公开(公告)号：US20090231827A1

公开(公告)日：2009-09-17

申请号：US12336697

申请日：2008-12-17

申请人： Toshiki Furutani ,  Atsushi Sakai ,  Kiyohisa Hasegawa ,  Hiroshi Segawa ,  Shuichi Kawano ,  Hajime Sakamoto

发明人： Toshiki Furutani ,  Atsushi Sakai ,  Kiyohisa Hasegawa ,  Hiroshi Segawa ,  Shuichi Kawano ,  Hajime Sakamoto

IPC分类号： H05K7/02 ,  H01L23/48 ,  C23F1/00

CPC分类号： H01L23/49822 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/19107

摘要： An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.

摘要翻译： 提供了插入件及其制造方法。 内插件包括基板和形成在基板内部的导体部分。 在基板上和导体部分上形成至少一个绝缘层。 在绝缘层内或绝缘层上形成信号布线部分。 第一焊盘被配置为接收电子部件，并且形成在所述至少一个绝缘层的最外绝缘层上。 连接导体形成在所述至少一个绝缘层中，以便将导体部分电连接到第一焊盘。

公开(公告)号：US20080216308A1

公开(公告)日：2008-09-11

申请号：US12118242

申请日：2008-05-09

申请人： Hiroshi Nitoh ,  Toshihiro Okabe ,  Kenji Ishit ,  Atsushi Sakai

发明人： Hiroshi Nitoh ,  Toshihiro Okabe ,  Kenji Ishit ,  Atsushi Sakai

IPC分类号： B23P19/00 ,  B23P23/00

CPC分类号： H01G13/00 ,  Y10T29/49121 ,  Y10T29/5313 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/532 ,  Y10T29/53213 ,  Y10T29/53217

摘要： The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

摘要翻译： 本发明涉及一种用于制造梳状电容器元件的装置，该梳状电容器元件包括引导件和多个矩形金属箔片接合到导向件上，该自动进给机构用于将带状金属箔以恒定的长度 朝向引导构件，用于将金属箔接合到引导构件的接合机构，以及用于切割接合的金属箔的切割机构。 根据本发明的装置，可以有效地制造具有多个矩形金属箔片的梳状电容器元件，通过将细长的带状金属箔粘合而不会损坏。

公开(公告)号：US20070233554A1

公开(公告)日：2007-10-04

申请号：US11516274

申请日：2006-09-06

申请人： Atsushi Sakai ,  Takayuki Hasebe

发明人： Atsushi Sakai ,  Takayuki Hasebe

IPC分类号： G07B15/00 ,  H04Q5/22 ,  G08B13/14

CPC分类号： G06Q30/02

摘要： An advertisement management device generates and manages advertisement information and an advertisement identifier, a tag management unit generates a tag identifier and tag information unique to the tag identifier, and manages the tag identifier, the tag information, and the advertisement identifier generated by the advertisement management device in associated manner. The tag management unit sends the tag identifier and the advertisement identifier to the radio tag. A reader reads the tag identifier and the advertisement identifier from the radio tag, sends the tag identifier to the tag management unit, and sends the advertisement identifier to the advertisement management unit. The tag management unit sends tag information corresponding to the tag identifier received from the reading unit to a display unit, and the advertisement management unit sends advertisement information corresponding to the advertisement identifier received from the reading unit to the display unit.

摘要翻译： 广告管理装置生成和管理广告信息和广告标识符，标签管理单元生成标签标识符和标签标识符唯一的标签信息，并管理由广告管理器生成的标签标识符，标签信息和广告标识符 设备以相关方式。 标签管理单元将标签标识符和广告标识符发送到无线标签。 读取器从无线电标签读取标签标识符和广告标识符，将标签标识符发送到标签管理单元，并将广告标识符发送到广告管理单元。 标签管理单元将与从读取单元接收的标签标识符相对应的标签信息发送到显示单元，并且广告管理单元将与从读取单元接收的广告标识符相对应的广告信息发送到显示单元。

公开(公告)号：US20070115504A1

公开(公告)日：2007-05-24

申请号：US11559832

申请日：2006-11-14

申请人： Kumi Hata ,  Masatoshi Nakazawa ,  Atsushi Sakai

发明人： Kumi Hata ,  Masatoshi Nakazawa ,  Atsushi Sakai

IPC分类号： H04N1/40

CPC分类号： H04N1/4074

摘要： An image correction apparatus and method enable correcting an image so that the image is always discernible and at least text can be read regardless of user settings. A correction range that increases the gray level and a correction range that decreases the gray level are calculated for each image to calculate the correction range suitable for the particular image.

