摘要:
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要:
A diffraction micro flow structure and optical tweezers using the same are provided. The diffraction micro flow structure comprises a substrate and a diffraction part. The substrate comprises at least a flow path. The diffraction part is disposed on the substrate. The diffraction part comprises a diffraction optical element. After light passes through the diffraction optical element, the light is focused in the flow path and forms an optical field.
摘要:
A large area optical diagnosis apparatus and the operating method thereof are disclosed. The large area optical diagnosis apparatus includes a light source, a light path structure, and a sensing module. The light source is used to at least emit a coherent light. The light path structure includes a plurality of optical units used for dividing the coherent light into a plurality of first incident lights and a plurality of second incident lights. The plurality of first incident lights are emitted toward an object to be diagnosed and the plurality of second incident lights are emitted toward a reference end. The object to be diagnosed and the reference end reflect the plurality of first incident lights and the plurality of second incident lights to be a plurality of reflected lights. The sensing module senses the plurality of reflected lights to generate a sensing result related to the object to be diagnosed.
摘要:
An endoscopy apparatus having high degree of motion freedom and the operating method thereof are disclosed. The endoscopy apparatus having high degree of motion freedom includes a multi-stage endoscopy module and a control module. The multi-stage endoscopy module includes at least a first endoscopy unit and a second endoscopy unit. The first endoscopy unit and the second endoscopy unit can provide a first bending and a second bending respectively. The second bending is larger than the first bending. When the multi-stage endoscopy module moves to a region near a target observing position, the control module will control the second endoscopy unit to generate slight deformation to observe a real-time state of the target observing position.
摘要:
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要:
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要:
The invention provides a semiconductor device package. The package includes a chip disposed on a supported board and a conductive path formed between the chip and the supported board, on the backside of the supported board, or on the chip, so that the conductive path does not have to go around a region where the chip is located. Accordingly, the dimensions of the semiconductor device package are reduced.
摘要:
An apparatus for driving a fluid includes a substrate, at least one electrode group and a controlling unit. The substrate has at least one plane. The electrode group is disposed on the substrate and includes a first electrode, a second electrode and a third electrode. A projecting position of the second electrode on the plane is disposed between that of the first electrode and that of the third electrode. The controlling unit electrically connected to electrode group is for driving the first to third electrodes. When the controlling unit drives the first to third electrodes to make the first and third electrodes have opposite polarities and to make the second and third electrodes have the same polarity, an electric field produced by the electrode group enables the fluid on the substrate to flow from the first electrode to the third electrode.
摘要:
The invention provides a microinjection apparatus for a fluid. The microinjection apparatus comprises a substrate, a manifold, at least one fluid chamber, and at least one thermal sensing film. The manifold is formed on the substrate for containing the fluid therein. The at least one fluid chamber is also formed on the substrate and in communication with the manifold. Furthermore, the fluid chamber has a respective orifice and a respective heater disposed adjacent to the orifice. In addition, the thermal sensing film corresponds to the fluid chamber and is formed on a surface adjacent to the orifice. It should be noticed that the thermal sensing film has a respective color changeable in response to a heat generated during operation of the corresponding heater.
摘要:
An apparatus of generating an optical tweezers with momentum and method thereof and an optical tweezers photo-image for guiding particles are provided. The apparatus generates at least one optical tweezers on an examined object that carries at least one particle. The apparatus includes a laser source, a diffractive optical element and a convergent lens. The laser beam from the laser source passes through the diffractive optical element to produce a diffractive pattern. The laser beam is then received by the convergent lens and then to be focused on a plane of the examined object. The optic axis of the convergent lens is substantially not perpendicular to the plane of the examined object, so that the laser beam is projected onto the plane of the examined object in a skewed manner for providing a lateral momentum to move the particle.