中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

129 records (took 0.019 seconds)

    Separate control of coolant flow through coolant circuits
    41.
    发明授权
    Separate control of coolant flow through coolant circuits 有权
    通过冷却剂回路分离冷却剂流量

    公开(公告)号：US09148983B2

    公开(公告)日：2015-09-29

    申请号：US13781993

    申请日：2013-03-01

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G06F19/00 ,  H05K7/20 ,  G05D23/19 ,  G06F1/20

    CPC classification number: H05K7/2079 ,  G05D23/1934 ,  G06F1/206 ,  H05K7/20836

    Abstract: Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

    Abstract translation: 提供了用于自动冷却剂流控制的方法，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

    Wicking and coupling element(s) facilitating evaporative cooling of component(s)
    42.
    发明授权
    Wicking and coupling element(s) facilitating evaporative cooling of component(s) 有权
    促进部件蒸发冷却的芯吸和耦合元件

    公开(公告)号：US09095942B2

    公开(公告)日：2015-08-04

    申请号：US13627256

    申请日：2012-09-26

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: B23P15/26 ,  H05K7/203 ,  H05K7/20336 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49396

    Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

    Abstract translation: 提供冷却装置和方法以便于电子系统的电子部件的冷却。 冷却装置包括至少部分地围绕和形成围绕部件的隔室的壳体，并且浸入冷却流体设置在隔间内。 电子系统的至少一个部件至少部分地非浸没在隔室中的流体内。 芯吸膜元件物理耦合到至少一个部件的主表面并且部分地设置在隔室内的流体内。 耦合元件将芯吸膜元件物理地耦合到至少一个部件的主表面，而没有覆盖部件主表面的耦合元件。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

    Inlet-air-cooling door assembly for an electronics rack
    43.
    发明授权
    Inlet-air-cooling door assembly for an electronics rack 有权
    用于电子机架的入口 - 空气冷却门组件

    公开(公告)号：US09025332B2

    公开(公告)日：2015-05-05

    申请号：US13782020

    申请日：2013-03-01

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Daniel E. Zambrano

    IPC: H05K7/20 ,  F28D15/00 ,  F28F9/00

    CPC classification number: F28D15/00 ,  F28F9/00 ,  H05K7/2079 ,  H05K7/20827

    Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

    Abstract translation: 提供了一种方法，其包括提供用于电子机架的冷却装置，其包括构造成耦合到电子机架的空气入口侧的门组件。 门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。 气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布 的架子。

    Dry-cooling unit with gravity-assisted coolant flow
    44.
    发明授权
    Dry-cooling unit with gravity-assisted coolant flow 有权
    具有重力辅助冷却剂流的干冷单元

    公开(公告)号：US09013872B2

    公开(公告)日：2015-04-21

    申请号：US13692235

    申请日：2012-12-03

    Applicant: International Business Machines Corporation ,  Kevin P. Radigan

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC: F28F9/00 ,  F25B1/00 ,  H05K7/20

    CPC classification number: F28F9/00 ,  F25B1/00 ,  H05K7/20772 ,  H05K7/2079 ,  Y10T29/4935

    Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

    Abstract translation: 提供了一种制造冷却单元的方法，以便冷却通过冷却剂回路的冷却剂。 冷却单元包括一个或多个散热单元和升高的冷却剂箱。 散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。 散热单元包括联接到冷却剂回路的一个或多个热交换组件，用于至少一部分冷却剂通过一个或多个热交换组件。 在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接，并且便于冷却剂返回到冷却剂回路 基本恒定的压力。

    Effectiveness-weighted control of cooling system components
    48.
    发明授权
    Effectiveness-weighted control of cooling system components 有权

    公开(公告)号：US10595447B2

    公开(公告)日：2020-03-17

    申请号：US16005823

    申请日：2018-06-12

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G05D23/00 ,  H05K7/20 ,  G05D23/19 ,  G05B15/02

    Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

    Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
    50.
    发明授权
    Drawer-level immersion-cooling with hinged, liquid-cooled heat sink 有权

    公开(公告)号：US10070560B2

    公开(公告)日：2018-09-04

    申请号：US15175331

    申请日：2016-06-07

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20

    Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

Patent Agency Ranking