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45 条记录 (耗时 0.026 秒)

    Chemical vapor deposition apparatus
    42.
    发明授权
    Chemical vapor deposition apparatus 失效
    化学气相沉积装置

    公开(公告)号：US06814813B2

    公开(公告)日：2004-11-09

    申请号：US10132767

    申请日：2002-04-24

    申请人： Ross S. Dando ,  Craig M. Carpenter ,  Philip H. Campbell ,  Allen P. Mardian

    发明人： Ross S. Dando ,  Craig M. Carpenter ,  Philip H. Campbell ,  Allen P. Mardian

    IPC分类号： C23C1600

    CPC分类号： C23C16/45519 ,  C23C16/4401 ,  C23C16/54 ,  Y10S156/914 ,  Y10S414/139

    摘要： A chemical vapor deposition apparatus includes a subatmospheric substrate transfer chamber. A subatmospheric deposition chamber is defined at least in part by a chamber sidewall. A passageway in the chamber sidewall extends from the transfer chamber to the deposition chamber. Semiconductor substrates pass into and out of the deposition chamber through the passageway for deposition processing. A mechanical gate is included within at least one of the deposition chamber and the sidewall passageway, and is configured to open and close at least a portion of the passageway to the chamber. A chamber liner apparatus of a chemical vapor deposition apparatus forms a deposition subchamber within the chamber. At least a portion of the chamber liner apparatus is selectively movable to fully expose and to fully cover the passageway to the chamber.

    摘要翻译： 化学气相沉积设备包括低于大气压的基底传送室。 至少部分地由室侧壁限定低于大气压的沉积室。 腔室侧壁中的通道从传送室延伸到沉积室。 半导体衬底通过用于沉积处理的通道进入和离开沉积室。 机械闸门包括在沉积室和侧壁通道中的至少一个中，并且构造成打开和关闭至腔室的通道的至少一部分。 化学气相沉积设备的腔室衬垫设备在室内形成沉积子室。 腔室衬套装置的至少一部分选择性地可移动以完全暴露并完全覆盖到腔室的通道。

    Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
    43.
    发明授权
    Method of replacing at least a portion of a semiconductor substrate deposition chamber liner 有权
    替换半导体衬底沉积室衬里的至少一部分的方法

    公开(公告)号：US06613587B1

    公开(公告)日：2003-09-02

    申请号：US10121302

    申请日：2002-04-11

    申请人： Craig M. Carpenter ,  Ross S. Dando ,  Philip H. Campbell ,  Allen P. Mardian ,  Gurtej S. Sandhu

    发明人： Craig M. Carpenter ,  Ross S. Dando ,  Philip H. Campbell ,  Allen P. Mardian ,  Gurtej S. Sandhu

    IPC分类号： H01L2100

    CPC分类号： C23C16/54 ,  C23C16/4401

    摘要： A method includes removing at least a piece of a deposition chamber liner from a deposition chamber by passing it through a passageway to the deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing. A replacement for the removed deposition chamber liner piece is provided into the chamber by passing the replacement through said passageway. A liner apparatus includes a plurality of pieces which when assembled within a selected semiconductor substrate deposition processor chamber are configured to restrict at least a majority portion of all internal wall surfaces which define said semiconductor substrate deposition processor chamber from exposure to deposition material within the chamber. At least some of the pieces are sized for passing completely through a substrates passageway to the chamber through which semiconductor substrates pass into and out of the chamber for deposition processing.

    摘要翻译： 一种方法包括通过将沉积室衬套通过通道传送到沉积室，通过半导体衬底通过其进入和离开室进行沉积处理，从沉积室去除至少一块沉积室衬里。 通过使替换通过所述通道，将移除的沉积室衬垫件的替代物提供到腔室中。 衬套装置包括多个片段，当组装在所选择的半导体衬底沉积处理器室中时，其被限定为限定所述半导体衬底沉积处理器室的所有内壁表面的至少大部分部分暴露于腔室内的沉积材料。 至少一些片的尺寸被设计成完全通过衬底通道到半导体衬底通过其进入和离开室以进行沉积处理的室。

    Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
    44.
    发明授权
    Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies 有权
    微电子衬底组件平面化机器和微电子衬底组件的机械和化学机械平面化的方法

    公开(公告)号：US06439967B2

    公开(公告)日：2002-08-27

    申请号：US09145400

    申请日：1998-09-01

    申请人： Craig M. Carpenter

    发明人： Craig M. Carpenter

    IPC分类号： B24B722

    CPC分类号： B24B37/12 ,  B24B13/012 ,  B24B37/20 ,  B24B37/26 ,  B24D9/08

    摘要： A plurality of planarizing machines for microelectronic substrate assemblies, and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies are disclosed. The planarizing machines for processing microelectronic substrate assemblies generally include a table, a pad support assembly either positioned on or in the table, and a planarizing medium coupled to the pad support assembly. The pad support assembly includes a fluid container and an elastic membrane coupled to the fluid container. The fluid container generally is a basin either that is either a separate component that is attached to the table, or a depression in the table itself. The fluid container can also be a bladder attached to the table. The membrane generally has a first surface engaging a portion of the fluid container to define a fluid chamber or cavity, and the membrane has a second surface to which the planarizing medium is attached. The planarizing medium can be a polishing pad attached directly to the second surface of the membrane, or the planarizing medium can be a polishing pad with an under-pad that is attached to the second surface of the membrane. The fluid chamber is filled with support fluid to support the elastic membrane over the fluid chamber. The support fluid can be water, glycerin, air, or other suitable fluids that support the elastic membrane in a manner that allows the membrane and the planarizing medium to freely flex inward into the fluid chamber under the influence of a mechanical force to provide at least a substantially uniform distribution of pressure across the substrate.

    摘要翻译： 公开了用于微电子衬底组件的多个平面化机器，以及微电子衬底组件的机械和化学机械平面化的方法。 用于处理微电子衬底组件的平面化机器通常包括一个桌子，一个定位在桌子上或桌子上的衬垫支撑组件以及耦合到衬垫支撑组件的平面化介质。 垫支撑组件包括流体容器和联接到流体容器的弹性膜。 流体容器通常是盆地，或者是连接到桌子上的单独部件或桌子本身的凹陷部分。 流体容器也可以是附着在桌子上的气囊。 膜通常具有接合流体容器的一部分以限定流体室或空腔的第一表面，并且膜具有附着有平坦化介质的第二表面。 平坦化介质可以是直接附接到膜的第二表面的抛光垫，或者平坦化介质可以是具有附着到膜的第二表面的底垫的抛光垫。 流体室填充有支撑流体以将弹性膜支撑在流体室上。 支撑流体可以是水，甘油，空气或其它合适的流体，其以允许膜和平坦化介质在机械力的影响下自由地向内进入流体室的方式支撑弹性膜，以至少提供 跨过基底的压力基本均匀分布。