公开(公告)号：US20110250752A1

公开(公告)日：2011-10-13

申请号：US13165888

申请日：2011-06-22

申请人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

发明人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

IPC分类号： H01L21/28

CPC分类号： H01L27/1104 ,  H01L27/11

摘要： In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

公开(公告)号：US20110215414A1

公开(公告)日：2011-09-08

申请号：US13067177

申请日：2011-05-13

申请人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

发明人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

IPC分类号： H01L27/092

CPC分类号： G11C11/412 ,  G11C11/40 ,  G11C11/413 ,  G11C11/418 ,  H01L21/823475 ,  H01L21/823493 ,  H01L21/823814 ,  H01L21/82385 ,  H01L27/088 ,  H01L27/092 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H03K19/0016

摘要： The gate tunnel leakage current is increased in the up-to-date process, so that it is necessary to reduce the gate tunnel leakage current in the LSI which is driven by a battery for use in a cellular phone and which needs to be in a standby mode at a low leakage current. In a semiconductor integrated circuit device, the ground source electrode lines of logic and memory circuits are kept at a ground potential in an active mode, and are kept at a voltage higher than the ground potential in an unselected standby mode. The gate tunnel leakage current can be reduced without destroying data.

公开(公告)号：US07973497B2

公开(公告)日：2011-07-05

申请号：US12403432

申请日：2009-03-13

申请人： Akio Nishida ,  Shigeru Arai

发明人： Akio Nishida ,  Shigeru Arai

IPC分类号： G05F1/00

CPC分类号： H05B41/3921 ,  H05B41/2828

摘要： A discharge tube lighting apparatus includes a converter that converts a voltage received from an alternating-current or direct-current power supply into a predetermined direct-current voltage and an inverter that converts an output voltage of the converter into an alternating-current voltage having a predetermined frequency. The inverter performs burst control based on an externally input dimming signal. The converter operates regardless of the active or inactive period of the burst control of the inverter and performs negative feedback control in response to a detection signal of a tube current in the active period of the inverter.

摘要翻译： 放电管照明装置包括将从交流或直流电源接收的电压转换为预定直流电压的转换器和将转换器的输出电压转换成具有预定直流电压的交流电压的逆变器， 预定频率。 逆变器基于外部输入的调光信号进行突发控制。 无论变频器的脉冲串控制的有效或无效周期如何，转换器都工作，并且响应于在反相器的有效周期内的管电流的检测信号执行负反馈控制。

公开(公告)号：US07964484B2

公开(公告)日：2011-06-21

申请号：US12457917

申请日：2009-06-25

申请人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

发明人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

IPC分类号： H01L21/425 ,  H01L29/167

CPC分类号： G11C11/412 ,  G11C11/40 ,  G11C11/413 ,  G11C11/418 ,  H01L21/823475 ,  H01L21/823493 ,  H01L21/823814 ,  H01L21/82385 ,  H01L27/088 ,  H01L27/092 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H03K19/0016

摘要： The gate tunnel leakage current is increased in the up-to-date process, so that it is necessary to reduce the gate tunnel leakage current in the LSI which is driven by a battery for use in a cellular phone and which needs to be in a standby mode at a low leakage current. In a semiconductor integrated circuit device, the ground source electrode lines of logic and memory circuits are kept at a ground potential in an active mode, and are kept at a voltage higher than the ground potential in an unselected standby mode. The gate tunnel leakage current can be reduced without destroying data.

摘要翻译： 在最新的工艺中，栅极隧道泄漏电流增加，因此需要减小由用于蜂窝电话的电池驱动的LSI中的栅极隧道泄漏电流，并且需要在 待机模式处于低漏电流。 在半导体集成电路器件中，逻辑和存储电路的接地源电极线保持在有源模式的接地电位，并且在未选择待机模式下保持在比地电位高的电压。 可以减少栅极漏电流而不破坏数据。

公开(公告)号：US20100190330A1

公开(公告)日：2010-07-29

申请号：US12727890

申请日：2010-03-19

申请人： Yasuaki YONEMOCHI ,  Hisakazu Otoi ,  Akio Nishida ,  Shigeru Shiratake

发明人： Yasuaki YONEMOCHI ,  Hisakazu Otoi ,  Akio Nishida ,  Shigeru Shiratake

IPC分类号： H01L21/28

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L21/7682 ,  H01L27/115 ,  H01L29/42324

摘要： A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.

