利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.025 秒)

    INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF
    2.
    发明申请
    INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF 有权
    集成电路封装及其制作方法

    公开(公告)号：US20100129963A1

    公开(公告)日：2010-05-27

    申请号：US12694239

    申请日：2010-01-26

    申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    IPC分类号： H01L21/60

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

    摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

    Integrated circuit package and fabricating method thereof
    3.
    发明申请
    Integrated circuit package and fabricating method thereof 有权
    集成电路封装及其制造方法

    公开(公告)号：US20090179324A1

    公开(公告)日：2009-07-16

    申请号：US12102439

    申请日：2008-04-14

    申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    IPC分类号： H01L23/36 ,  H01L21/56

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

    摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

    Integrated circuit package and fabricating method thereof
    4.
    发明授权
    Integrated circuit package and fabricating method thereof 有权
    集成电路封装及其制造方法

    公开(公告)号：US07829388B2

    公开(公告)日：2010-11-09

    申请号：US12694239

    申请日：2010-01-26

    申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

    IPC分类号： H01L21/00

    CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

    摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

    Touch sensing device and touch sensing apparatus
    6.
    发明授权
    Touch sensing device and touch sensing apparatus 有权
    触摸感应装置和触摸感应装置

    公开(公告)号：US08102379B2

    公开(公告)日：2012-01-24

    申请号：US12139833

    申请日：2008-06-16

    申请人： Chung-Cheng Chou ,  William Wang ,  Chia-Hung Hsu ,  Chin-Yung Chen

    发明人： Chung-Cheng Chou ,  William Wang ,  Chia-Hung Hsu ,  Chin-Yung Chen

    IPC分类号： G06F3/041 ,  B41J2/41 ,  G02B26/00

    CPC分类号： G06F3/041

    摘要： The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed.

    摘要翻译： 本发明公开了一种触摸感测装置，其包括容纳空间，第一基板层，第二基板层，驱动器和传感器。 第一衬底层和第二衬底层限定用于容纳流体的容纳空间。 驱动器可以向第一衬底层的第一导电层，第二衬底层的第二导电层和流体提供电荷。 传感器可感测流体的电气特性。 当点单元接近触摸感测装置并影响电荷时，可以改变流体的外观，然后电特性也可以改变。

    FLEXIBLE LIGHT-EMITTING APPARATUS
    7.
    发明申请
    FLEXIBLE LIGHT-EMITTING APPARATUS 失效
    柔性发光装置

    公开(公告)号：US20100238683A1

    公开(公告)日：2010-09-23

    申请号：US12426962

    申请日：2009-04-21

    申请人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

    发明人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

    IPC分类号： H01L33/00

    CPC分类号： F21V7/04 ,  G02B6/001 ,  Y10S362/80

    摘要： A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

    摘要翻译： 提供了包括侧发光柔性导光杆，两个发光二极管和两个透镜的柔性发光装置。 侧发光柔性导光杆具有第一端，与第一端相对的第二端和连接第一端和第二端的发光面。 LED分别设置在第一端和第二端的旁边，并且分别用于朝向侧面发光柔性导光棒发射光束。 其中一个透镜位于第一端和设置在第一端旁边的LED之间，另一透镜位于第二端和位于第二端旁边的LED之间。 每个光束通过相应的透镜进入侧发光柔性导光杆，并通过发光表面传输到侧发光柔性导光杆的外侧。

    APPARATUS FOR FILM DEPOSITION ON A CONTINUOUS FLEXIBLE WEB
    8.
    发明申请
    APPARATUS FOR FILM DEPOSITION ON A CONTINUOUS FLEXIBLE WEB 审中-公开
    在连续灵活网络上进行薄膜沉积的装置