摘要翻译： 图像校正装置和方法能够校正图像，使得图像总是可辨别的，并且至少文本可以被读取，而不管用户设置如何。 为每个图像计算增加灰度级的校正范围和降低灰度级的校正范围，以计算适合于特定图像的校正范围。

公开(公告)号：US07175781B2

公开(公告)日：2007-02-13

申请号：US10939569

申请日：2004-09-14

申请人： Hiroshi Konuma ,  Koro Shirane ,  Ryuji Monden ,  Atsushi Sakai ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Toru Sawaguchi ,  Hideko Ohata ,  Yoshiaki Ikenoue

发明人： Hiroshi Konuma ,  Koro Shirane ,  Ryuji Monden ,  Atsushi Sakai ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Toru Sawaguchi ,  Hideko Ohata ,  Yoshiaki Ikenoue

IPC分类号： H01G9/00 ,  H01G9/028

CPC分类号： H01G9/025 ,  H01G9/028 ,  H01G9/15 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a valve acting metal having microfine pores, a dielectric film formed on a surface of the valve acting metal, and a solid electrolyte layer provided on the dielectric film, in which at least a portion of the solid electrolyte layer is of a lamellar structure. In particular, a solid electrolytic capacitor includes an electrically conducting polymer having a specified condensed ring structure containing (1) a solid electrolyte layer containing a sulfoquinone anion, and (2) a solid electrolyte layer containing an anthracenesulfonate ion and other anion.

摘要翻译： 固体电解电容器包括具有微细孔的阀作用金属，形成在阀作用金属的表面上的电介质膜和设置在电介质膜上的固体电解质层，其中固体电解质层的至少一部分为 层状结构。 特别地，固体电解电容器包括具有特定的稠环结构的导电性聚合物，其含有（1）含有磺基醌阴离子的固体电解质层，（2）含有蒽磺酸根离子和其他阴离子的固体电解质层。

公开(公告)号：US20070027560A1

公开(公告)日：2007-02-01

申请号：US11457073

申请日：2006-07-12

申请人： Masatoshi Nakazawa ,  Atsushi Sakai ,  Masahiro Katagiri

发明人： Masatoshi Nakazawa ,  Atsushi Sakai ,  Masahiro Katagiri

IPC分类号： G05B11/01

CPC分类号： H04L41/12 ,  H04L41/082 ,  H04L41/0856

摘要： A device control system, a device control method, and a device control program for rendering a trace function as a function added to a service object that provides the software application with an interface to a particular device based on the Microsoft .NET Framework. The device control system has a service object, a service object for tracing, and renders a trace function in a service object that provides a device interface to a software application based on the .NET Framework. The trace function can be rendered in the service object based on whether the trace function is disabled or enabled without modifying the software application.

摘要翻译： 一种设备控制系统，设备控制方法和设备控制程序，用于将跟踪功能呈现为添加到服务对象的功能，该服务对象向Microsoft软件应用程序提供基于Microsoft .NET Framework的特定设备的接口。 设备控制系统具有服务对象，用于跟踪的服务对象，并在服务对象中呈现跟踪功能，该对象为基于.NET Framework的软件应用程序提供设备接口。 跟踪功能可以根据跟踪功能是否被禁用或启用而不修改软件应用程序在服务对象中呈现。

公开(公告)号：US20060049995A1

公开(公告)日：2006-03-09

申请号：US11215131

申请日：2005-08-31

申请人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01L24/24 ,  H01L24/45 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73267 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/22 ,  H05K1/0298 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.

公开(公告)号：US06449140B1

公开(公告)日：2002-09-10

申请号：US09899992

申请日：2001-07-09

申请人： Atsushi Sakai ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Takashi Ichimura

发明人： Atsushi Sakai ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Takashi Ichimura

IPC分类号： H01G904

CPC分类号： H01G9/15 ,  H01G9/028 ,  H01G9/0425 ,  Y10T29/417

摘要： The present invention provides a solid electrolytic capacitor having a structure that relieves thermal stress, prevents leakage current, exhibits low impedance and ensures high reliability. The solid electrolytic capacitor element has a valve-acting metal substrate with a dielectric film and an edge part acting as an anode, an insulating layer circumferentially provided on the substrate, a solid electrolyte layer and an electrically conducting layer having a carbon paste layer and a metal powder-containing electrically conducting layer formed in this order on the entire substrate surface opposite to the anode with respect to the insulating layer and acting as a cathode. The electrically conducting layer is provided within a region of the carbon paste layer or with a spacing from the cathode side edge part of the insulating layer. The present invention also provides a method for producing the element, and a solid electrolytic capacitor using the element.