公开(公告)号：US07595266B2

公开(公告)日：2009-09-29

申请号：US12146599

申请日：2008-06-26

申请人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

发明人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

IPC分类号： H01L21/44

CPC分类号： H01L27/1104 ,  H01L27/11

摘要： In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

摘要翻译： 在形成五个埋入中间导电层的沟槽中，用于连接转移MISFET和驱动MISFET与其上形成的垂直MISFET，其中第二和第三沟槽以及第一，第四和第五沟槽分别通过使用第一和第二 光刻胶膜作为掩模。 由于即使在第一沟槽和第二或第三沟槽之间的最短距离以及第二沟槽和第三沟槽与第四沟槽之间的最短距离小于分辨率极限的情况下，也可以以高精度形成所有沟槽 对于曝光光，布置在一个相同存储单元中的五个沟槽中的每一个之间的距离可以减小到小于曝光光的分辨率极限。

公开(公告)号：US20080203437A1

公开(公告)日：2008-08-28

申请号：US12078992

申请日：2008-04-09

申请人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

发明人： Kenichi Osada ,  Koichiro Ishibashi ,  Yoshikazu Saitoh ,  Akio Nishida ,  Masaru Nakamichi ,  Naoki Kitai

IPC分类号： H01L27/11 ,  G11C11/40

CPC分类号： G11C11/412 ,  G11C11/40 ,  G11C11/413 ,  G11C11/418 ,  H01L21/823475 ,  H01L21/823493 ,  H01L21/823814 ,  H01L21/82385 ,  H01L27/088 ,  H01L27/092 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H03K19/0016

摘要： The gate tunnel leakage current is increased in the up-to-date process, so that it is necessary to reduce the gate tunnel leakage current in the LSI which is driven by a battery for use in a cellular phone and which needs to be in a standby mode at a low leakage current. In a semiconductor integrated circuit device, the ground source electrode lines of logic and memory circuits are kept at a ground potential in an active mode, and are kept at a voltage higher than the ground potential in an unselected standby mode. The gate tunnel leakage current can be reduced without destroying data.

摘要翻译： 在最新的工艺中，栅极隧道泄漏电流增加，因此需要减小由用于蜂窝电话的电池驱动的LSI中的栅极隧道泄漏电流，并且需要在 待机模式处于低漏电流。 在半导体集成电路器件中，逻辑和存储电路的接地源电极线保持在有源模式的接地电位，并且在未选择待机模式下保持在比地电位高的电压。 可以减少栅极漏电流而不破坏数据。

公开(公告)号：US20070034968A1

公开(公告)日：2007-02-15

申请号：US11584623

申请日：2006-10-23

申请人： Akio Nishida ,  Hiraku Chakihara ,  Koichi Toba

发明人： Akio Nishida ,  Hiraku Chakihara ,  Koichi Toba

IPC分类号： H01L29/94

CPC分类号： G11C11/4125 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116

摘要： In order to improve the soft error resistance of a memory cell of an SRAM without increasing its chip size in deep through-holes formed by perforating a silicon oxide film, there is a silicon nitride film and a silicon oxide film, a capacitor element having a TIN film serving as a lower electrode. This capacitor element is connected between a storage node and a supply voltage line, between a storage node and a reference voltage line, or between storage nodes of the memory cell of the SRAM.

摘要翻译： 为了提高SRAM的存储单元的软错误电阻，而不增加其通过穿孔氧化硅膜形成的深通孔中的芯片尺寸，存在氮化硅膜和氧化硅膜，电容器元件具有 TIN膜用作下电极。 该电容器元件连接在存储节点和电源电压线之间，存储节点和参考电压线之间，或SRAM的存储单元的存储节点之间。

公开(公告)号：US20060057795A1

公开(公告)日：2006-03-16

申请号：US11265292

申请日：2005-11-03

申请人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

发明人： Hiraku Chakihara ,  Mitsuhiro Noguchi ,  Masahiro Tadokoro ,  Naonori Wada ,  Akio Nishida

IPC分类号： H01L21/8234

CPC分类号： H01L27/1104 ,  H01L27/11

摘要： In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

公开(公告)号：US20060022321A1

公开(公告)日：2006-02-02

申请号：US11190011

申请日：2005-07-27

申请人： Kazuhito Matsukawa ,  Tsuyoshi Koga ,  Akio Nishida ,  Yoshiko Higashide ,  Jun Shibata ,  Hiroshi Tobimatsu

发明人： Kazuhito Matsukawa ,  Tsuyoshi Koga ,  Akio Nishida ,  Yoshiko Higashide ,  Jun Shibata ,  Hiroshi Tobimatsu

IPC分类号： H01L21/50 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a semiconductor chip A wherein an element layer 2 having transistors and the like is formed on the front face, and the back face is joined to an underlying member, such as a package substrate, the thickness T is made 100 μm or less, and thereafter, a gettering layer 3 is formed on the back face of the semiconductor chip A. The gettering layer 3 is formed, for example, by polishing the back face of said semiconductor chip A using a polishing machine. Thereby, the yield of devices can be improved in the step for assembling the package.