N21/00
CPC classification number: G01N21/8806 , G01N21/94 , G01N21/9501 , G01N21/95623
Abstract: The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.
Abstract translation: 本发明是用于检查异物的缺陷的装置，包括照明光学系统，检测光学系统，屏蔽单元，其设置在所述检测光学系统中，以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统，其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶，或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜，或通过加热，突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板，或圆柱形的屏蔽板或 板形。
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公开(公告)号：US20060124874A1
公开(公告)日：2006-06-15
申请号：US10536715
申请日：2003-11-27
Applicant: Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
Inventor： Sachio Uto , Minori Noguchi , Hidetoshi Nishiyama , Yoshimasa Ohshima , Akira Hamamatsu , Takahiro Jingu , Toshihiko Nakata , Masahiro Watanabe
CPC classification number: G01N21/00 , G01N21/9501 , G06T7/0004 , G06T2207/30148
Abstract: A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.
Abstract translation: 一种缺陷检查装置，具有：在其上安装检查对象基板的同时沿预定方向行进的扫描台; 照明光学系统，用于以与其倾斜的预定角度将照明光束照射在检查对象基板的表面上; 检测光学系统，包括：用于接收从检查对象基板向上发射的上方反射/散射光的上方光检测器，从而将其转换为高定向图像信号;以及侧向光检测器， 将检测对象基板发射的侧向反射/散射光倾斜到倾斜方向，以与照明光束平坦地相交，从而转换为侧向图像信号; 以及信号处理系统 - 用于基于上限图像信号和侧向图像信号来检测缺陷。
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Patent Agency Ranking
公开(公告)号：US07061602B2
公开(公告)日：2006-06-13
申请号：US11117336
申请日：2005-04-29
Applicant: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
Inventor： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
CPC classification number: G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
Abstract: A method of inspecting a sample in which the sample is inspected under a plurality of inspection conditions and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
Abstract translation: 检查在多个检查条件下检查样品的样品的检查方法以及根据多个检查条件中的每一个检查样品而获得的检查数据以及与检查日期对应的检查日期的样品的位置信息的方法 条件被存储。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。
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公开(公告)号：US20060030059A1
公开(公告)日：2006-02-09
申请号：US11244078
申请日：2005-10-06
Applicant: Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
Inventor： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
IPC: H01L21/66
CPC classification number: B82Y15/00 , G01N21/94 , G01N21/95623 , G01N21/95684 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L21/681 , H01L22/12 , H01L2924/0002 , H01L2924/00
Abstract: A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.
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48.发明申请Method and its apparatus for inspecting particles or defects of a semiconductor device 有权用于检查半导体器件的颗粒或缺陷的方法及其装置公开(公告)号：US20050264798A1
公开(公告)日：2005-12-01
申请号：US11190838
申请日：2005-07-28
Applicant: Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
Inventor： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
CPC classification number: G01N21/274 , G01N21/47 , G01N21/4738 , G01N21/8806 , G01N21/94 , G01N21/95 , G01N21/956 , G01N2021/8854
Abstract: An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
Abstract translation: 用于光学检查颗粒和/或缺陷的装置将颗粒和/或缺陷的尺寸与检查结果中的故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。
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公开(公告)号：US20050196033A1
公开(公告)日：2005-09-08
申请号：US11117336
申请日：2005-04-29
Applicant: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
Inventor： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC: G01N21/956 , G06T7/00 , H01L21/66 , G06K9/00
CPC classification number: G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
Abstract: A method of inspecting a sample in which the sample is inspected under a plurality of inspection conditions and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
Abstract translation: 检查在多个检查条件下检查样品的样品的检查方法以及根据多个检查条件中的每一个检查样品而获得的检查数据以及与检查日期对应的检查日期的样品的位置信息的方法 条件被存储。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。
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公开(公告)号：US20050122508A1
公开(公告)日：2005-06-09
申请号：US10975450
申请日：2004-10-29
Applicant: Sachio Uto , Yoshimasa Ohshima , Minori Noguchi , Toshiei Kurosaki
Inventor： Sachio Uto , Yoshimasa Ohshima , Minori Noguchi , Toshiei Kurosaki
IPC: G01N21/956 , G01N23/225 , G01N21/88
CPC classification number: H01J37/226 , G01N21/956 , G01N23/2251 , H01J2237/2482
Abstract: The present invention provides an apparatus capable of, and a method for, inspecting at high speed and with high accuracy the super minute foreign particles and pattern defects occurring during device-manufacturing processes in which circuit patterns are to be formed on a sample such as a substrate of semiconductor devices and other elements: in the invention, the sample is illuminated in a dark field from multiple directions each of a different incident angle, the light scattered from the sample during the dark-field illumination is detected in each of the multiple directions, and the signals obtained by detecting the scattered light in each direction; thus, defects present on the surface of an optically transparent film of the sample, and defects present in or under the transparent film are discriminated from each other and both types of defects are discriminatively reviewed using a scanning electron microscope.
Abstract translation: 本发明提供了一种能够以高精度，高精度地检查在器件制造过程中发生的超微小异物和图案缺陷的装置，其中电路图形将被形成在诸如 半导体器件的衬底和其他元件：在本发明中，样品在来自不同入射角的多个方向的暗场中照射，在暗场照明期间从样品散射的光在多个方向中的每一个中被检测 以及通过检测各方向的散射光而获得的信号; 因此，存在于样品的光学透明膜的表面上的缺陷以及存在于透明膜中或其下的缺陷彼此区分，并且使用扫描电子显微镜来区分地区分两种类型的缺陷。
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