摘要翻译： 本发明提供一种具有减轻热应力，防止漏电流，低阻抗，高可靠性的结构的固体电解电容器。 固体电解电容器元件具有带电介质膜的阀作用金属基板和作为阳极的边缘部分，周向设置在基板上的绝缘层，固体电解质层和具有碳糊层和 含金属粉末的导电层相对于绝缘层在与阳极相反的整个基板表面上依次形成并用作阴极。 导电层设置在碳糊层的一个区域内或与绝缘层的阴极侧边缘部分间隔开。 本发明还提供了一种用于制造元件的方法和使用该元件的固体电解电容器。

公开(公告)号：US06430032B2

公开(公告)日：2002-08-06

申请号：US09899209

申请日：2001-07-06

申请人： Atsushi Sakai ,  Ryuji Monden ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Tatsuo Obata

发明人： Atsushi Sakai ,  Ryuji Monden ,  Yuji Furuta ,  Katsuhiko Yamazaki ,  Tatsuo Obata

IPC分类号： H01G900

CPC分类号： H01G9/0036 ,  H01G9/15 ,  Y10T29/417

摘要： To provide a solid electrolytic capacitor where solid electrolyte is formed at the cut end part and at the masking part to a larger thickness than in other parts, where the adhesion of the solid electrolyte formed on the valve acting metal oxide film is improved, and whereby the capacitor is highly stabilized in various basic properties such as capacitance, dielectric loss (tan &dgr;), leakage current and short circuit defective ratio and also in the reflow soldering heat resistance and moisture resistance load characteristics. These solid electrolytic capacitor can be obtained by forming electrically conducting polymer on a dielectric film by specifying time for dipping of the surface of a valve actiong metal porous body with a solution containing a monomer and with a solution containing an oxidizing agent, time for vaporization of the solvent of the solution containing a monomer, and polymerization conditions after dipping of the solution containing an oxidizing agent.

摘要翻译： 为了提供一种固体电解电容器，其中在切割端部和掩模部分处形成固体电解质的厚度大于其他部分的厚度，其中形成在阀作用金属氧化物膜上的固体电解质的粘附性得到改善，并且由此 电容器在诸如电容，介电损耗（tanδ），漏电流和短路缺陷率等各种基本特性中也具有高度稳定性，并且还具有回流焊接耐热性和耐湿负载特性。这些固体电解电容器可以通过形成 导电聚合物在电介质膜上的规定时间，用于将含有单体的溶液和含有氧化剂的溶液的气泡作用金属多孔体的表面浸渍的时间，含有单体的溶液的溶剂的蒸发时间， 以及在浸渍含有氧化剂的溶液之后的聚合条件。

公开(公告)号：US06421227B2

公开(公告)日：2002-07-16

申请号：US09732710

申请日：2000-12-11

申请人： Hiroshi Nitoh ,  Atsushi Sakai ,  Wataru Minamida ,  Yuji Furuta

发明人： Hiroshi Nitoh ,  Atsushi Sakai ,  Wataru Minamida ,  Yuji Furuta

IPC分类号： H01G900

CPC分类号： H01G9/15 ,  H01G9/028 ,  Y10T29/417

摘要： A solid electrolytic capacitor is obtained by mounting a plurality of single plate capacitor elements within a chip by employing a stacking structure such as parallel stacking, opposing stacking, each layer-opposing stacking or closest stacking. As a result, a compact and high-capacitance element can be easily manufactured. The single plate capacitor element is preferably an element having an unfolded fan-like shape.

摘要翻译： 通过采用层叠结构例如平行堆叠，相对堆叠，每一层相对堆叠或最近堆叠，将多个单板电容器元件安装在芯片内，获得固体电解电容器。 结果，可以容易地制造紧凑且高电容的元件。 单板电容器元件优选是具有展开的扇形形状的元件。