公开(公告)号：US08035980B2

公开(公告)日：2011-10-11

申请号：US12472205

申请日：2009-05-26

Applicant: Yu-Chiang Cheng ,  Kuo-Ming Chuang

Inventor： Yu-Chiang Cheng ,  Kuo-Ming Chuang

IPC: H05K7/00

CPC classification number: H05K1/024 ,  H01P3/026 ,  H01P3/085 ,  H01P5/185 ,  H05K1/025 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract translation: 提供了通过使用不同的参考平面来修改特性阻抗的电路结构。 该结构包括模拟信号线，数字信号线，用于模拟信号的相应参考平面和用于数字信号的对应参考平面。 其中，模拟信号线的线宽与数字信号线的线宽相同。 此外，模拟信号线与对应的模拟信号参考平面之间的距离长于数字信号线与对应的数字信号参考平面之间的距离。 因此，可以解决信号传输期间的特征阻抗失配，并且可以提高信号传输的质量。

公开(公告)号：US07782270B2

公开(公告)日：2010-08-24

申请号：US12153738

申请日：2008-05-23

Applicant: Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

Inventor： Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

IPC: H01Q1/48 ,  H01Q9/38

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q5/371

Abstract: Disclosed is a planar inverted-F antenna with an extended grounding plane. The planar inverted-F antenna has a grounding metal plate having a selected side edge on which the extended grounding plane is formed and has a predetermined height. At least one antenna signal radiating plate is connected to the grounding metal plate by a short-circuit piece and is substantially parallel to and spaced from the grounding metal plate by a distance. A feeding point extends from the antenna signal radiating plate in a direction toward the grounding metal plate and corresponds to the extended grounding plane with a predetermined gap therebetween. With the arrangement of the extended grounding plane, the impedance matching of the antenna is improved and the impedance bandwidth of the antenna is increased.

Abstract translation: 公开了具有扩展接地平面的平面倒F天线。 平面倒F天线具有接地金属板，所述接地金属板具有选定的侧边缘，所述扩展接地平面形成在该边缘上并具有预定高度。 至少一个天线信号辐射板通过短路片连接到接地金属板，并且与接地金属板基本上平行并间隔一定距离。 馈电点从天线信号辐射板沿着接地金属板的方向延伸，并且对应于延伸的接地平面，其间具有预定的间隙。 随着扩展接地平面的布置，天线的阻抗匹配得到改善，天线的阻抗带宽增加。

公开(公告)号：US20090231065A1

公开(公告)日：2009-09-17

申请号：US12472205

申请日：2009-05-26

Applicant: Yu-Chiang Cheng ,  Kuo-Ming Chuang

Inventor： Yu-Chiang Cheng ,  Kuo-Ming Chuang

IPC: H01P3/08 ,  H05K1/03

CPC classification number: H05K1/024 ,  H01P3/026 ,  H01P3/085 ,  H01P5/185 ,  H05K1/025 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract translation: 提供了通过使用不同的参考平面来修改特性阻抗的电路结构。 该结构包括模拟信号线，数字信号线，用于模拟信号的相应参考平面和用于数字信号的对应参考平面。 其中，模拟信号线的线宽与数字信号线的线宽相同。 此外，模拟信号线与对应的模拟信号参考平面之间的距离长于数字信号线与对应的数字信号参考平面之间的距离。 因此，可以解决信号传输期间的特征阻抗失配，并且可以提高信号传输的质量。

公开(公告)号：US07427807B2

公开(公告)日：2008-09-23

申请号：US11356070

申请日：2006-02-17

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H01L23/34

CPC classification number: H01L23/3736 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract translation: 本发明公开了一种用于芯片散热的制造方法和结构。 该散热结构包括电路结构的底板，中央处理单元的模具和盖。 该盖通常用于进行从芯片产生的废热。 盖可以由特殊的导热材料制成，包括具有高导热性的碳元素的金属和支架结构，以提高热传导的效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法进行。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。

公开(公告)号：USRE39766E1

公开(公告)日：2007-08-14

申请号：US10943256

申请日：2004-09-15

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other; first, second, third and fourth signal wiring layers; first, second and third ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil. Each of the second and sixth insulating substrates has a thickness ranging from 3 to 13 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 15 mil. The fourth insulating substrate has a thickness ranging from 2 to 6 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first and second ground wiring layers. The third signal wiring layer has a third resistance with respect to the third ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the third ground wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括依次一个上下设置的第一，第二，第三，第四，第五，第六和第七绝缘衬底; 第一，第二，第三和第四信号布线层; 第一，第二和第三接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个的厚度范围为2.5至7.5密耳。 第二和第六绝缘基板中的每一个具有3至13密耳的厚度。 第三和第五绝缘基板中的每一个具有3至15密耳的厚度。 第四绝缘基板具有2至6密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一和第二接地布线层具有第二电阻。 第三信号布线层相对于第三接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第三接地布线层具有第四电阻。 第一，第二，第三和第四电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US20060255451A1

