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公开(公告)号：US20220059735A1
公开(公告)日：2022-02-24
申请号：US17518591
申请日：2021-11-04
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
Abstract: An image display device includes a plurality of pixels each of which includes a plurality of first subpixels and a second subpixel. The plurality of first subpixels is configured to emit red light, green light, and blue light. The second subpixel is configured to emit blue light. The plurality of pixels includes at least one pixel in which the plurality of first subpixels includes a defective subpixel which is supposed to emit predetermined light with a predetermined color. The second subpixel includes a light-emitting element and a wavelength conversion layer provided over the light-emitting element to convert emission light emitted from the light-emitting element to converted light with the predetermined color if the predetermined color is red or green.
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公开(公告)号：US20200303471A1
公开(公告)日：2020-09-24
申请号：US16824041
申请日：2020-03-19
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
IPC: H01L27/32 , H01L31/107
Abstract: A method for manufacturing an image display device includes: preparing a substrate, the substrate comprising a semiconductor layer, the semiconductor layer comprising a light emitting layer, the semiconductor layer being formed on a first substrate; bonding the semiconductor layer to a second substrate, the second substrate comprising a circuit that comprises a circuit element; forming a light emitting element by etching the semiconductor layer; forming an insulating film covering the light emitting element; forming a via reaching the circuit through the insulating film; and electrically connecting the light emitting element and the circuit element through the via, the via connecting the light emitting element and the circuit element provided in different layers.
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公开(公告)号：US20240334575A1
公开(公告)日：2024-10-03
申请号：US18619067
申请日：2024-03-27
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO , Naoto FUJIWARA , Takeshi MORIKAWA , Akira HORI
IPC: H05B47/16 , F21V9/30 , F21Y113/13 , F21Y115/10 , H05B45/44
CPC classification number: H05B47/16 , F21V9/30 , H05B45/44 , F21Y2113/13 , F21Y2115/10
Abstract: A light source including a light-emitting device including a substrate, and a first light-emitting element and a second light-emitting element that are located on the substrate. The light source further includes a drive circuit to supply a current to drive the light-emitting device, a switch configured to switch between a first state of supplying a current to only the first light-emitting element and a second state of supplying a current to only the second light-emitting element, and a timing controller configured to control a timing of an operation of the switch. A light emission peak wavelength of the first light-emitting element is 430 nm or greater and less than 490 nm. A light emission peak wavelength of the second light-emitting element is 490 nm or greater and less than 570 nm. A forward voltage of the second light-emitting element is less than a forward voltage of the first light-emitting element.
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公开(公告)号：US20240125985A1
公开(公告)日：2024-04-18
申请号：US18392314
申请日：2023-12-21
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
Abstract: An image-forming element includes a base member including a first surface, and a second surface opposite the first surface; and a reflector array located on the base member. The reflector array comprises a plurality of reflector rows, each including a plurality of dihedral corner reflectors arranged along a first direction. The plurality of reflector rows are arranged in a second direction crossing the first direction, the plurality of reflector rows being parallel to each other with a spacing therebetween. Each of the plurality of dihedral corner reflectors includes: a first reflecting surface configured to reflect light from a first surface side, and a second reflecting surface orthogonal to the first reflecting surface and configured to reflect a reflected light from the first reflecting surface toward the first surface side.
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公开(公告)号：US20230420630A1
公开(公告)日：2023-12-28
申请号：US18462540
申请日：2023-09-07
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L25/167 , H01L27/124 , H01L33/007 , H01L2933/0066
Abstract: A method for manufacturing an image display device includes: preparing a substrate, the substrate including a circuit and a first insulating film covering the circuit; forming a graphene-including layer on the first insulating film; forming a semiconductor layer on the graphene-including layer; forming a light-emitting element by etching the semiconductor layer, the light-emitting element including a bottom surface on the graphene-including layer, and a light-emitting surface at a side opposite to the bottom surface; forming a second insulating film covering the graphene-including layer, the light-emitting element, and the first insulating film; forming a first via extending through the first and second insulating films; and forming a wiring layer on the second insulating film. The first via is located between the wiring layer and the circuit and electrically connects the wiring layer and the circuit. The light-emitting element is electrically connected to the circuit via the wiring layer.
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Patent Agency Ranking
公开(公告)号：US20230343813A1
公开(公告)日：2023-10-26
申请号：US18318126
申请日：2023-05-16
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
CPC classification number: H01L27/156 , H01L33/50 , H01L33/60 , H01L2933/0041 , H01L2933/0058
Abstract: A method for manufacturing an image display device according to an embodiment includes forming a graphene layer on a first substrate, forming a semiconductor layer including a light-emitting layer on the graphene layer, forming the light-emitting element by patterning the semiconductor layer so that the light-emitting element includes a bottom surface on the graphene layer and a light-emitting surface at a side opposite to the bottom surface, forming a first insulating film that covers the first substrate, the graphene layer, and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film that covers the first insulating film and the circuit element, exposing the light-emitting surface by removing a portion of the first insulating film and a portion of the second insulating film, forming a via extending through the first and second insulating films, and forming a wiring layer on the second insulating film.
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公开(公告)号：US20230335688A1
公开(公告)日：2023-10-19
申请号：US18338261
申请日：2023-06-20
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
CPC classification number: H01L33/505 , H01L22/20 , H01L25/0753 , H01L25/167 , G09G3/2003 , G09G5/38 , G09G2320/0233 , H01L2933/0041 , G09G2330/10
Abstract: A method for manufacturing an image display device including providing a plurality of first subpixels and a second subpixel, where the plurality of first subpixels have a plurality of first light-emitting elements and are configured to emit red, green, and blue light, and the second subpixel has a second light-emitting element and being configured to emit blue light. A defective subpixel detection process includes turning on the plurality of first light-emitting elements, and acquiring data of position of at least one defective subpixel among the plurality of first subpixels, where the defective subpixel is supposed to emit predetermined light with a predetermined color. A wavelength conversion layer formation process includes providing a wavelength conversion layer over the second light-emitting element to convert emission light emitted from the second light-emitting element to the predetermined light with the predetermined color if the predetermined color is red or green.
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公开(公告)号：US20230215907A1
公开(公告)日：2023-07-06
申请号：US18176697
申请日：2023-03-01
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: An image display device manufacturing method according to an embodiment includes preparing a semiconductor layer, bonding the semiconductor layer to a first surface of a light-transmitting substrate, etching the semiconductor layer to form, on the first surface, a light-emitting element including a light-emitting surface and an upper surface provided on a side opposite to the light-emitting surface, forming a first insulating film covering the first surface and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film covering the first insulating film and the circuit element, forming a first via passing through the first insulating film and the second insulating film, and forming a first wiring layer on the second insulating film. The first via is located between and electrically connects the first wiring layer and the upper surface.
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公开(公告)号：US20220223776A1
公开(公告)日：2022-07-14
申请号：US17709006
申请日：2022-03-30
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
Abstract: An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a conductive layer including a portion made of a single crystal metal; forming, on the portion made of the single crystal metal, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.
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公开(公告)号：US20220149228A1
公开(公告)日：2022-05-12
申请号：US17582263
申请日：2022-01-24
Applicant: NICHIA CORPORATION
Inventor： Hajime AKIMOTO
Abstract: A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a light-transmitting substrate, a circuit element formed on the light-transmitting substrate, a wiring layer connectable to the circuit element, and a first insulating film covering the circuit element and the wiring layer; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the light-emitting element; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via. The wiring layer includes a light-reflective part. The light-emitting element is located on the light-reflective part.
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