摘要:
In one form a memory and method thereof has a memory array having a plurality of memory cells. A bit line precharge operation is based on a clock edge of an external clock signal. A word line is selected after the beginning of the precharge operation. A sense operation is begun after enabling the word line, where the sense operation is for sensing a logic state of a memory cell. A data bit is output from the memory array corresponding to the sensed logic state of the memory cell. In one form the bit line precharge operation further comprises the bit line precharge operation having a predetermined duration that is independent of the clock signal, and the sense operation begins a predetermined delay time after enabling the word line, the sense operation having a variable duration.
摘要:
A system has a first plurality of cores in a first coherency group. Each core transfers data in packets. The cores are directly coupled serially to form a serial path. The data packets are transferred along the serial path. The serial path is coupled at one end to a packet switch. The packet switch is coupled to a memory. The first plurality of cores and the packet switch are on an integrated circuit. The memory may or may not be on the integrated circuit. In another aspect a second plurality of cores in a second coherency group is coupled to the packet switch. The cores of the first and second pluralities may be reconfigured to form or become part of coherency groups different from the first and second coherency groups.
摘要:
A semiconductor topography (10) is provided which includes a semiconductor-on-insulator (SOI) substrate having a conductive line (16) arranged within an insulating layer (22) of the SOI substrate. A method for forming an SOI substrate with such a configuration includes forming a first conductive line (16) within an insulating layer (22) arranged above a wafer substrate (12) and forming a silicon layer (24) upon surfaces of the first conductive line and the insulating layer. A further method is provided which includes the formation of a transistor gate (28) upon an SOI substrate having a conductive line (16) embedded therein and implanting dopants within the semiconductor topography to form source and drain regions (30) within an upper semiconductor layer (24) of the SOI substrate such that an underside of one of the source and drain regions is in contact with the conductive line.
摘要:
In one form a memory and method thereof has a memory array having a plurality of columns of bit lines and a plurality of intersecting rows of word lines. Control circuitry is coupled to the memory array for successively accessing predetermined bit locations in the memory array during successive memory cycles. The control circuitry senses data within the memory array at a beginning of a predetermined memory cycle. Timing of the memory cycle is determined from a single external clock edge of a memory system clock. During a single memory cycle the memory initially performs the function of sensing followed by at least the functions of precharging the bit lines, addressing and developing a signal to be sensed. In one form each of the successive memory cycles is a period of time of no more than a single period of the memory system clock.
摘要:
An integrated circuit (101) includes electrical circuitry (105) formed on a substrate (103). An interconnect layer (109, 117) is formed over the electrical circuitry (105). In one example, a plurality of magneto-resistive random access memory cells (MRAM) (161, 171) is implemented above the interconnect layer. Each of the MRAM cells comprises a magneto-resistive tunnel junction (MTJ) storage element. A transistor (130) is formed-over the interconnect layer (109, 117). In one embodiment, the transistor is implemented as a thin film transistor (TFT). In one embodiment the transistor is a select transistor and may be coupled to one or more of the MTJ storage elements. Access circuitry (203, 205, 207, 209) is formed on the substrate (103) under the plurality of MRAM cells (161, 171).
摘要:
An SRAM memory cell (10) is provided a boosted voltage by a charge pump (56) to reduce the soft error rate within the SRAM (10) and to improve bit cell stability. A voltage regulator (58) is coupled to the charge pump (56) to regulate the operation of the charge pump (56) and its outputted boosted voltage. The voltage regulator (58) regulates the boosted voltage over three operating states: low supply voltage, steady state operation, and burn-in.
摘要:
A charge pump (40) is implemented with several stages (30), including a control stage (50), in a manner integral with a ring-oscillator loop. The charge pump (40) is more efficient for producing voltage VBB to supply to a substrate well implementing circuitry such as a DRAM or SRAM (61), since there are no threshold voltage drops across any of the critical path transistors (M3) within the charge pump (40). This is accomplished by providing a boosted signal level from the proceeding stage (30). In the design, parasitic diode leakage is negligible.
摘要:
A BICMOS level converter (60) for use at lower power supply voltages includes an input buffer (20) for receiving an ECL level input signal and providing level shifted buffered signals referenced to V.sub.SS, a differential amplifier (61), a clamping circuit (71 and 72) for preventing the bipolar transistors (64 and 65) from operating in saturation, cross-coupled pull-up circuit (67) for a stronger transition from a logic low to a logic high, and a cross-coupled half-latch (75) for reducing the power consumption. The BICMOS level converter (60) has improved switching speeds, wider margins, and reduced power consumption for use at 3.3 volts.
摘要:
A power supply dependent input buffer (20) having a differential amplifier (22), emitter-follower transistors (29 and 32), level shifting resistors (30 and 33), and power supply dependent current sources (31 and 34) receives an ECL input signal referenced to a positive power supply voltage and provides buffered level shifted signals referenced to ground. The current sources (31 and 34) receive a power supply dependent bias voltage that changes in relation to a change in the positive power supply voltage. In turn, the voltage drop across the resistors (30 and 33) changes with respect to the positive power supply voltage such that the buffered level shifted signals are constant with respect to ground. The power supply dependent input buffer (20) is for use at low power supply voltages (such as 3.3 volts), resulting in low power consumption and wider margins on following stages, such as a level converter.
摘要:
A static random access memory (30), resistant to soft error from alpha particle emissions has a high density array of memory cells (44) coupled to word lines (73 and 74) and bit line pairs (68), and operates at low power supply voltages (for example, 3.3 volts). A charging circuit (55) boosts a supply voltage to the memory array above the power supply voltage. The charging circuit (55) includes an oscillator (57), a charge pump (56), and a voltage regulator (58). The boosted supply voltage reduces the effect of an alpha particle hitting the memory array (44) at low power supply voltages. Providing a boosted supply voltage to the memory array (44) improves soft error resistance without adding capacitance to each memory cell (52 and 54).