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公开(公告)号：US07102462B2
公开(公告)日：2006-09-05
申请号：US11024769
申请日：2004-12-30
IPC分类号： H03H9/25 , H01L41/083
CPC分类号： H01F17/0006 , H01F5/003 , H01F27/29 , H01F2017/0046 , H01L23/5227 , H01L2924/0002 , H03H9/0576 , H03H9/725 , H03H2001/0078 , H01L2924/00
摘要： The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
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42.发明授权Surface acoustic wave device with reflection electrodes having pitches that vary 有权表面声波装置，其反射电极具有变化的间距公开(公告)号：US07002438B2
公开(公告)日：2006-02-21
申请号：US10925152
申请日：2004-08-25
申请人： Osamu Kawachi , Satoshi Orito , Takuya Abe
发明人： Osamu Kawachi , Satoshi Orito , Takuya Abe
IPC分类号： H03H9/64
CPC分类号： H03H9/6469 , H03H9/0042
摘要： A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.
摘要翻译： 声表面波装置包括：基板; 形成在基板上的一对反射电极; 以及介于反射电极之间的驱动电极。 在该声表面波装置中，每个反射电极中的间距根据预定的变化图案而变化。 利用这种结构，可以同时提高抑制寄生信号和形状因子（通带的截止区域的清晰度）。
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公开(公告)号：US20060022767A1
公开(公告)日：2006-02-02
申请号：US11024769
申请日：2004-12-30
IPC分类号： H03H9/72
CPC分类号： H01F17/0006 , H01F5/003 , H01F27/29 , H01F2017/0046 , H01L23/5227 , H01L2924/0002 , H03H9/0576 , H03H9/725 , H03H2001/0078 , H01L2924/00
摘要： The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
摘要翻译： 本发明允许进一步小型化和缩短声表面波器件，同时避免弹性表面波器件对螺旋电感器的电感值和性能指标（Q值）的影响。 其上形成有螺旋电感器的芯片与另一声表面波器件芯片一起倒装安装在封装中。 该包装有一个气密密封的盖子。 导体图案形成在封装的面对螺旋电感器的表面上。 此外，螺旋电感器的区域和导体图案之间的重叠为7％以下。
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44.发明授权Surface acoustic wave device with two split interdigital transducers connected by specified electrode structures 有权具有通过指定电极结构连接的两个分叉叉指式换能器的表面声波装置公开(公告)号：US06965282B2
公开(公告)日：2005-11-15
申请号：US10959173
申请日：2004-10-07
申请人： Osamu Kawachi , Motoyuki Tajima , Takuya Abe
发明人： Osamu Kawachi , Motoyuki Tajima , Takuya Abe
CPC分类号： H03H9/0042 , H03H9/0028 , H03H9/0061 , H03H9/02992 , H03H9/14591
摘要： Improvement on an insertion loss, as well as phase balance, is obtained in surface acoustic wave device. In the surface acoustic wave device, when an aperture length of the electrode fingers of an interdigital transducer for input or an interdigital transducer for output is defined as X, the interdigital transducer for input or the interdigital transducer for output includes two split interdigital transducers respectively including electrode fingers having an aperture length of approximately X/2, and electrodes of respective electrode fingers in the first and second split interdigital transducers are extracted from the two split interdigital transducers, and disposed in such a way as signals in the two outputs or inputs connected to a balanced terminal pair have a phase difference of 180°, and the two split interdigital transducers are connected in series by a common electrode of solid shape, of which electrode width is greater than twice the pitch of the electrode fingers in the two split interdigital transducers, and further the common electrode is connected to the ground potential.
摘要翻译： 弹性表面波器件可以获得插入损耗以及相位平衡的改善。 在表面声波装置中，当用于输入的叉指式换能器或用于输出的叉指换能器的电极指的孔径长度被定义为X时，用于输入的叉指换能器或用于输出的叉指式换能器包括两个分叉叉指换能器，分别包括 具有大约X / 2的开口长度的电极指，并且从两个分叉叉指式换能器中提取第一和第二分割叉指式换能器中的各个电极指的电极，并且以与两个输出或输入中的信号相连的方式设置 平衡端子对具有180°的相位差，并且两个分离叉指式换能器通过固体形状的公共电极串联连接，其电极宽度大于两个分叉叉指中电极指的间距的两倍 换能器，另外公共电极连接到地电位。
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公开(公告)号：US20050156687A1
公开(公告)日：2005-07-21
申请号：US11029500
申请日：2005-01-06
申请人： Satoru Matsuda , Osamu Kawachi
发明人： Satoru Matsuda , Osamu Kawachi
CPC分类号： H03H9/02771 , H03H9/02905 , H03H9/643 , H03H9/725
摘要： The present invention provides a surface acoustic wave device that allows a plurality of surface acoustic wave filters to be formed on a single chip and permits greater miniaturization. The surface acoustic wave device comprises a piezoelectric substrate, a first surface acoustic wave resonator formed on the piezoelectric substrate, and a second surface acoustic wave resonator formed on the piezoelectric substrate in the surface acoustic wave propagation direction of the first surface acoustic wave resonator. The positions in which the first and second surface acoustic wave resonators are formed on the piezoelectric substrate are in an at least partially overlapping relationship in a surface acoustic wave propagation region that is defined by virtually extending the respective openings of the first and second surface acoustic wave resonators. The surface acoustic wave device further comprises a part for dividing the overlap surface acoustic wave propagation region into an upper half and a lower half and for affording the phases of surface acoustic waves that are propagated by the first surface acoustic wave resonator a mutually antiphase relationship in the upper-half region and lower-half region thus divided.
