公开(公告)号：US09454059B1

公开(公告)日：2016-09-27

申请号：US14472193

申请日：2014-08-28

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan

IPC: G02F1/225 ,  G02F1/025 ,  G02F1/21 ,  G02F1/015

CPC classification number: G02F1/0121 ,  G02F1/0123 ,  G02F1/025 ,  G02F1/225 ,  G02F1/2255 ,  G02F1/2257 ,  G02F2001/0154 ,  G02F2001/212 ,  H04B10/25 ,  H04B10/505 ,  H04L7/0075

Abstract: The present invention includes a linear driver for Mach-Zehnder modulator (MZM) configured in a differential form with two waveguides carrying two traveling waves. Each waveguide comprises a MZM material configured with either a single segment in 3×MZM length or two split segments with one in 2×MZM length and another one in either 1× or 2×MZM length. By coupling a DC current source supplied with a modulation voltage with each segment thereof for providing electrical modulation signal overlapping with each of the two traveling waves. The modulated traveling waves in the two waveguides then are combined in one output signal by a multimode interference coupler. By properly choosing the configuration of MZM linear segments with optional length ratios, a low power consumption MZM linear driver provides either NRZ or PAM-4 modulation scheme to the input optical signals for telecommunication through silicon photonics.

Abstract translation: 本发明包括一种以差分形式配置的马赫曾德尔调制器（MZM）的线性驱动器，其具有两个携带两个行波的波导。 每个波导包括配置有3×MZM长度的单个段或具有2×MZM长度的2个分割段的MZM材料，以及1×或2×MZM长度的另一个。 通过将提供有调制电压的DC电流源与其每个段耦合以提供与两个行波中的每一个重叠的电调制信号。 然后，两个波导中的调制行波由多模干涉耦合器组合在一个输出信号中。 通过适当选择具有可选长度比的MZM线性段的配置，低功耗MZM线性驱动器为通过硅光子学的电信输入光信号提供NRZ或PAM-4调制方案。

公开(公告)号：US09374173B2

公开(公告)日：2016-06-21

申请号：US14815824

申请日：2015-07-31

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan

IPC: H04B10/04 ,  H04B10/70 ,  H04B10/079 ,  H04J14/02

CPC classification number: H04B10/40 ,  H01S5/0261 ,  H01S5/0427 ,  H03L7/0807 ,  H03L2207/50 ,  H04B10/07955 ,  H04B10/541 ,  H04B10/5561 ,  H04B10/70 ,  H04B10/801 ,  H04J14/0221 ,  H04L49/109

Abstract: In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. The device also has an interface configured to communicate between the silicon photonics device and the control block.

公开(公告)号：US11888286B2

公开(公告)日：2024-01-30

申请号：US17076162

申请日：2020-10-21

Applicant: INPHI CORPORATION

Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan

IPC: H01S5/02 ,  H01S5/0238 ,  H01S5/028 ,  H01S5/0237 ,  H01S5/227 ,  H01S5/22 ,  H01S5/0234

CPC classification number: H01S5/0238 ,  H01S5/0202 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/0287 ,  H01S5/2206 ,  H01S5/2275

Abstract: A laser chip for flip-chip bonding on a silicon photonics chip with passive alignment features. The laser chip includes a chip body made of a p-region and a n-region in vertical direction and extended from a front facet to a rear facet in longitudinal direction, a pair of first vertical stoppers formed respectively beyond two sides of the chip body based on a wider width of the n-region, an active region buried in the chip body between the p-region and the n-region in the vertical direction and extended from the front facet to the rear facet in the longitudinal direction, an alignment mark formed on a top surface of the p-region near the front facet with a lateral distance defined in sub-micron precision relative to the active region; and a thin metal film on the surface of the p-region having a cleaved edge shared with the front facet.

公开(公告)号：US11728619B2

公开(公告)日：2023-08-15

申请号：US16922622

申请日：2020-07-07

Applicant: INPHI CORPORATION

Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan

IPC: H01S5/028 ,  H01S5/02 ,  H01S5/026 ,  H01S5/14 ,  H01S5/20 ,  H01S5/343 ,  H01S5/227 ,  H01S5/065 ,  H01S5/06 ,  H01S5/50 ,  H01S5/10 ,  H01S5/00

CPC classification number: H01S5/0287 ,  H01S5/021 ,  H01S5/026 ,  H01S5/142 ,  H01S5/2022 ,  H01S5/0078 ,  H01S5/0218 ,  H01S5/0612 ,  H01S5/0654 ,  H01S5/1085 ,  H01S5/227 ,  H01S5/34306 ,  H01S5/50

