公开(公告)号：US20070019380A1

公开(公告)日：2007-01-25

申请号：US11184524

申请日：2005-07-19

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth, ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth, ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  F24F13/04 ,  H05K7/20736

摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

公开(公告)号：US20070017658A1

公开(公告)日：2007-01-25

申请号：US11184654

申请日：2005-07-19

申请人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

发明人： Bret Lehman ,  Roger Schmidt ,  Prabjit Singh

IPC分类号： H05K7/20

CPC分类号： H05K7/20254 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49364 ,  Y10T29/49368 ,  Y10T29/49369 ,  Y10T29/49373 ,  Y10T29/49377 ,  Y10T29/49393

摘要： Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.

摘要翻译： 提供冷板装置和制造方法以便于电子部件的冷却。 制造方法包括：形成具有第一金属的管，并且具有设置在其间的传热区域的第一和第二端; 将管的传热区域定位在模具内，并通过使熔融形式的第二金属接触在管上而使管子周围的散热构件铸造，其中第一和第二金属在管道之间进行反应以在管和管之间形成合金层 并且通过冷却熔融的第二金属，在管和散热部件之间形成冶金结合部; 并且控制散热构件的铸造以最小化合金层的厚度，以增强在管和散热构件之间形成的冶金结合的传热特性。

公开(公告)号：US20060250773A1

公开(公告)日：2006-11-09

申请号：US11124064

申请日：2005-05-06

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

公开(公告)号：US20060084374A1

公开(公告)日：2006-04-20

申请号：US10965517

申请日：2004-10-14

申请人： Ethan Cruz ,  Maurice Holahan ,  Roger Schmidt

发明人： Ethan Cruz ,  Maurice Holahan ,  Roger Schmidt

IPC分类号： H05K5/00

CPC分类号： H05K7/2019

摘要： An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device.

公开(公告)号：US20060002088A1

公开(公告)日：2006-01-05

申请号：US10883392

申请日：2004-07-01

申请人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

发明人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

IPC分类号： H05K7/20

CPC分类号： F28F3/04 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

公开(公告)号：US20050248921A1

公开(公告)日：2005-11-10

申请号：US10842594

申请日：2004-05-10

申请人： Roger Schmidt ,  Prabjit Singh

发明人： Roger Schmidt ,  Prabjit Singh

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/16225 ,  H01L2924/09701

摘要： A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.

摘要翻译： 公开了一种用于液体冷却电子设备的方法和装置，而不会湿润电子设备的下侧硬件和与其连接的基板。 在示例性实施例中，电子模块衬底组件包括衬底，电连接到衬底的电子器件和弹性体屏障。 屏障包括被配置为可密封地固定到限定电子设备的芯片边缘的切口。 切口提供流体连通到通过切口暴露的电子设备的后表面，同时屏障将基板从这种流体连通中密封。

公开(公告)号：US20050237716A1

公开(公告)日：2005-10-27

申请号：US10828767

申请日：2004-04-21

申请人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

发明人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20736 ,  H05K7/20745

摘要： An air flow system and method are provided which include a duct configured to mount either as an inlet or outlet duct to an electronics rack. When mounted to cover an air-intake side of the electronics rack, a supply air flow plenum is defined for directing conditioned air to the air-intake side. The duct includes a first air inlet at a first end for receiving the conditioned air, and is tapered from the first end to a second end thereof, with the supply plenum having a varying air flow cross-section. The duct further includes a second air inlet for providing supplemental room air to the plenum. The second inlet is disposed adjacent to the first inlet, thereby facilitating mixing of conditioned air with room air within the supply air flow plenum prior to delivery thereof to the air-intake side of the electronics rack.

