TRANSPARENT ELECTRICALLY-CONDUCTIVE HARD-COATED SUBSTRATE AND METHOD FOR PRODUCING THE SAME
    45.
    发明申请
    TRANSPARENT ELECTRICALLY-CONDUCTIVE HARD-COATED SUBSTRATE AND METHOD FOR PRODUCING THE SAME 审中-公开
    透明电导体硬化基材及其制造方法

    公开(公告)号:US20080152870A1

    公开(公告)日:2008-06-26

    申请号:US11615831

    申请日:2006-12-22

    IPC分类号: B32B9/04 B05D1/36 B32B3/10

    摘要: A transparent electrically-conductive hard-coated substrate of the invention comprises a transparent base material; a deposited carbon nanotubes layer formed on the transparent base material; and a cured resin layer formed on the deposited carbon nanotubes layer, wherein the deposited carbon nanotubes layer has a thickness of 10 nm or less, the total thickness of the deposited carbon nanotubes layer and the cured resin layer is 1.5 μm or more, and part of the deposited carbon nanotubes layer is diffused into the cured resin layer so that carbon nanotubes are present in the cured resin layer. The transparent electrically-conductive hard-coated substrate possesses high transparency and hard coating properties and also has electrical conductivity.

    摘要翻译: 本发明的透明导电硬涂层基材包括透明基材; 形成在透明基材上的沉积碳纳米管层; 以及形成在所述沉积的碳纳米管层上的固化树脂层,其中所述沉积的碳纳米管层的厚度为10nm以下,所述沉积的碳纳米管层和所述固化树脂层的总厚度为1.5μm以上, 的沉积碳纳米管层扩散到固化树脂层中,使得碳纳米管存在于固化树脂层中。 透明导电硬涂层基材具有高透明度和硬涂层性能,并且还具有导电性。

    Process for producing electro-optic hybrid circuit board
    47.
    发明申请
    Process for producing electro-optic hybrid circuit board 失效
    电光混合电路板的制造工艺

    公开(公告)号:US20060120658A1

    公开(公告)日:2006-06-08

    申请号:US11285358

    申请日:2005-11-23

    IPC分类号: G02B6/12

    摘要: The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.

    摘要翻译: 本发明提供了一种电光混合电路板的制造方法,其特征在于,包括以下步骤:在金属转印片的金属箔侧形成下层包覆层,所述金属转印片包括可剥离基板和形成在其上的金属箔; 在下封层上形成核心层; 形成外包层以覆盖芯层和下包层; 从金属箔剥离可释放基材; 并蚀刻金属箔从而形成预定的导体图案。

    Electro-optic hybrid circuit board
    48.
    发明申请
    Electro-optic hybrid circuit board 失效
    电光混合电路板

    公开(公告)号:US20060086533A1

    公开(公告)日:2006-04-27

    申请号:US11258108

    申请日:2005-10-26

    IPC分类号: H05K7/06

    摘要: The invention provides an electro-optic hybrid circuit board having an optical waveguide superposed on a wiring circuit board, the electro-optic hybrid circuit board comprising: an insulating layer; a conductor pattern formed on the insulating layer; an undercladding layer formed on the conductor pattern-having insulating layer so as to surround the conductor pattern; a core layer formed on the undercladding layer; and an overcladding layer formed to cover the core layer and the undercladding layer.

    摘要翻译: 本发明提供一种具有叠加在布线电路板上的光波导的电光混合电路板,该电光混合电路板包括:绝缘层; 形成在所述绝缘层上的导体图案; 形成在具有绝缘层的导体图案上以包围导体图案的下包层; 形成在下包层上的芯层; 以及形成为覆盖芯层和下包层的外包层。

    Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts
    50.
    发明申请
    Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts 审中-公开
    聚酰胺酰亚胺树脂,聚酰胺酰亚胺树脂的制造方法,聚酰胺酰亚胺树脂组合物,成膜材料和电子部件用粘合剂

    公开(公告)号:US20050043502A1

    公开(公告)日:2005-02-24

    申请号:US10885447

    申请日:2004-07-06

    摘要: The present invention provides a resin and a resin composition having low elasticity and being excellent in flexibility while being excellent in heat resistance, electric characteristics and adhesivity, a film-forming material comprising the resin or resin composition, and an adhesive for electronic parts. The resin of the present invention is a polyamideimide resin comprising a structural unit represented by the following general formula (1) and at least one of the structural unit represented by the following general formula (2) and the structural unit represented by the following general formula (3). The number k of the structural unit represented by the general formula (1), the number m of the structural unit represented by the general formula (2), and the number n of the structural unit represented by the general formula (3) contained in the polyamide resin satisfy the relation of 0

    摘要翻译: 本发明提供一种具有低弹性和优异的耐热性,电特性和粘合性的树脂和树脂组合物,包含树脂或树脂组合物的成膜材料和用于电子部件的粘合剂。 本发明的树脂是包含由以下通式(1)表示的结构单元和由以下通式(2)表示的结构单元和由以下通式表示的结构单元中的至少一种的聚酰胺酰亚胺树脂 (3)。 由通式(1)表示的结构单元的数k,由通式(2)表示的结构单元的数量m和由通式(3)表示的结构单元的数目n包含在 聚酰胺树脂满足0