摘要:
A nonvolatile semiconductor storage device has a semiconductor substrate, a gate electrode formed on a surface of the semiconductor substrate, and a first diffusion layer and a second diffusion layer formed in the surface of the semiconductor substrate on opposite sides of the gate electrode, a channel region being formed between the first and second diffusion layers. A first insulating layer, isolated pieces of material and a second insulating layer are formed in order in a multilayer structure on the surface of the semiconductor substrate on the channel region.
摘要:
There are included a fractionating tower for liquefying and separating the compressed air cooled by heat exchangers to an ultralow temperature, a liquid oxygen takeout path for guiding the liquid oxygen in the above-mentioned fractionating tower to the above-mentioned heat exchangers to gasify so as to become a gasified oxygen, and a product oxygen gas takeout path which extends from the front end of the above-mentioned liquid oxygen takeout path and increases the temperature of the above-mentioned gasified oxygen so as to obtain a product oxygen gas, the above-mentioned liquid oxygen takeout path being provided with an oxygen gas pressurizing pump, and the above-mentioned product oxygen gas takeout path on the side upstream the above-mentioned heat exchangers being provided with an expansion turbine. In the present invention, the liquid oxygen taken out from the fractionating tower is pressurized in a liquid state, then introduced into the expansion turbine to generate a cold, which cold is fed to the heat exchangers, so that the cold is used as a cold source for the entire equipment to reduce the cost of generating the cold.
摘要:
The invention provides a method of fabricating a semiconductor device on an SOI substrate having a single crystal silicon substrate, a silicon dioxide film laid on top of the silicon substrate and a single crystal silicon layer laid on top of the silicon dioxide film. The method includes the steps of forming a single crystal silicon island composed of the single crystal silicon layer in a first region in which the semiconductor device is to be fabricated, and selectively forming a low temperature deposition silicon dioxide film in a second region in which the semiconductor device is not to be fabricated in the presence of photoresist, so that the low temperature deposition silicon dioxide film covers side surfaces of the silicon island. The second region turns into an isolation region for electrically separating adjacent semiconductor devices.
摘要:
A method and an apparatus for separating a specific component gas from a mixed gas, wherein granular adsorbent is held in a sealed space in a layered state, easily adsorptive gas is adsorbed to the granular adsorbent by blowing material mixed gas into the adsorbent layers and contacting the granular adsorbent with a counter-current of material gas, and the granular adsorbent is transferred gradually out of the sealed space, and reactivated by desorbing the easily adsorptive gas from the granular adsorbent, and the reactivated granular adsorbent is returned to the inside of the sealed space to be reused. Therefore, frequent actions of opening and closing valves are unnecessary, so that it is possible to separate and produce excellent product gas with high purity.
摘要:
This invention relates to a method for forming a uniform, deep nitride layer on and in steel works at low cost, wherein a steel work is fluorided in heated condition in an atmosphere of a mixed gas composed of fluorine gas and inert gas and, then, nitrided in heated condition in an atmosphere of nitriding gas.
摘要:
On a semiconductor substrate, a thin insulating film to be used as a gate insulating film, a thin polysilicon film and a thick mask layer are formed in the order and an opening for gate electrode formation is formed in the mask layer. After an ion implantation of impurities having the same conductivity type as that of the substrate is performed thereto through the opening to form, in the substrate, an impurity region having the same conductivity type as and impurity density larger than that of the substrate, the opening is filled with electrically conductive material. Thereafter, the mask layer is removed and an exposed first polysilicon film is removed to form a gate electrode comprising the conductive material and an underlying portion of the polysilicon film. Then, source region and drain region are formed in self-aligned manner with respect to the gate electrode.
摘要:
The present invention relates to an apparatus for producing semiconductors utilizing vacuum chemical epitaxy (VCE) method.Said VCE method has a high utilization efficiency of reactant gas and can finish the surface of a semiconductor layer formed on the surface of a substrate smoothly in comparision with a conventional Metalorganic Chemical Vapor Deposition Method(MOCVD). However, in case of forming semiconductor layer on the surface of a substrate with a large area, it is impossible to form homogeneous semiconductor layer.According to the present invention, a reactant gas dispersing chamber is disposed under a reaction chamber disposed within a vacuum chamber, the both chambers are communicated by a plurality of communicating holes, a feeding pipe for supplying reactant gas is extended into the reactant gas dispersing chamber, an end opening thereof is faced downward and a color portion is formed in parallel at the circumference of the end opening. Said reactant gas is blown off downward from the end opening of the feeding pipe and dispersed in parallel along the collar portion and dispersed homogeneously in the reactant gas dispersing chamber, and in the state, is introduced to the reaction chamber via said communicating holes. Therefore, even if on a substrate with a large area, homogeneous semiconductor layer can be formed.
摘要:
Apparatus for continuously producing semiconductor films on substrates in a vacuum chamber. A plurality of reaction chambers are provided within the vacuum chamber, substrates are supported by a top plate and transferred to each reaction chamber, which are filled with a certain reactant gas mixture while the substrates are heated from above the reaction chamber. Continuous treatment of the substrates is provided with an increase in reactant gas utilization efficiency. Disturbance of reactant gas flow by thermal convection is prevented and semiconductor layers having smooth surfaces are formed.
摘要:
The invention provides an apparatus for production of highly pure oxygen gas by cryogenic liquefaction and separation of air which does not include an expansion turbine which is known to frequently cause operation troubles. The apparatus comprises an oxygen gas production apparatus comprising an air compression means for compressing air from an outside source, a purification means for removing carbon dioxide gas and water vapor from the air compressed by said air compression means, a heat exchange means for chilling the compressed air from said purification means to a cryogenic temperature, a fractionation column for liquefying and fractionating the compressed air chilled to a cryogenic temperature by said heat exchange means and holding nitrogen in gaseous state and oxygen in liquid state, a liquid oxygen storage means for receiving liquid oxygen from an outside source and storing the same, a line for continuously introducing into said fractionation column the liquid oxygen from said liquid oxygen storage means in lieu of the generated refrigeration from a cold heat generating expansion means, an oxygen gas withdrawal line for guiding the liquid oxygen within said fractionation column as a refrigerant to said heat exchange means and withdrawing the gasified oxygen produced by heat exchange as a product oxygen gas, and a pressurizing means for pressurizing the product oxygen gas withdrawn from said oxygen withdrawal line.
摘要:
The non-aqueous electrolyte solution of the present invention is a non-aqueous electrolyte solution comprising acetonitrile and a lithium salt, wherein the anion of the lithium salt has a LUMO (lowest unoccupied molecular orbital) energy in the range of −2.00 to 4.35 eV, and a HOMO (highest occupied molecular orbital) energy in the range of −5.35 to −2.90 eV.