公开(公告)号：US20090176923A1

公开(公告)日：2009-07-09

申请号：US12162507

申请日：2007-02-06

申请人： Osamu Fujii ,  Koji Sarukawa

发明人： Osamu Fujii ,  Koji Sarukawa

IPC分类号： C08K3/40

CPC分类号： C08J5/043 ,  C08J2323/12 ,  C08J2367/02 ,  C08J2377/00 ,  C08L23/12 ,  C08L77/00 ,  Y10T428/2998

摘要： The present invention provides a glass fiber-reinforced thermoplastic resin composition in which a particular relationship is satisfied between the glass fiber content (W (parts by weight)) and the melt viscosity (η) of the thermoplastic resin composition at molding temperature as determined at a shear rate of 1,000 sec−1. According to the present invention, there can be obtained a glass fiber-reinforced thermoplastic resin having increased strength and rigidity and excellent in practical characteristics such as impact resistance and antifreeze liquid resistance. In addition, molded articles obtained by injection-molding the composition are available as components having reduced anisotropies of mechanical characteristics and mold shrinkage factor.

摘要翻译： 本发明提供一种玻璃纤维增​​强热塑性树脂组合物，其中，在成型温度下，玻璃纤维含量（W（重量份））与热塑性树脂组合物的熔融粘度（η）之间的关系满足特定关系， 剪切速率为1000秒-1。 根据本发明，可以获得具有强度和刚性提高的玻璃纤维增​​强热塑性树脂，并且具有优异的耐冲击性和防冻液性等实用特性。 此外，通过注射成型组合物获得的模塑制品可用作机械特性和模具收缩率各向异性降低的组分。

公开(公告)号：US20070290208A1

公开(公告)日：2007-12-20

申请号：US11889451

申请日：2007-08-13

申请人： Kaoru Hiyama ,  Tomoya Sanuki ,  Osamu Fujii

发明人： Kaoru Hiyama ,  Tomoya Sanuki ,  Osamu Fujii

IPC分类号： H01L29/10

CPC分类号： H01L21/823807 ,  H01L27/0629 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/10829 ,  H01L27/10894 ,  H01L29/92

摘要： A semiconductor device includes a substrate having a first area and a second area adjacent to the first area, a first silicon layer provided on the substrate in the first area, a relaxed layer which is provided on the substrate in the second area and which has a lattice constant greater than a lattice constant of the first silicon layer, and a strained-Si layer which is provided on the relaxed layer and which has a lattice constant substantially equivalent to the lattice constant of the relaxed layer.

摘要翻译： 半导体器件包括具有与第一区域相邻的第一区域和第二区域的衬底，设置在第一区域中的衬底上的第一硅层，设置在第二区域中的衬底上的松弛层， 晶格常数大于第一硅层的晶格常数，以及设置在松弛层上并具有与弛豫层的晶格常数基本相等的晶格常数的应变Si层。

公开(公告)号：US07137177B2

公开(公告)日：2006-11-21

申请号：US10966324

申请日：2004-10-14

申请人： Osamu Fujii ,  Minoru Uno

发明人： Osamu Fujii ,  Minoru Uno

IPC分类号： A44B19/36

CPC分类号： A44B19/386 ,  Y10T24/2502 ,  Y10T24/2514 ,  Y10T24/2518 ,  Y10T24/252 ,  Y10T24/2593 ,  Y10T24/2598

摘要： Coil-like or zigzag-like linear fastener elements formed of synthetic fiber mono-filaments are attached such that coupling heads project from a side edge of a fastener tape and at least one coupling head thereof located at a top end is moved to the inside of the fastener tape so as to substantially coincide with the side edge. Then, the fastener element is fused to the fastener tape in a state in which an inverted portion project inwardly while the coupling heads are in a non-coupling condition, so as to form a top end stop. The top end stop formed of the linear fastener element includes plasticity and provides an excellent tactile feeling without any burr on the surface thereof.

