Buried transistors for silicon on insulator technology
    41.
    发明授权
    Buried transistors for silicon on insulator technology 有权
    埋入晶体管用于绝缘体上硅技术

    公开(公告)号:US07276765B2

    公开(公告)日:2007-10-02

    申请号:US11085018

    申请日:2005-03-21

    IPC分类号: H01L29/72

    摘要: A buried transistor particularly suitable for SOI technology, where the transistor is fabricated within a trench in a substrate and the resulting transistor incorporates completely isolated active areas. The resulting substrate has a decreased topography and there is no need for polysilicon (or other) plugs to connect to the transistor, unless desired. With this invention, better control is achieved in processing, particularly of gate length. The substrate having the buried transistor can be silicon oxide bonded to another substrate to form an SOI structure.

    摘要翻译: 特别适用于SOI技术的埋入式晶体管,其中晶体管制造在衬底中的沟槽内,并且所得晶体管包含完全隔离的有源区。 所得到的衬底具有减小的形貌,除非需要,否则不需要多晶硅(或其它)插头来连接晶体管。 利用本发明,在特别是栅极长度的处理中实现更好的控制。 具有埋入晶体管的衬底可以是氧化硅结合到另一衬底以形成SOI结构。

    Buried transistors for silicon on insulator technology
    43.
    发明授权
    Buried transistors for silicon on insulator technology 有权
    埋入晶体管用于绝缘体上硅技术

    公开(公告)号:US06900500B2

    公开(公告)日:2005-05-31

    申请号:US10224341

    申请日:2002-08-21

    摘要: A buried transistor particularly suitable for SOI technology, where the transistor is fabricated within a trench in a substrate and the resulting transistor incorporates completely isolated active areas. The resulting substrate has a decreased topography and there is no need for polysilicon (or other) plugs to connect to the transistor, unless desired. With this invention, better control is achieved in processing, particularly of gate length. The substrate having the buried transistor can be silicon oxide bonded to another substrate to form an SOI structure.

    摘要翻译: 特别适用于SOI技术的埋入式晶体管,其中晶体管制造在衬底中的沟槽内,并且所得晶体管包含完全隔离的有源区。 所得到的衬底具有减小的形貌,除非需要,否则不需要多晶硅(或其它)插头来连接晶体管。 利用本发明,在特别是栅极长度的处理中实现更好的控制。 具有埋入晶体管的衬底可以是氧化硅结合到另一衬底以形成SOI结构。

    THREE-DIMENSIONAL COLOR IMAGE SENSORS HAVING SPACED-APART MULTI-PIXEL COLOR REGIONS THEREIN
    45.
    发明申请
    THREE-DIMENSIONAL COLOR IMAGE SENSORS HAVING SPACED-APART MULTI-PIXEL COLOR REGIONS THEREIN 审中-公开
    三维彩色图像传感器,其间隔多个像素颜色区域

    公开(公告)号:US20120268566A1

    公开(公告)日:2012-10-25

    申请号:US13450761

    申请日:2012-04-19

    IPC分类号: H04N13/02

    摘要: A three-dimensional color image sensor includes color pixels and depth pixels therein. A semiconductor substrate is provided with a depth region therein, which extends adjacent a surface of the semiconductor substrate. A two-dimensional array of spaced-apart color regions are provided within the depth region. Each of the color regions includes a plurality of different color pixels therein (e.g., red, blue and green pixels) and each of the color pixels within each of the spaced-apart color regions are spaced-apart from all other color pixels within other color regions.

    摘要翻译: 三维彩色图像传感器包括其中的彩色像素和深度像素。 半导体衬底在其中设置有深度区域,其在半导体衬底的表面附近延伸。 在深度区域内设置间隔开的彩色区域的二维阵列。 每个颜色区域在其中包括多个不同的颜色像素(例如,红色,蓝色和绿色像素),并且每个间隔开的颜色区域内的每个彩色像素与其他颜色内的所有其他颜色像素间隔开 地区。

    Buffer layer in flat panel display
    49.
    发明授权
    Buffer layer in flat panel display 有权
    平板显示缓冲层

    公开(公告)号:US07247227B2

    公开(公告)日:2007-07-24

    申请号:US09960912

    申请日:2001-09-21

    IPC分类号: C25D11/04 C23C28/00

    摘要: In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bonding and other fabrication steps. This aluminum oxide barrier layer is preferably formed either by: (1) partially or completely anodizing an aluminum layer formed over the ITO layer, or (2) an in situ process forming aluminum oxide either over the ITO layer or over an aluminum layer formed on the ITO layer. After either of these processes, an aluminum layer is then formed over the aluminum oxide layer.

    摘要翻译: 在诸如平板显示器的器件中,当这样的材料将被接触以保护ITO免受例如在阳极接合和其它制造期间的光学和电学缺陷时,在铝层和ITO层之间提供氧化铝层 脚步。 这种氧化铝阻挡层优选地通过以下方式形成:(1)部分或完全地阳极氧化形成在ITO层上的铝层,或者(2)在ITO层上或在形成在ITO层上的铝层上形成氧化铝的原位工艺 ITO层。 在这些工艺中的任一种之后,然后在氧化铝层上形成铝层。