摘要:
A method and device for pattern alignment are disclosed. The device can include an exposure field; a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region; and a die alignment mark disposed between the seal ring region and the corner stress relief region.
摘要:
A device includes a test unit in a die. The test unit includes a physical test region including an active region, and a plurality of conductive lines over the active region and parallel to each other. The plurality of conductive lines has substantially a uniform spacing, wherein no contact plugs are directly over and connected to the plurality of conductive lines. The test unit further includes an electrical test region including a transistor having a gate formed of a same material, and at a same level, as the plurality of conductive lines; and contact plugs connected to a source, a drain, and the gate of the transistor. The test unit further includes an alignment mark adjacent the physical test region and the electrical test region.
摘要:
A package structure includes: a substrate having a plurality of first conductive pads and a plurality of second conductive pads; an MEMS element disposed on the substrate; a cover member disposed on the MEMS element and having a metal layer formed thereon; a plurality of bonding wires electrically connected to the MEMS element and the second conductive pads of the substrate; a plurality of first wire segments, each having one end electrically connected to a corresponding one of the first conductive pads; and an encapsulant formed on the substrate and encapsulating the MEMS element, the cover member, the first wire segments and the bonding wires, wherein the other end of each of the first wire segments is exposed from the encapsulant. Compared with the prior art, the package structure of the present invention has improved overall yield and functionality.
摘要:
A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.
摘要:
A solar cell includes a substrate, a conductor layer and an anti-reflection coating (ARC) layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer has first and second exposed surfaces, first and second side surfaces and a bottom surface. The first side surface is connected to the first and second exposed surfaces. The second side surface is connected to the second exposed surface and the bottom surface disposed on the front side. The second portion is disposed in the ARC layer. The conductor layer has an exposed surface, which is exposed out of the ARC layer, and higher than the second exposed surface and substantially flush with an exposed surface of the ARC layer.
摘要:
A device includes a test unit in a die. The test unit includes a physical test region including an active region, and a plurality of conductive lines over the active region and parallel to each other. The plurality of conductive lines has substantially a uniform spacing, wherein no contact plugs are directly over and connected to the plurality of conductive lines. The test unit further includes an electrical test region including a transistor having a gate formed of a same material, and at a same level, as the plurality of conductive lines; and contact plugs connected to a source, a drain, and the gate of the transistor. The test unit further includes an alignment mark adjacent the physical test region and the electrical test region.
摘要:
Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value.
摘要:
A method for manufacturing an anti-reflection structure is provided. The method includes the following steps: First, a to-be-treated object is provided in a reactive area. Next, a plasma source is provided in the reactive area. Then, the plasma source is ionized to form plasma in atmospheric pressure. Next, the surface of the to-be-treated object is treated by plasma so as to form a plurality of micro-protuberances on the surface of the to-be-treated object.
摘要:
Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack.
摘要:
System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner including a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method includes providing a water tank that connects to at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level.