摘要翻译： 由合成纤维单丝形成的线圈状或之字形线性紧固件被附接，使得联接头从拉链带的侧边缘突出，并且位于顶端的至少一个联接头移动到 该拉链带基本上与侧边缘重合。 然后，当联接头处于非耦合状态时，在倒置部分向内突出的状态下，紧固件与拉链带熔合，从而形成顶端止动件。 由线性紧固元件形成的顶端止动件包括可塑性，并且在其表面上没有任何毛刺提供优良的触感。

公开(公告)号：US06906384B2

公开(公告)日：2005-06-14

申请号：US10096655

申请日：2002-03-14

申请人： Takashi Yamada ,  Tsutomu Sato ,  Shinichi Nitta ,  Hajime Nagano ,  Ichiro Mizushima ,  Hisato Oyamatsu ,  Yoshihiro Minami ,  Shinji Miyano ,  Osamu Fujii

发明人： Takashi Yamada ,  Tsutomu Sato ,  Shinichi Nitta ,  Hajime Nagano ,  Ichiro Mizushima ,  Hisato Oyamatsu ,  Yoshihiro Minami ,  Shinji Miyano ,  Osamu Fujii

IPC分类号： H01L21/76 ,  H01L21/762 ,  H01L21/764 ,  H01L21/8234 ,  H01L21/8242 ,  H01L21/84 ,  H01L27/08 ,  H01L27/088 ,  H01L27/10 ,  H01L27/108 ,  H01L27/12 ,  H01L29/786 ,  H01L27/01

CPC分类号： H01L27/10861 ,  H01L21/76243 ,  H01L21/823481 ,  H01L21/84 ,  H01L27/10873 ,  H01L27/10894 ,  H01L27/1203 ,  H01L29/78639

摘要： A semiconductor device includes first and second semiconductor layers and first and second MOS transistors. The first semiconductor layer is provided on and electrically connected to the semiconductor substrate. The second semiconductor layer is provided near the first semiconductor layer and formed above the semiconductor substrate via one of an insulating film and a cavity. The first and second MOS transistors are respectively provided on the first and second semiconductor layers, and each has a gate electrode arranged parallel to a boundary between the first and second semiconductor layers.

摘要翻译： 半导体器件包括第一和第二半导体层以及第一和第二MOS晶体管。 第一半导体层设置在半导体衬底上并与之电连接。 第二半导体层设置在第一半导体层附近，并且经由绝缘膜和空腔中的一个形成在半导体基板的上方。 第一和第二MOS晶体管分别设置在第一和第二半导体层上，并且各自具有平行于第一和第二半导体层之间的边界排列的栅电极。

公开(公告)号：US20050081340A1

公开(公告)日：2005-04-21

申请号：US10966324

申请日：2004-10-14

申请人： Osamu Fujii ,  Minoru Uno

发明人： Osamu Fujii ,  Minoru Uno

IPC分类号： A44B19/36 ,  A44B19/38

CPC分类号： A44B19/386 ,  Y10T24/2502 ,  Y10T24/2514 ,  Y10T24/2518 ,  Y10T24/252 ,  Y10T24/2593 ,  Y10T24/2598

摘要： Coil-like or zigzag-like linear fastener elements formed of synthetic fiber mono-filaments are attached such that coupling heads project from a side edge of a fastener tape and at least one coupling head thereof located at a top end is moved to the inside of the fastener tape so as to substantially coincide with the side edge. Then, the fastener element is fused to the fastener tape in a state in which an inverted portion project inwardly while the coupling heads are in a non-coupling condition, so as to form a top end stop. The top end stop formed of the linear fastener element includes plasticity and provides an excellent tactile feeling without any burr on the surface thereof.

