公开(公告)号：US20220215794A1

公开(公告)日：2022-07-07

申请号：US17543218

申请日：2021-12-06

Applicant: InnoLux Corporation

Inventor： Yi-Hua HSU ,  Ker-Yih KAO ,  Ming-Chun TSENG ,  Mu-Fan CHANG ,  Wen-Lin HUANG

IPC: G09G3/32

Abstract: A light emitting device of the present disclosure includes: a circuit board; a plurality of substrates including a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board, and the second substrate is disposed on the circuit board and overlapped with the first substrate; a plurality of light emitting units disposed on the first substrate; a plurality of pixel driving circuits electrically connected to the plurality of light emitting units; and a plurality of gate driving circuits electrically connected to the plurality of pixel driving circuits, wherein at least a part of the plurality of pixel driving circuits or at least a part of the plurality of gate driving circuits are disposed on the second substrate.

公开(公告)号：US20210176861A1

公开(公告)日：2021-06-10

申请号：US17154599

申请日：2021-01-21

Applicant: InnoLux Corporation

Inventor： Po-Yun HSU ,  Ker-Yih KAO ,  Chia-Ping TSENG

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/05

Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.

公开(公告)号：US20190325813A1

公开(公告)日：2019-10-24

申请号：US16355961

申请日：2019-03-18

Applicant: InnoLux Corporation

Inventor： Min-Hsin LO ,  Ker-Yih KAO ,  Cheng-Hsu CHOU ,  Kung-Chen KUO ,  Hung-Sheng LIAO

IPC: G09G3/32 ,  H01L27/12

Abstract: A display device includes a pixel array, multiple data lines and multiple gate lines. The pixel array includes multiple pixels. At least one of the pixels includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a pixel circuit, which includes a first light-emitting element and a first driving circuit. The first driving circuit is coupled to and configured to control the first light-emitting element. The first driving circuit includes multiple TFTs. The second sub-pixel includes a pixel circuit, which includes a second light-emitting element and a second driving circuit. The second driving circuit is coupled to and configured to control the second light-emitting element. The second driving circuit includes multiple TFTs. The number of TFTs of the first driving circuit and the number of TFTs of the second driving circuit are different.

公开(公告)号：US20140374750A1

公开(公告)日：2014-12-25

申请号：US14478148

申请日：2014-09-05

Applicant: InnoLux Corporation

Inventor： Hsin-Hung LIN ,  Jung-Fang CHANG ,  Ker-Yih KAO

IPC: H01L27/12 ,  H01L23/31 ,  H01L29/51 ,  H01L23/48 ,  H01L29/786 ,  H01L29/417

CPC classification number: H01L27/1225 ,  H01L21/441 ,  H01L21/47 ,  H01L21/471 ,  H01L21/47573 ,  H01L23/3171 ,  H01L23/481 ,  H01L27/1259 ,  H01L29/41733 ,  H01L29/41775 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/7869 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor.

公开(公告)号：US20250132272A1

公开(公告)日：2025-04-24

申请号：US18888462

申请日：2024-09-18

Applicant: InnoLux Corporation

Inventor： Jui-Jen YUEH ,  Wei-Yuan CHENG ,  Ker-Yih KAO

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

Abstract: An electronic device is provided. The electronic device includes a protective layer, a chip disposed on the protective layer, a first connector electrically connected to the chip, and an antenna unit disposed on the first connector and electrically connected to the chip. The antenna unit includes a pattern layer and a covering layer disposed on the pattern layer. The pattern layer includes a first surface and the covering layer includes a second surface. The first surface is rougher than the second surface.

公开(公告)号：US20240237293A1

公开(公告)日：2024-07-11

申请号：US18534706

申请日：2023-12-10

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Chung-Jyh LIN ,  Chin-Ming HUANG ,  Chien-Lin LAI ,  Kuo-Sheng YEH

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  H05K7/20218

Abstract: An electronic device is provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have rounded-corner structures.

公开(公告)号：US20240237195A1

公开(公告)日：2024-07-11

申请号：US18534734

申请日：2023-12-11

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Chung-Jyh LIN ,  Chin-Ming HUANG ,  Chien-Lin LAI

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0272 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2203/025

Abstract: An electronic device and a manufacturing method of the electronic device are provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have monocrystal structures.

公开(公告)号：US20230252937A1

公开(公告)日：2023-08-10

申请号：US18131135

申请日：2023-04-05

Applicant: InnoLux Corporation

Inventor： Yi-Hua HSU ,  Ker-Yih KAO ,  Ming-Chun TSENG ,  Mu-Fan CHANG ,  Wen-Lin HUANG

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: An electronic device includes: a circuit board; a plurality of diodes disposed on a first surface of the circuit board; a plurality of first driving circuits disposed on the first surface of the circuit board and electrically connected to the plurality of diodes; and a plurality of second driving circuits electrically connected to the plurality of first driving circuits, wherein a part of the plurality of second driving circuits are disposed on a first substrate, and another part of the second driving circuits are disposed on a second substrate.

公开(公告)号：US20230089751A1

公开(公告)日：2023-03-23

申请号：US17736067

申请日：2022-05-03

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Hung-I TSENG

IPC: H01L23/538 ,  H01L21/48

Abstract: An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is disposed between the second metal layer and the first insulating layer. The second metal layer is electrically connected to the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer.

公开(公告)号：US20210193790A1

公开(公告)日：2021-06-24

申请号：US17119841

申请日：2020-12-11

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Chin-Lung TING ,  Li-Wei MAO ,  Ming-Chun TSENG ,  Kung-Chen KUO ,  Yi-Hua HSU ,  Ker-Yih KAO

IPC: H01L27/32 ,  G09G3/00 ,  G09F9/302 ,  H01L51/00 ,  H01L51/52

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface and a bottom surface. A top circuit is disposed on the top surface. A bottom circuit is disposed on the bottom surface and electrically connected to the top circuit. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The driver is disposed on the bottom surface of the circuit substrate and electrically connected to the bottom circuit.