NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    41.
    发明申请
    NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非挥发性半导体存储器件及其制造方法

    公开(公告)号:US20090230458A1

    公开(公告)日:2009-09-17

    申请号:US12392636

    申请日:2009-02-25

    IPC分类号: H01L29/792 H01L21/28

    摘要: A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a columnar semiconductor layer extending in a direction perpendicular to a substrate; a plurality of conductive layers formed at a sidewall of the columnar semiconductor layer via memory layers; and interlayer insulation layers formed above of below the conductive layers. A sidewall of the conductive layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes larger at lower position thereof than at upper position thereof. While, a sidewall of the interlayer insulation layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes smaller at lower position thereof than at upper position thereof.

    摘要翻译: 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括:在垂直于衬底的方向上延伸的柱状半导体层; 多个导电层,经由存储层形成在所述柱状半导体层的侧壁处; 以及形成在导电层下方的层间绝缘层。 形成面向柱状半导体层的导电层的侧壁,使得其与柱状半导体层的中心轴的距离在其下部位置比在其上部位置变大。 同时,面对柱状半导体层的层间绝缘层的侧壁形成为倾斜,使得其在柱状半导体层的中心轴线处的距离在其下部位置处比在其上部位置变小。

    Memory system, semiconductor memory device and method of driving same
    43.
    发明授权
    Memory system, semiconductor memory device and method of driving same 有权
    存储器系统,半导体存储器件及其驱动方法

    公开(公告)号:US07558141B2

    公开(公告)日:2009-07-07

    申请号:US11955900

    申请日:2007-12-13

    IPC分类号: G11C7/14

    摘要: A semiconductor memory device has a semiconductor substrate, first select transistors formed on the surface of said semiconductor substrate, first dummy transistors formed above said first select transistors, a plurality of memory cell transistors formed above said first dummy transistors so as to extend in a direction perpendicular to the surface of said semiconductor substrate, each of said memory cell transistor including an insulating layer having a charge-accumulating function, second dummy transistors formed above said memory cell transistors, and second select transistors formed above said second dummy transistors; wherein a first potential is provided to the gate electrodes of said first select transistors and the gate electrodes of said first dummy transistors and a second potential is provided to the gate electrodes of said second select transistors and the gate electrodes of said second dummy transistors at the time of write operation to write data to said memory cell transistors.

    摘要翻译: 半导体存储器件具有半导体衬底,形成在所述半导体衬底的表面上的第一选择晶体管,形成在所述第一选择晶体管上方的第一虚拟晶体管,形成在所述第一虚拟晶体管上方的多个存储单元晶体管, 垂直于所述半导体衬底的表面,每个所述存储单元晶体管包括具有电荷累积功能的绝缘层,形成在所述存储单元晶体管上方的第二虚拟晶体管以及形成在所述第二虚设晶体管上方的第二选择晶体管; 其中第一电位被提供给所述第一选择晶体管的栅电极和所述第一虚拟晶体管的栅电极,并且第二电位被提供给所述第二选择晶体管的栅电极和所述第二虚晶体管的栅电极 写入操作的时间将数据写入到所述存储单元晶体管。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR MEMORY DEVICE
    44.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR MEMORY DEVICE 有权
    用于制造半导体存储器件的半导体存储器件和方法

    公开(公告)号:US20090146190A1

    公开(公告)日:2009-06-11

    申请号:US12325711

    申请日:2008-12-01

    IPC分类号: H01L27/115 H01L21/8247

    摘要: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device, comprising a plurality of memory strings, each of the memory strings being constituted with a plurality of electrically erasable memory cells being serially connected each other, the memory strings comprising: a columnar semiconductor layer perpendicularly extending toward a substrate; a plurality of conductive layers being formed in parallel to the substrate and including a first space between a sidewall of the columnar semiconductor layers; and characteristic change layer being formed on the sidewall of the columnar semiconductor layer faced to the first space or a sidewall of the conductive layer faced to the first space and changing characteristics accompanying with applied voltage; wherein the plurality of the conductive layers have a function of a relative movement to a prescribed direction for the columnar semiconductor layer.