摘要翻译： 由合成纤维单丝形成的线圈状或之字形线性紧固件被附接，使得联接头从拉链带的侧边缘突出，并且位于顶端的至少一个联接头移动到 该拉链带基本上与侧边缘重合。 然后，当联接头处于非耦合状态时，在倒置部分向内突出的状态下，紧固件与拉链带熔合，从而形成顶端止动件。 由线性紧固元件形成的顶端止动件包括可塑性，并且在其表面上没有任何毛刺提供优良的触感。

公开(公告)号：US4266043A

公开(公告)日：1981-05-05

申请号：US90892

申请日：1979-11-05

申请人： Osamu Fujii ,  Toshio Kishimoto ,  Akio Kobayashi

发明人： Osamu Fujii ,  Toshio Kishimoto ,  Akio Kobayashi

IPC分类号： C08G18/00 ,  C08G18/48 ,  C08J9/02 ,  C08G18/14 ,  C08G18/12

CPC分类号： C08J9/02 ,  C08G18/4837 ,  C08G2101/0008 ,  C08G2101/0083 ,  C08J2375/00 ,  Y10S521/905 ,  Y10S521/914

摘要： A resilient hydrophobic foamed polymer obtained by reacting a mixture of an isocyanate terminated urethane prepolymer and a polyisocyanate (A) with aqueous material, said prepolymer being relatively hydrophilic and the reaction product of a molar excess of a polyisocyanate (B) with a polyetherpolyol having from 15 to 50% by weight of oxethylene content, said aqueous material having a water content between about 15 to 150% by weight based on said prepolymer, the amount of said polyisocyanate (A) ranging between about 5 to 15% by weight based on said prepolymer, said polyetherpolyol being selected from the group consisting of (a) the addition polymerization product of a starting material, ethylene oxide and another epoxide and (b) a mixture of at least two of the following:(1) The addition polymerization product of a starting material and ethylene oxide;(2) the addition polymerization product of a starting material and an epoxide other than ethylene oxide;(3) the addition polymerization material, ethylene oxide and another epoxide,and said starting material being selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol; dipropylene glycol; butylene glycol; hexylene glycol; glycerol; trimethylolethane; trimethylol propane; 1,2,6-hexanetriol; pentaerythritol; .alpha.-methylglycoside; sorbitol and sucrose.

摘要翻译： 通过将异氰酸酯封端的氨基甲酸酯预聚物和多异氰酸酯（A）的混合物与水性材料反应而获得的弹性疏水性发泡聚合物，所述预聚物相对亲水，并且摩尔过量的多异氰酸酯（B）与聚醚多元醇的反应产物具有 15至50重量％的氧化乙烯含量，所述水性材料的水含量基于所述预聚物为约15至150重量％，所述多异氰酸酯（A）的量基于所述预聚物的约5至15重量％ 预聚物，所述聚醚多元醇选自（a）原料加成聚合产物，环氧乙烷和另一种环氧化物，和（b）至少两种以下的混合物：（1）加成聚合产物 原料和环氧乙烷; （2）原料和环氧乙烷以外的环氧化物的加聚反应产物; （3）加成聚合材料，环氧乙烷和另一种环氧化物，所述原料选自乙二醇，二甘醇，丙二醇; 二丙二醇 丁二醇; 己二醇 甘油 三羟甲基乙烷 三羟甲基丙烷 1,2,6-己三醇; 季戊四醇 α-甲基糖苷; 山梨糖醇和蔗糖。

公开(公告)号：US08735181B2

公开(公告)日：2014-05-27

申请号：US12251558

申请日：2008-10-15

申请人： Osamu Fujii ,  Yoshimasa Kawase ,  Hisato Oyamatsu ,  Takeshi Shibata

发明人： Osamu Fujii ,  Yoshimasa Kawase ,  Hisato Oyamatsu ,  Takeshi Shibata

IPC分类号： G01R31/26

CPC分类号： H01L22/12 ,  H01J2237/30461 ,  H01J2237/31703 ,  H01J2237/3171

摘要： A measuring device measures a gate length of a plurality of gate electrodes formed on a wafer. A calculation device calculates data of an ion implantation dosage for making uniform a threshold voltage in a wafer surface on the basis of distribution of the gate length in a wafer surface measured by the measuring device. The ion implantation device implants ions into the wafer on the basis of the data of the ion implantation dosage calculated by the calculation device.