摘要翻译： 本发明提供一种表面声波装置，其允许在单个芯片上形成多个表面声波滤波器，并且允许更大的小型化。 表面声波装置包括压电基片，形成在压电基片上的第一声表面波谐振器和形成在第一声表面波谐振器的表面声波传播方向上的压电基片上的第二声表面波谐振器。 在压电基板上形成第一和第二表面声波谐振器的位置在通过将第一和第二表面声波的各个开口虚拟地延伸而限定的表面声波传播区域中至少部分重叠的关系 谐振器。 表面声波装置还包括用于将重叠声表面波传播区域分成上半部分和下半部分并且用于使由第一声表面波谐振器传播的表面声波的相位相互反相关系的部分 上半区域和下半部分区域被划分。
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公开(公告)号：US20050035831A1
公开(公告)日：2005-02-17
申请号：US10925152
申请日：2004-08-25
申请人： Osamu Kawachi , Satoshi Orito , Takuya Abe
发明人： Osamu Kawachi , Satoshi Orito , Takuya Abe
CPC分类号： H03H9/6469 , H03H9/0042
摘要： A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.
摘要翻译： 声表面波装置包括：基板; 形成在基板上的一对反射电极; 以及介于反射电极之间的驱动电极。 在该声表面波装置中，每个反射电极中的间距根据预定的变化图案而变化。 利用这种结构，可以同时提高抑制寄生信号和形状因子（通带的截止区域的清晰度）。
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公开(公告)号：US5631515A
公开(公告)日：1997-05-20
申请号：US404310
申请日：1995-03-15
申请人： Seiji Mineyoshi , Osamu Kawachi
发明人： Seiji Mineyoshi , Osamu Kawachi
CPC分类号： H03H9/02866 , H03H9/643 , H03H9/6483
摘要： A surface acoustic wave device is designed such that an inter-digital transducer and a reflector have the same grating cycle. The electrode dye width of the reflector is larger than that of the inter-digital transducer, or the electrode dye width is smaller than the distance between the electrodes by changing at least one of the inter-digital transducer and the reflector. Connecting the thus structured surface acoustic wave devices to a single piezoelectric substrate as resonators in a ladder form produces a surface acoustic wave device for use in a filter.
摘要翻译： 表面声波装置被设计成使得数字间换能器和反射器具有相同的光栅周期。 反射器的电极染料宽度大于数字式换能器的电极染料宽度，或者通过改变数字间换能器和反射器中的至少一个，电极染料宽度小于电极之间的距离。 将这样构成的表面声波装置连接到单个压电基片作为梯形谐振器，产生用于滤波器的表面声波装置。
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48.发明授权公开(公告)号：US07795999B2
公开(公告)日：2010-09-14
申请号：US11878747
申请日：2007-07-26
申请人： Yasufumi Kaneda , Osamu Kawachi , Seiichi Mitobe , Kouta Ookubo
发明人： Yasufumi Kaneda , Osamu Kawachi , Seiichi Mitobe , Kouta Ookubo
IPC分类号： H03H9/64
CPC分类号： H03H9/6476 , H03H9/14582
摘要： A filter includes a first filter that is connected between an input node and an output node and is a surface acoustic wave filter, and a second filter that is provided between the input node and the output node and is connected in parallel with the first filter. The first filter has a total number N1 of pairs of electrode fingers of interdigital transducers and the second filter having a total number N2 of pairs of electrode fingers of interdigital transducers, in which N1 is greater than N2.
摘要翻译： 滤波器包括连接在输入节点和输出节点之间并且是表面声波滤波器的第一滤波器，以及设置在输入节点和输出节点之间并与第一滤波器并联连接的第二滤波器。 第一滤波器具有交叉指型换能器的电极指数对N1的总数，并且第二滤波器具有跨数字换能器的电极指对的总数N2，其中N1大于N2。
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公开(公告)号：US07400220B2
公开(公告)日：2008-07-15
申请号：US11065363
申请日：2005-02-25
申请人： Yasuyuki Saitou , Osamu Kawachi
发明人： Yasuyuki Saitou , Osamu Kawachi
CPC分类号： H03H9/6483 , H03H9/25 , H03H9/643 , H03H9/6473 , H03H9/6496
摘要： A surface acoustic wave device includes a surface acoustic wave resonator. The surface acoustic wave resonator includes comb-like electrodes and reflection electrodes provided on both sides of the comb-like electrodes, and each of the reflection electrodes has at least two different pitches. It is thus possible to suppress the ripple components.
摘要翻译： 表面声波装置包括表面声波谐振器。 表面声波谐振器包括梳状电极和设置在梳状电极两侧的反射电极，并且每个反射电极具有至少两个不同的间距。 因此可以抑制纹波成分。
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公开(公告)号：US20080111247A1
公开(公告)日：2008-05-15
申请号：US11598816
申请日：2006-11-14
IPC分类号： H01L23/488 , B23K31/02 , H01L21/60
CPC分类号： B23K1/0016 , H01L23/10 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要翻译： 提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角 的焊料熔化时，器件芯片和焊料大于90°。
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