摘要翻译： 提供了一种气流系统和方法，其包括被配置为作为入口或出口管道安装到电子机架的管道。 当安装以覆盖电子机架的进气侧时，限定用于将经调节的空气引导到进气侧的供应气流增压室。 管道包括在第一端处用于接收经调节的空气的第一空气入口，并且从第一端至第二端逐渐变细，供气室具有变化的空气流横截面。 导管还包括用于向集气室提供补充室内空气的第二空气入口。 第二入口与第一入口相邻地设置，从而便于将调节后的空气与供给空气流通气室内的室内空气混合，然后将其输送到电子机架的进气侧。

公开(公告)号：US20050068728A1

公开(公告)日：2005-03-31

申请号：US10675628

申请日：2003-09-30

申请人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

发明人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20772 ,  G06F1/20 ,  G06F2200/201

摘要： A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.

摘要翻译： 提供散热组件和方法以及冷却的多抽屉电子机架，其具有第一冷却回路和第二冷却回路。 第一冷却回路基本上设置在电子抽屉内并且定位成从抽屉内的电子模块提取热量。 第一冷却回路还包括第一平面传热表面。 第二冷却回路基本上设置在电子抽屉的外部，并且包括第二平面传热表面。 当电子抽屉处于电子机架中的对接位置时，偏置机构将第一平面传热表面和第二传热表面机械地迫使第二传热表面共面，以便于将热量从第一冷却回路传递到第二冷却回路。

公开(公告)号：US20140030439A1

公开(公告)日：2014-01-30

申请号：US14007707

申请日：2012-04-05

申请人： Roger Schmidt

发明人： Roger Schmidt

IPC分类号： B05B15/12

CPC分类号： B05B15/1288 ,  B05B13/0221 ,  B05B13/0431 ,  B05B13/0447 ,  B05B16/90

摘要： A treatment unit for the surface treatment of articles having at least one treatment chamber and a conveying system which conveys articles to be treated into the treatment chamber, along a conveying path through the treatment chamber and back out of the treatment chamber. Each article in each position on the conveying path prescribes a conveying direction tangential to the conveying path. An application system includes at least one multiaxis application robot, which takes along with it an application device and moves along a robot path of movement. The conveying system and the application system are set up such that the at least one application robot moves in relation to the conveying direction of an article optionally with a movement component parallel to the conveying direction of the article and/or a movement component perpendicular to the conveying direction of the article. Also, an installation and a method for the surface treatment of articles.

摘要翻译： 用于表面处理具有至少一个处理室和输送系统的处理单元，该处理室沿着经由处理室的输送路径返回到处理室内并将待处理的物品输送到处理室中。 在输送路径上的每个位置上的每个物品规定与输送路径相切的输送方向。 一种应用系统包括至少一个多轴应用机器人，其与其一起应用应用设备并沿着机器人运动路径移动。 输送系统和应用系统被设置成使得至少一个应用机器人相对于物品的输送方向移动，任选地具有平行于物品的输送方向的移动部件和/或垂直于物品的运动部件 输送物品的方向。 另外，用于表面处理物品的安装和方法。

公开(公告)号：US08023818B2

公开(公告)日：2011-09-20

申请号：US12179192

申请日：2008-07-24

申请人： Roger Schmidt ,  Michael Stuart

发明人： Roger Schmidt ,  Michael Stuart

IPC分类号： G03B17/48

CPC分类号： G02B7/22 ,  G02B7/24

摘要： An articulating infrared window to be installed into a panel of a cabinet is disclosed. The window includes a window housing and an infrared transparent pane. The infrared transparent pane is installed within the window housing. Embodiments of the window housing can include various articulation mechanisms including individually or in combination a double gimbal assembly, a single gimbal and rotary stage, a ball and socket joint, and an extension joint (such as a bellows) for articulating the infrared transparent pane.

摘要翻译： 公开了一种安装在机柜面板上的铰接式红外线窗。 窗户包括一个窗户外壳和红外透明窗格。 红外透明窗格安装在窗户外壳内。 窗户壳体的实施例可以包括各种铰接机构，其包括单个或组合的双重万向架组件，单个万向节和旋转台，球窝接头以及用于铰接红外线透明板的延伸接头（例如波纹管）。