    公开(公告)号：US20090014317A1

    公开(公告)日：2009-01-15

    申请号：US11926310

    申请日：2007-10-29

    申请人： Chia-Yuan CHANG ,  Chia-Hung Hsu

    发明人： Chia-Yuan CHANG ,  Chia-Hung Hsu

    IPC分类号： C23C14/34

    CPC分类号： C23C14/562 ,  C23C14/022

    摘要： An apparatus for film deposition on a continuous flexible web includes: a deposition chamber; a web-supporting drum disposed rotatably in the deposition chamber and having an outer surface for supporting the flexible web thereon; a web-conveying unit including a web-supplying roller and a web-take-up roller for conveying the continuous flexible web from the web-supplying roller onto the outer surface of the web-supporting drum and then to the web-take-up roller; and a plurality of sputtering guns disposed around the outer surface of the web-supporting drum for depositing a film on the first surface of the flexible web on the outer surface of the web-supporting drum.

    摘要翻译： 用于在连续柔性幅材上沉积膜的设备包括：沉积室; 卷筒纸支撑鼓可旋转地设置在沉积室中，并具有用于在其上支撑柔性幅材的外表面; 纸幅输送单元，其包括幅材供给辊和幅材卷取辊，用于将连续的柔性幅材从幅材供给辊输送到幅材支撑鼓的外表面上，然后到幅材卷取 滚筒; 以及多个溅射枪，其设置在所述幅材支撑滚筒的外表面周围，用于在所述幅材支撑滚筒的外表面上的柔性幅材的第一表面上沉积薄膜。

    Method of activating P-type compound semiconductor by using lasers for reducing the resistivity thereof
    9.
    发明授权
    Method of activating P-type compound semiconductor by using lasers for reducing the resistivity thereof 失效
    通过使用激光降低其电阻率来激活P型化合物半导体的方法

    公开(公告)号：US06432847B1

    公开(公告)日：2002-08-13

    申请号：US09587211

    申请日：2000-06-01

    申请人： Jian-Shihn Tsang ,  Wen-Chung Tsai ,  Tsung-Yu Chen ,  Chia-Hung Hsu ,  Wei-Chih Lai

    发明人： Jian-Shihn Tsang ,  Wen-Chung Tsai ,  Tsung-Yu Chen ,  Chia-Hung Hsu ,  Wei-Chih Lai

    IPC分类号： H01L2126

    CPC分类号： H01L21/3245 ,  H01L21/268

    摘要： A novel method of using lasers for generating driving energy for activating P-type compound semiconductor films and reducing the resistivity thereof. The P-type compound semiconductor films are made from III-V nitrides or II-VI group compounds doped with P-type impurity. The present invention can be carried out in the ambience of atmosphere rather than in the ambience of nitrogen gas. In addition, adjusting the power and focusing distance of a laser source, and the power density can change the time required by the activating process.

    摘要翻译： 一种使用激光器产生用于激活P型化合物半导体膜的驱动能并降低其电阻率的新颖方法。 P型化合物半导体膜由掺杂有P型杂质的III-V族氮化物或II-VI族化合物制成。 本发明可以在大气环境中进行，而不是在氮气氛下进行。 此外，调整激光源的功率和聚焦距离，并且功率密度可以改变激活过程所需的时间。

    Flexible light-emitting apparatus
    10.
    发明授权
    Flexible light-emitting apparatus 失效
    柔性发光装置

    公开(公告)号：US07993046B2

    公开(公告)日：2011-08-09

    申请号：US12426962

    申请日：2009-04-21

    申请人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

    发明人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

    IPC分类号： F21V7/04 ,  H01L33/00

    CPC分类号： F21V7/04 ,  G02B6/001 ,  Y10S362/80

    摘要： A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

    摘要翻译： 提供了包括侧发光柔性导光杆，两个发光二极管和两个透镜的柔性发光装置。 侧发光柔性导光杆具有第一端，与第一端相对的第二端和连接第一端和第二端的发光面。 LED分别设置在第一端和第二端的旁边，并且分别用于朝向侧面发光柔性导光棒发射光束。 其中一个透镜位于第一端和设置在第一端旁边的LED之间，另一透镜位于第二端和位于第二端旁边的LED之间。 每个光束通过相应的透镜进入侧发光柔性导光杆，并通过发光表面传输到侧发光柔性导光杆的外侧。