摘要:
A fixture for fabricating a full width scanning or imaging array from a plurality of relatively short subunits which provides immunity from vertical misalignment of the subunits caused by particle contamination. This is accomplished by providing a clearance slot in the fixture horizontal reference edge to minimize the reference edge and subunit contact area and to provide a space for the contaminating particles to accumulate so that they will not interfere with the precision placement and vertical alignment of the subunits on the fixture.
摘要:
A "roofshooter" pagewidth printhead for use in a thermal ink jet printing device is fabricated by forming a plurality of subunits, each being produced by bonding a heater substrate having an architecture including an array of heater elements and an etched ink feed slot to a secondary substrate having a series of spaced feed hole openings to form a combined substrate in which said series of spaced feed hole openings communicates with said ink feed slot, and dicing said combined substrates through said ink feed slot to form a subunit. An array of butted subunits having a length equal to one pagewidth is formed by butting one of said subunits against an adjacent subunit. The array of butted subunits is bonded to a pagewidth support substrate. The secondary substrate provides an integral support structure for maintaining the alignment of the heater plate which, if diced through the feed hole without the secondary substrate, would separate into individual pieces, thereby complicating the alignment and assembly process.
摘要:
The vacuum hold down alignment substrate is formed as an array of precisely aligned alignment substrate subunits. Each subunit is formed with an alignment pattern formed in a photo-patternable or electroformable material. When the plurality of alignment substrate subunits are formed into an array to produce the alignment substrate, the alignment patterns are aligned to receive corresponding patterns in discrete subunit devices which are aligned into an array on the alignment substrate.
摘要:
An improved thermal ink jet printhead and method of fabrication thereof is disclosed of the type formed by the mating and bonding of first and second substrates. The first substrate is silicon with {100} crystal plane surfaces and has anisotropically etched in one surface thereof a linear series of separate through recesses and a plurality of parallel, elongated ink channels grooves. The second substrate has a plurality of heating elements and addressing electrodes patterned on one surface thereof. The through recesses serve as a segmented ink reservoir with each segment having an ink inlet, and the elongated ink channel grooves having one end adjacent the segmented reservoir and the opposite end open to serve as ink droplet emitting nozzles. Each segment of the segmented reservoir is isolated from each other by dividing walls. The dividing walls strengthen the printhead, and the separate through recesses reduce the effects of angular misalignment between mask and first substrate crystal planes. In the preferred embodiment, a thick film insulative layer is sandwiched between the first and second substrates and patterned to form recesses therein to provide the means for placing the segmented reservoir into communication with the ink channel grooves. To produce a multicolor printing printhead, the thick film layer is patterned to form a linear series of recesses, each substantially equal in length to an associated one of the reservoir segments, so that each reservoir segment may have a different colored ink supplied thereto that cannot mix with the ink of the other reservoir segments.
摘要:
Relatively small fluid handling devices having a filter bonded on the surface containing the fluid inlets. An example of such a device is a thermal ink jet printhead. A substantially flat filter is placed at the ink inlet to the printhead by a fabrication process which laminates a wafer sized filter to the aligned and bonded wafers containing a plurality of printheads. The individual printheads are obtained by a sectioning operation, which cuts through the two or more bonded wafers and the filter. The filter may be a woven mesh screen or, preferably, an electroformed screen with a predetermined pore size. Since the filter covers one entire side of the printhead, the relatively large contact area prevents delamination and enables convenient leak-free sealing. The filter prevents the entrance of contaminants into the relatively large inlets of the printhead at an early stage of assembly and packaging.
摘要:
A method for separating chips formed on a silicon substrate is provided which uses a combination of reactive ion etching techniques combined with orientation etching to yield integrated chips having edges which can be more precisely butted together to form large area arrays.
摘要:
Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.
摘要:
A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module.
摘要:
The present application is directed to electrostatic actuators, and methods of making electrostatic actuators. In one embodiment, an electrostatic actuator of the present application comprises a first electrode and a second electrode. The second electrode is positioned in proximity to the first electrode so as to provide a gap between the first electrode and the second electrode. The first electrode is capable of being deflected toward the second electrode. A dielectric structure comprising a dielectric landing post is positioned in the gap between the first electrode and the second electrode, the dielectric structure extending over a greater surface of the gap than the landing post. The landing post protrudes out into the gap so as to limit the minimum contact spacing between the first electrode and the second electrode.
摘要:
The present application is directed to electrostatic actuators, and methods of making electrostatic actuators. In one embodiment, an electrostatic actuator of the present application comprises a first electrode and a second electrode. The second electrode is positioned in proximity to the first electrode so as to provide a gap between the first electrode and the second electrode. The first electrode is capable of being deflected toward the second electrode. A dielectric structure comprising a dielectric landing post is positioned in the gap between the first electrode and the second electrode, the dielectric structure extending over a greater surface of the gap than the landing post. The landing post protrudes out into the gap so as to limit the minimum contact spacing between the first electrode and the second electrode.