公开(公告)号：US20080108165A1

公开(公告)日：2008-05-08

申请号：US12008054

申请日：2008-01-07

申请人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

发明人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC分类号： H01L21/00

CPC分类号： B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

公开(公告)号：US06952041B2

公开(公告)日：2005-10-04

申请号：US10627237

申请日：2003-07-25

申请人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

发明人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC分类号： B81B3/00 ,  G01P15/00 ,  H01L20060101 ,  H01L21/00 ,  H01L27/01 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及一种MEMS器件，以及制造或制造具有机械结构和固定器的MEMS器件以将机械结构固定到衬底的技术。 本发明的锚固件由相对不受机械结构的释放过程影响的材料构成。 在这方面，蚀刻释放过程是选择性的或优先于相对于包括锚固件的材料固定机械结构的材料。 此外，本发明的锚固件以这样一种方式被固定到基底上，使得绝缘层的去除对机械结构锚固到基底上几乎没有影响。

公开(公告)号：US20050019974A1

公开(公告)日：2005-01-27

申请号：US10627237

申请日：2003-07-25

申请人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

发明人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC分类号： B81B3/00 ,  G01P15/00 ,  H01L20060101 ,  H01L21/00 ,  H01L27/01 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

公开(公告)号：US09771257B2

公开(公告)日：2017-09-26

申请号：US13213709

申请日：2011-08-19

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： H01L29/84 ,  B81C1/00

CPC分类号： B81C1/00293 ,  B81C2203/0136

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

公开(公告)号：US20110221013A1

公开(公告)日：2011-09-15

申请号：US12952895

申请日：2010-11-23

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

摘要翻译： 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

公开(公告)号：US07625603B2

公开(公告)日：2009-12-01

申请号：US10713172

申请日：2003-11-14

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： C23C16/00 ,  C23C16/30 ,  B05D3/02 ,  H01L21/00 ,  H01L21/76 ,  H01L21/30 ,  H01L21/302 ,  H01L21/469 ,  C23F1/00 ,  B44C1/22

CPC分类号： H01L21/02164 ,  C23C16/045 ,  C23C16/402 ,  C23C16/56 ,  H01L21/0228 ,  H01L21/02337 ,  H01L21/31612

摘要： A silicon oxide layer is formed by oxidation or decomposition of a silicon precursor gas in an oxygen-rich environment followed by annealing. The silicon oxide layer may be formed with slightly compressive stress to yield, following annealing, an oxide layer having very low stress. The silicon oxide layer thus formed is readily etched without resulting residue using HF-vapor.

摘要翻译： 通过在富氧环境中氧化或分解硅前体气体然后进行退火而形成氧化硅层。 氧化硅层可以形成为稍微的压缩应力，以在退火之后产生具有非常低的应力的氧化物层。 由此形成的氧化硅层容易地被蚀刻，而不会使用HF-蒸气而产生残余物。

公开(公告)号：US07514283B2

公开(公告)日：2009-04-07

申请号：US10392528

申请日：2003-03-20

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： H00L21/00 ,  H00L21/76 ,  C23F1/00

CPC分类号： B81C1/00293 ,  B81C2203/0136

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及一种制造或制造具有在受控或预定的机械阻尼环境中操作的机械结构的MEMS的技术。 在这方面，本发明在MEMS的最终包装和/或完成之前将机械结构封装在腔室内。 包含和/或容纳机械结构的腔室内的环境提供预定的，期望的和/或选择的机械阻尼。 控制，选择和/或设计机械结构要操作的封装流体的参数（例如，气体压力）以提供期望的和/或预定的操作环境。

公开(公告)号：US07317233B2

公开(公告)日：2008-01-08

申请号：US11157582

申请日：2005-06-21

申请人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

发明人： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC分类号： H01L29/84 ,  H01L27/20 ,  G01P15/00

CPC分类号： B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及一种MEMS器件，以及制造或制造具有机械结构和固定器的MEMS器件以将机械结构固定到衬底的技术。 本发明的锚固件由相对不受机械结构的释放过程影响的材料构成。 在这方面，蚀刻释放过程是选择性的或优先于相对于包括锚固件的材料固定机械结构的材料。 此外，本发明的锚固件以这样一种方式被固定到基底上，使得绝缘层的去除对机械结构锚固到基底上几乎没有影响。

公开(公告)号：US07270868B2

公开(公告)日：2007-09-18

申请号：US10618791

申请日：2003-07-14

申请人： Thorsten Pannek ,  Udo Bischof ,  Silvia Kronmueller ,  Jens Frey ,  Ulf Wilhelm

发明人： Thorsten Pannek ,  Udo Bischof ,  Silvia Kronmueller ,  Jens Frey ,  Ulf Wilhelm

IPC分类号： B32B3/00 ,  B32B3/10 ,  B32B3/18 ,  H01L21/00 ,  H01L29/84

CPC分类号： B81C1/00595 ,  Y10T428/24612 ,  Y10T428/24628

摘要： A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.

摘要翻译： 描述了具有包含可移动元件和不可移动元件的表面微机械结构的部件及其制造方法。 组件的表面微机械结构在功能层中产生，功能层通过至少一个不导电的第一绝缘层和至少一个第一牺牲层连接到基板。 通过去除第一牺牲层来暴露表面微机械结构的可移动元件。 第一绝缘层由不会被去除第一牺牲层的过程基本上受到攻击的材料制成。 因此，可以以设计控制的方式限制牺牲层的去除。 同时，确保表面微机械结构相对于部件的基板的可靠的电绝缘以及表面微机械结构的不动元件到基板的可靠的机械紧固。

公开(公告)号：US07075160B2

公开(公告)日：2006-07-11

申请号：US10454867

申请日：2003-06-04

申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC分类号： H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

摘要翻译： 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。