    摘要翻译: 根据本发明的一个方面,提供了一种非易失性半导体存储器件,包括多个存储器串,每个存储器串由多个电可擦除存储器单元组成,所述多个电可擦除存储器单元串联连接,所述存储器串包括 :向衬底垂直延伸的柱状半导体层; 多个导电层平行于衬底形成并且包括柱状半导体层的侧壁之间的第一空间; 并且特征变化层形成在面向面向第一空间的导电层的第一空间或侧壁的柱状半导体层的侧壁上,并且伴随施加电压的变化特性; 其中所述多个所述导电层具有对于所述柱状半导体层相对于规定方向的相对移动的功能。

    Non-volatile semiconductor storage device and method of manufacturing the same
    46.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08237211B2

    公开(公告)日:2012-08-07

    申请号:US12556242

    申请日:2009-09-09

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor storage device has a memory string including a plurality of electrically rewritable memory cells connected in series. The non-volatile semiconductor storage device also has a protruding layer formed to protrude upward with respect to a substrate. The memory string includes: a plurality of first conductive layers laminated on the substrate; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and an electric charge storage layer formed between the first conductive layers and the first semiconductor layer, and configured to be able to store electric charges. Each of the plurality of first conductive layers includes: a bottom portion extending in parallel to the substrate; and a side portion extending upward with respect to the substrate along the protruding layer at the bottom portion. The protruding layer has a width in a first direction parallel to the substrate that is less than or equal to its length in a lamination direction.

    摘要翻译: 非易失性半导体存储装置具有串联连接的多个电可重写存储单元的存储串。 非挥发性半导体存储装置还具有形成为相对于基板向上突出的突出层。 存储器串包括:层叠在基板上的多个第一导电层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷存储层,并且能够存储电荷。 多个第一导电层中的每一个包括:平行于基板延伸的底部; 以及沿底部的突出层相对于基板向上延伸的侧部。 该突出层在平行于基板的第一方向上的宽度小于或等于其在层叠方向上的长度。

    Semiconductor device and method of manufacturing the same
    48.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US07768063B2

    公开(公告)日:2010-08-03

    申请号:US12248577

    申请日:2008-10-09

    IPC分类号: H01L29/94

    摘要: A semiconductor device comprising: a semiconductor substrate; a first conductive layer provided on a surface of the substrate and serving as one of a source and a drain; a first insulating film provided on the first conductive layer; a gate electrode film provided on the first insulating film; a second insulating film provided on the gate electrode film; a gate opening provided so as to penetrate the second insulating film, the gate electrode film and the first insulating film to expose a part of the first conductive layer; a recess provided in the surface of the first conductive layer just below the gate opening; a gate insulator provided on the side surface of the gate opening and having a projecting shape at a portion between the first insulating film and the recess; a second conductive layer buried in the recess and in a bottom of the gate opening so as to be in contact with the gate insulator.

    摘要翻译: 一种半导体器件,包括:半导体衬底; 设置在所述基板的表面上并用作源极和漏极之一的第一导电层; 设置在所述第一导电层上的第一绝缘膜; 设置在所述第一绝缘膜上的栅电极膜; 设置在栅电极膜上的第二绝缘膜; 设置为穿透第二绝缘膜的栅极开口,栅极电极膜和第一绝缘膜,以暴露第一导电层的一部分; 设置在所述第一导电层的位于所述栅极开口正下方的表面中的凹部; 栅极绝缘体,其设置在所述栅极开口的侧表面上,并且在所述第一绝缘膜和所述凹部之间的部分处具有突出形状; 第二导电层,其埋在所述凹部中并位于所述栅极开口的底部,以与所述栅极绝缘体接触。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    49.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号:US20100013049A1

    公开(公告)日:2010-01-21

    申请号:US12504959

    申请日:2009-07-17

    摘要: A first multilayer body is formed by alternately layering dielectric films and electrode films on a substrate. Then, an end portion of the first multilayer body is processed into a staircase shape, and a first interlayer dielectric film is formed around the first multilayer body. Next, a plurality of contact holes having a diameter decreasing downward are formed in the first interlayer dielectric film so that the contact holes reach respective end portions of the electrode films. Then, a sacrificial material is buried in the contact holes. Next, a second multilayer body is formed immediately above the first multilayer body, and a second interlayer dielectric film is formed around the second multilayer body. Thereafter, a plurality of contact holes having a diameter decreasing downward are formed in the second interlayer dielectric film to communicate with the respective contact holes formed in the first interlayer dielectric film. Then, the sacrificial material is removed and a contact is buried inside the contact holes. The contact has a step difference.

    摘要翻译: 通过在基板上交替层叠电介质膜和电极膜来形成第一多层体。 然后,将第一多层体的端部加工成阶梯状,在第一层叠体的周围形成第一层间绝缘膜。 接下来,在第一层间电介质膜中形成直径减小的多个接触孔,使得接触孔到达电极膜的各个端部。 然后,牺牲材料被埋在接触孔中。 接着,在第一多层体的正上方形成第二层叠体,在第二层叠体的周围形成第二层间绝缘膜。 此后,在第二层间电介质膜中形成直径减小的多个接触孔,与形成在第一层间绝缘膜中的各接触孔连通。 然后,去除牺牲材料并将接触件埋在接触孔内。 联系人有差异。