公开(公告)号：US20130199767A1

公开(公告)日：2013-08-08

申请号：US13364907

申请日：2012-02-02

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28F7/00 ,  B23K37/00 ,  B23K31/02

CPC classification number: H01L23/473 ,  B23K1/0014 ,  B23K31/02 ,  B23K2101/14 ,  H01L21/4882 ,  H01L21/4885 ,  H01L23/3677 ,  H01L23/467 ,  H01L24/72 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Abstract translation: 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。

公开(公告)号：US20110203108A1

公开(公告)日：2011-08-25

申请号：US12708774

申请日：2010-02-19

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01R31/02 ,  H01R43/00

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  Y10T29/49224

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract translation: 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。

公开(公告)号：US20090151907A1

公开(公告)日：2009-06-18

申请号：US11956024

申请日：2007-12-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28D15/00 ,  B21D53/02

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.

Abstract translation: 用于制造用于冷却集成电路的柔性热接口装置的方法包括以下步骤：根据至少一个选定图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件，使得所述片材包括平坦区域和弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合将所述堆叠片材中的至少一个的至少一部分结合。

公开(公告)号：US20080247165A1

公开(公告)日：2008-10-09

申请号：US11696265

申请日：2007-04-04

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01J3/46 ,  G02B27/30 ,  F21V23/04

CPC classification number: G01J3/50 ,  G02B27/20

Abstract: A method and apparatus for increasing the visibility in the visible spectrum of a laser pointer on a target. The laser pointer provides a laser source or sources of at least two distinct visible colors. The visibility of at least one of the laser source colors on the target is determined. The laser source color is selected from the given colors based on the determined visibility. The selected laser source color is directed to the target.

Abstract translation: 一种用于增加激光指示器在目标上的可见光谱中的可视性的方法和装置。 激光指示器提供至少两种不同可见颜色的激光源或源。 确定目标上的至少一种激光源颜色的可视性。 基于所确定的可视性，从给定的颜色中选择激光源颜色。 所选择的激光源颜色指向目标。

公开(公告)号：US09151543B2

公开(公告)日：2015-10-06

申请号：US13184239

申请日：2011-07-15

Applicant: Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

Inventor： Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

IPC: F25B25/00 ,  F28D15/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28D15/00 ,  H05K7/2079

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract translation: 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。

公开(公告)号：US08746000B2

公开(公告)日：2014-06-10

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: F25D23/12

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。

公开(公告)号：US08649177B2

公开(公告)日：2014-02-11

申请号：US13451714

申请日：2012-04-20

Applicant: Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract translation: 提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内。 该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

公开(公告)号：US20140022725A1

公开(公告)日：2014-01-23

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G06F1/20

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。

公开(公告)号：US20140020885A1

公开(公告)日：2014-01-23

申请号：US13551929

申请日：2012-07-18

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Abstract translation: 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

公开(公告)号：US08286855B2

公开(公告)日：2012-10-16

申请号：US13442322

申请日：2012-04-09

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种将导电接合材料沉积在模具中的空腔中的方法。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。