公开(公告)号：US20220181536A1

公开(公告)日：2022-06-09

申请号：US17116125

申请日：2020-12-09

Applicant: International Business Machines Corporation

Inventor： Ryan T. Gordon ,  Kenneth P. Rodbell ,  Robert L. Sandstrom ,  Jeffrey W. Sleight

IPC: H01L39/22 ,  H01L39/12 ,  H01L39/24

Abstract: Techniques regarding qubit structures comprising ion implanted Josephson junctions are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a strip of superconducting material coupling a first superconducting electrode and a second superconducting electrode. The strip of superconducting material can have a first region comprising an ion implant and a second region that is free from the ion implant.

公开(公告)号：US20220123195A1

公开(公告)日：2022-04-21

申请号：US17071528

申请日：2020-10-15

Applicant: International Business Machines Corporation

Inventor： Vivekananda P. Adiga ,  Martin S. Sandberg ,  Jeng-Bang Yau ,  David L. Rath ,  John Bruley ,  Cihan Kurter ,  Kenneth P. Rodbell ,  Hongwen Yan

IPC: H01L39/24 ,  H01L39/02 ,  H01L39/08

Abstract: Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.

公开(公告)号：US10535713B2

公开(公告)日：2020-01-14

申请号：US14871030

申请日：2015-09-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew J. BrightSky ,  Cyril Cabral, Jr. ,  Kenneth P. Rodbell

IPC: H01L27/24 ,  H01L45/00 ,  G11C13/00

Abstract: A reactive material erasure element including a reactive material is located between PCM cells and is in close proximity to the PCM cells. The reaction of the reactive material is trigger by a current applied by a bottom electrode which has a small contact area with the reactive material erasure element, thereby providing a high current density in the reactive material erasure element to ignite the reaction of the reactive material. Due to the close proximity of the PCM cells and the reactive material erasure element, the heat generated from the reaction of the reactive material can be effectively directed to the PCM cells to cause phase transformation of phase change material elements in the PCM cells, which in turn erases data stored in the PCM cells.

公开(公告)号：US10388615B2

公开(公告)日：2019-08-20

申请号：US15800643

申请日：2017-11-01

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, Jr. ,  Gregory M. Fritz ,  Conal E. Murray ,  Kenneth P. Rodbell

IPC: H01L23/06 ,  H01L23/00 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/04 ,  H01L23/34 ,  H01L23/525 ,  H01L25/16

Abstract: Embodiments of the present invention provide integrated circuits and methods for activating reactions in integrated circuits. In one embodiment, an integrated circuit is provided having reactive material capable of being activated by electrical discharge, without requiring a battery or similar external power source, to produce an exothermic reaction that erases and/or destroys one or more semiconductor devices on the integrated circuit.

公开(公告)号：US10257924B2

公开(公告)日：2019-04-09

申请号：US15831534

申请日：2017-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Silvio Dragone ,  Michael J. Fisher ,  Michael A. Gaynes ,  David C. Long ,  Kenneth P. Rodbell ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G06F21/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  G06F21/87

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.

公开(公告)号：US20190096757A1

公开(公告)日：2019-03-28

申请号：US16201448

申请日：2018-11-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert L. Bruce ,  Cyril Cabral, JR. ,  Gregory M. Fritz ,  Eric A. Joseph ,  Michael F. Lofaro ,  Hiroyuki Miyazoe ,  Kenneth P. Rodbell ,  Ghavam Shahidi

IPC: H01L21/768

CPC classification number: H01L21/76885 ,  H01L21/76852 ,  H01L21/76897 ,  H01L23/5226 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure relates to integrated circuits and to methods of manufacturing interconnects of integrated circuits. For example, an integrated circuit includes a surface of the integrated circuit and an interconnect formed on the surface and comprising a metal. An average grain size of the metal of the interconnect is greater than or equal to at least half of a line width of the interconnect. In another example, a method for manufacturing an interconnect of an integrated circuit includes depositing a layer of a metal onto a surface of the integrated circuit, annealing the metal, patterning a first hard mask for placement over the metal and forming a line of the interconnect and a first via of the interconnect by performing a timed etch of the metal using the first hard mask.

公开(公告)号：US10177102B2

公开(公告)日：2019-01-08

申请号：US15831554

申请日：2017-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Silvio Dragone ,  Michael A. Gaynes ,  Kenneth P. Rodbell ,  William Santiago-Fernandez

IPC: G01R31/02 ,  H01L23/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H01L23/053 ,  H01L23/08 ,  H01L21/48 ,  G06F21/87

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).

公开(公告)号：US20180203045A1

公开(公告)日：2018-07-19

申请号：US15408075

申请日：2017-01-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew W. Copel ,  Michael S. Gordon ,  Kenneth P. Rodbell

IPC: G01R19/00 ,  G01R29/24

Abstract: An apparatus and method for measuring flux, current, or integrated charge of a beam are provided. The apparatus and method include a cup on which the beam is incident. The cup includes an inner cylinder, a coaxial cylinder, and an aperture. The coaxial cylinder surrounds the inner cylinder and is electrically insulated therefrom. An offset current source is in electrical communication with the inner cylinder. An electrometer, a charge integrator, or a counter may be electrically connected to the cup and the offset current source. When the beam is incident on the cup and aligned with the aperture, the electrometer can measure the beam current and the charge integrator can measure the integrated charge of the beam.

公开(公告)号：US20180079683A1

公开(公告)日：2018-03-22

申请号：US15824102

申请日：2017-11-28

Applicant: International Business Machines Corporation

Inventor： Qiang Huang ,  Kenneth P. Rodbell ,  Asli Sahin

IPC: C03C21/00 ,  C03C3/00

CPC classification number: C03C21/002 ,  C03C3/00

Abstract: In one aspect, a method for use in preparing a glass includes performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt. In another aspect, a glass is prepared at least in part by performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt.

公开(公告)号：US20170204002A1

公开(公告)日：2017-07-20

申请号：US15002359

申请日：2016-01-20

Applicant: International Business Machines Corporation

Inventor： Qiang Huang ,  Kenneth P. Rodbell ,  Asli Sahin

IPC: C03C21/00 ,  C03C3/00

CPC classification number: C03C21/002 ,  C03C3/00

Abstract: In one aspect, a method for use in preparing a glass includes performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt. In another aspect, a glass is prepared at least in part by performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt.