公开(公告)号：US09735077B1

公开(公告)日：2017-08-15

申请号：US15333832

申请日：2016-10-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Li-Wen Hung ,  Wanki Kim ,  John U. Knickerbocker ,  Kenneth P. Rodbell ,  Robert L. Wisnieff

IPC: H01L23/31 ,  H01L25/00 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L21/312 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065

CPC classification number: G06F17/5027 ,  G06F15/7803 ,  G06F15/7807 ,  G06F15/7857 ,  G06F15/803 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0655 ,  H01L25/071 ,  H01L25/112 ,  H01L25/115 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/08225 ,  H01L2224/11002 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/80006 ,  H01L2224/81005 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.