公开(公告)日：2006-11-16

申请号：US11307850

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H01L23/34

CPC classification number: C09J9/00 ,  C08L63/00 ,  C08L79/08 ,  C09J11/04 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3737 ,  H01L23/473 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01068

Abstract: This invention discloses a manufacturing process method and a structure for a heat conduction interface material. This heat conduction interface material is often used as a buffer interface between chips and heat dissipation devices and is conducted the waste heat from the chips. The heat conduction interface material can be combined a plastic material and a bracket structure of carbon element. The corresponding manufacturing process method for this heat conduction interface material comprises a mixed process that is composed of a plastic material and a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity, so as to improve the efficiency of heat conduction. The bracket structure of carbon element can be mixed into the metal and resins.

Abstract translation: 本发明公开了一种导热界面材料的制造方法和结构。 这种导热界面材料通常用作芯片和散热装置之间的缓冲接口，并且进行来自芯片的废热。 导热界面材料可以结合塑料材料和碳元素的支架结构。 用于该导热界面材料的相应制造方法包括由塑料材料和碳元素的支架结构组成的混合工艺。 碳元素的支架结构具有高导热性，从而提高导热效率。 碳元素的支架结构可以混入金属和树脂中。

公开(公告)号：US20060205118A1

公开(公告)日：2006-09-14

申请号：US11356070

申请日：2006-02-17

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H01L21/00

CPC classification number: H01L23/3736 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract translation: 本发明公开了一种用于芯片散热的制造方法和结构。 该散热结构包括电路结构的底板，中央处理单元的模具和盖。 该盖通常用于进行从芯片产生的废热。 盖可以由特殊的导热材料制成，包括具有高导热性的碳元素的金属和支架结构，以提高热传导的效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法进行。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。

公开(公告)号：US06417460B1

公开(公告)日：2002-07-09

申请号：US09800412

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K103

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/4688 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates; first, second, third, fourth and fifth signal wiring layers; first and second ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 6.5 mil. Each of the second, fourth and sixth insulating substrates has a thickness ranging from 3 to 9 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 23 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the first ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the second ground wiring layer and the power wiring layer. The fifth signal wiring layer has a fifth resistance with respect to the second ground wiring layer. The first, second, third, fourth and fifth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括第一，第二，第三，第四，第五，第六和第七绝缘基板; 第一，第二，第三，第四和第五信号布线层; 第一和第二接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个具有2.5至6.5密耳的厚度。 第二，第四和第六绝缘基板中的每一个具有3至9密耳的厚度。 第三和第五绝缘基板中的每一个具有3至23密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一接地布线层和电源布线层具有第二电阻。 第三信号布线层相对于第一接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第二接地布线层和电源布线层具有第四电阻。 第五信号布线层相对于第二接地布线层具有第五电阻。 第一，第二，第三，第四和第五电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US20080198087A1

公开(公告)日：2008-08-21

申请号：US11676181

申请日：2007-02-16

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zeng Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zeng Chou

IPC: H01Q1/48

CPC classification number: H01Q9/42 ,  H01Q5/371 ,  H01Q9/045

Abstract: A dual-band antenna is provided, which includes a signal resonance unit, a grounding unit, a connection unit, and a signal line. The grounding unit is disposed opposite to the signal resonance unit. The connection unit has a first connection element and a second connection element, wherein one end of the first connection element is connected to the signal resonance unit and the other end of the first connection element is connected to the grounding unit, while one end of the second connection element is connected to one side of the first connection element. The signal line has a signal feeding end and a circuit connection end, wherein the signal feeding end is electrically connected to the second connection element, and the circuit connection end is electrically connected to a wireless circuit device.

Abstract translation: 提供了一种双频天线，其包括信号共振单元，接地单元，连接单元和信号线。 接地单元设置成与信号谐振单元相对。 连接单元具有第一连接元件和第二连接元件，其中第一连接元件的一端连接到信号谐振单元，并且第一连接元件的另一端连接到接地单元，而第一连接元件的一端 第二连接元件连接到第一连接元件的一侧。 信号线具有信号馈送端和电路连接端，其中信号馈送端电连接到第二连接元件，并且电路连接端电连接到无线电路装置。

公开(公告)号：US20070199682A1

公开(公告)日：2007-08-30

申请号：US11307845

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

Abstract translation: 本发明公开了一种散热管的制造方法和结构。 耗散热管包括中空封闭管，柱，一种流体和芯结构。 耗散热管经常用于从芯片传导热量。 散热管可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂在金属表面上，也可以混入金属中。