摘要翻译： 测量装置测量形成在晶片上的多个栅电极的栅极长度。 计算装置基于由测量装置测量的晶片表面中的栅极长度的分布，计算用于使晶片表面中的阈值电压均匀的离子注入剂量的数据。 离子注入装置基于由计算装置计算的离子注入剂量的数据将离子注入晶片。

公开(公告)号：US08299160B2

公开(公告)日：2012-10-30

申请号：US12297476

申请日：2007-04-17

申请人： Kei Yamauchi ,  Osamu Fujii

发明人： Kei Yamauchi ,  Osamu Fujii

IPC分类号： C08K3/10

CPC分类号： C08J5/043 ,  C08J2377/00 ,  C08K3/16 ,  C08K7/14 ,  C08L77/00

摘要： A resin composition including 30 to 90% by mass of polyamide (A), 70 to 10% by mass of glass fibers (B), a copper compound (C) and a halogenated compound (D), wherein polyamide (A) has a sum of a terminal carboxyl group concentration and a terminal amino group concentration of 100 milliequivalents/kg or more and 200 milliequivalents/kg or less, the terminal carboxyl group concentration being higher than the terminal amino group concentration; glass fibers (B) have a fiber diameter of 10 to 20 μm and a weight average fiber length of 5 to 30 mm; the content of copper based on polyamide (A) is 30 ppm or more and 200 ppm or less; and the molar ratio of halogen to copper (halogen/copper) is more than 5 and not more than 25.

摘要翻译： 含有30〜90质量％的聚酰胺（A），70〜10质量％的玻璃纤维（B），铜化合物（C）和卤化物（D）的树脂组合物，其中，聚酰胺（A） 末端羧基浓度和末端氨基浓度为100毫当量/ kg以上至200毫当量/ kg以下，末端羧基浓度高于末端氨基浓度; 玻璃纤维（B）的纤维直径为10〜20μm，重均纤维长度为5〜30mm， 基于聚酰胺（A）的铜的含量为30ppm以上且200ppm以下; 卤素与铜（卤素/铜）的摩尔比大于5且不超过25。

公开(公告)号：US07930173B2

公开(公告)日：2011-04-19

申请号：US11812381

申请日：2007-06-18

申请人： Osamu Fujii

发明人： Osamu Fujii

IPC分类号： G10L19/00

CPC分类号： G10L19/0204 ,  G10L19/032 ,  G10L21/0364

摘要： Provided is a signal processing method which can enhance the resolution of a spectrum round off by quantization and compensate energy of a spectrum truncated to zero by quantization so as to achieve reproduction without dissatisfaction or uncomfortable feeling. The selecting circuit selects a plurality of coefficients from coefficients of a frequency band of a dequantized acoustic signal. The computing circuit then computes an interpolation coefficient of a coefficient, which is not selected by the selecting circuit, by an interpolation method such as a Lagrange's interpolation method or a spline interpolation method which uses the plurality of coefficients selected by the selecting circuit.

摘要翻译： 提供了一种信号处理方法，其可以通过量化来提高舍入的频谱的分辨率，并且通过量化来补偿被截断为零的频谱的能量，以便在不感到不舒服或不舒适的感觉的情况下实现再现。 选择电路从去量化声信号的频带的系数中选择多个系数。 然后，计算电路通过使用由选择电路选择的多个系数的拉格朗日内插法或者样条插补法等插值法来计算未被选择电路选择的系数的插值系数。

公开(公告)号：US07605442B2

公开(公告)日：2009-10-20

申请号：US12263830

申请日：2008-11-03

申请人： Osamu Fujii ,  Tomoya Sanuki

发明人： Osamu Fujii ,  Tomoya Sanuki

IPC分类号： H01L21/762

CPC分类号： H01L29/7846 ,  H01L21/823412 ,  H01L21/823481 ,  H01L29/7842

摘要： A semiconductor device comprises a semiconductor substrate, a plurality of transistors provided in the semiconductor substrate, and an isolation region for isolating the plurality of transistors to one another, the isolation region being comprised of an isolating insulation film, wherein a crystal structure of at least a part of the isolating insulation film is broken.

摘要翻译： 半导体器件包括半导体衬底，设置在半导体衬底中的多个晶体管和用于将多个晶体管彼此隔离的隔离区域，隔离区域由隔离绝缘膜组成，其中至少具有晶体结构 隔离绝缘膜的一部分被破坏。