Abstract: A method for improving wide-band wavelength-tunable laser. The method includes configuring a gain region between a first facet and a second facet and crosswise a PN-junction with an active layer between P-type cladding layer and N-type cladding layer. The method further includes coupling a light excited in the active layer and partially reflected from the second facet to pass through the first facet to a wavelength tuner configured to generate a joint interference spectrum with multiple modes separated by a joint-free-spectral-range (JFSR). Additionally, the method includes configuring the second facet to have reduced reflectivity for increasing wavelengths. Furthermore, the method includes reconfiguring the gain chip with an absorption layer near the active layer to induce a gain loss for wavelengths shorter than a longest wavelength associated with a short-wavelength side mode. Moreover, the method includes outputting amplified light at a basic mode via the second facet.

公开(公告)号：US10779063B2

公开(公告)日：2020-09-15

申请号：US15650334

申请日：2017-07-14

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan

IPC: H04Q11/00 ,  H04B10/40 ,  H04B10/516 ,  H04B10/54

Abstract: In an example, the present invention includes an integrated system on chip device. The device has a variable bias block configured with the control block, the variable bias block being configured to selectively tune each of a plurality of laser devices provided on the silicon photonics device to adjust for at least a wavelength of operation, a fabrication tolerance, and an extinction ratio.

公开(公告)号：US10733138B2

公开(公告)日：2020-08-04

申请号：US16196614

申请日：2018-11-20

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan

IPC: G06F15/78 ,  G06F13/42 ,  H04L27/00 ,  G02B6/12 ,  H04L1/00 ,  H04L25/03 ,  G06F13/40 ,  G06F13/364 ,  H04L27/02 ,  H04L5/14 ,  H04L27/18 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

公开(公告)号：US10715255B2

公开(公告)日：2020-07-14

申请号：US16536162

申请日：2019-08-08

Applicant: INPHI CORPORATION

Inventor： Todd Rope ,  Radhakrishnan L. Nagarajan ,  Hari Shankar

IPC: H04B10/516 ,  G02F1/01 ,  G02F1/225 ,  H01S5/0687 ,  H01S5/40 ,  H04B10/50 ,  H01S5/14 ,  H04B10/556 ,  H04J14/02 ,  G02F1/025 ,  H01S3/067 ,  H01S5/00 ,  G02F1/21

Abstract: The present invention relates to telecommunication techniques and integrated circuit (IC) devices. More specifically, embodiments of the present invention provide an off-quadrature modulation system. Once an off-quadrature modulation position is determined, a ratio between DC power transfer amplitude and dither tone amplitude for a modulator is as a control loop target to stabilize off-quadrature modulation. DC power transfer amplitude is obtained by measuring and sampling the output of an optical modulator. Dither tone amplitude is obtained by measuring and sampling the modulator output and performing calculation using the optical modulator output values and corresponding dither tone values. There are other embodiments as well.

公开(公告)号：US10560198B2

公开(公告)日：2020-02-11

申请号：US16408256

申请日：2019-05-09

Applicant: INPHI CORPORATION

Inventor： Todd Rope ,  Sung Choi ,  James Stewart ,  Radhakrishnan L. Nagarajan ,  Paul Yu ,  Ilya Lyubomirsky

IPC: H04B10/079 ,  H04B10/61 ,  H04B10/67 ,  H04B10/69 ,  H04L27/18 ,  G02B6/12 ,  G02B6/293 ,  H04B17/20 ,  H04L27/06

Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.

公开(公告)号：US10382125B2

公开(公告)日：2019-08-13

申请号：US15411914

申请日：2017-01-20

Applicant: INPHI CORPORATION

Inventor： Todd Rope ,  Radhakrishnan L. Nagarajan

IPC: H04B10/079 ,  H04B10/40 ,  H04L1/00

Abstract: The present invention is directed to communication systems and methods. According to an embodiment, a receiving optical transceiver determines signal quality for signals received from a transmitting optical transceiver. Information related to the signal quality is embedded into back-channel data and sent to the transmitting optical transceiver. The transmitting optical transceiver detects the presence of the back-channel data and adjusts one or more of its operating parameters based on the back-channel data. There are other embodiments as well.

公开(公告)号：US10248616B2

公开(公告)日：2019-04-02

申请号：US15810641

申请日：2017-11-13

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Chao Xu

IPC: G06F13/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F15/78 ,  G06F13/42 ,  G06F13/364 ,  G06F13/40 ,  H04L1/00 ,  H04L25/03 ,  G02B6/12 ,  H04L27/00 ,  H04L27/34 ,  H04L5/14 ,  H04L27/02 ,  H04L27/18

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.