Low loss SOI/CMOS compatible silicon waveguide and method of making the same
    42.
    发明申请
    Low loss SOI/CMOS compatible silicon waveguide and method of making the same 有权
    低损耗SOI / CMOS兼容硅波导及其制造方法

    公开(公告)号:US20070000862A1

    公开(公告)日:2007-01-04

    申请号:US11516217

    申请日:2006-09-06

    IPC分类号: B29D11/00 C23F1/00 B44C1/22

    CPC分类号: G02F1/025

    摘要: A method and structure for reducing optical signal loss in a silicon waveguide formed within a silicon-on-insulator (SOI) structure uses CMOS processing techniques to round the edges/corners of the silicon material along the extent of the waveguiding region. One exemplary set of processes utilizes an additional, sacrificial silicon layer that is subsequently etched to form silicon sidewall fillets along the optical waveguide, the fillets thus “rounding” the edges of the waveguide. Alternatively, the sacrificial silicon layer can be oxidized to consume a portion of the underlying silicon waveguide layer, also rounding the edges. Instead of using a sacrificial silicon layer, an oxidation-resistant layer may be patterned over a blanket silicon layer, the pattern defined to protect the optical waveguiding region. A thermal oxidation process is then used to convert the exposed portion of the silicon layer into silicon dioxide, forming a bird's beak structure at the edges of the silicon layer, thus defining the “rounded” edges of the silicon waveguiding structure.

    摘要翻译: 用于减少在绝缘体上硅(SOI)结构中形成的硅波导中的光信号损耗的方法和结构使用CMOS处理技术来沿着波导区域的范围舍入硅材料的边缘/角。 一个示例性的工艺集合利用附加的牺牲硅层,其随后被蚀刻以沿着光波导形成硅侧壁圆角,因此圆角“波浪”了波导的边缘。 或者,牺牲硅层可以被氧化以消耗下面的硅波导层的一部分,也是边缘的四周。 代替使用牺牲硅层,可以在覆盖硅层上图案化抗氧化层,所述图案被限定为保护光波导区域。 然后使用热氧化工艺将硅层的暴露部分转化成二氧化硅,在硅层的边缘处形成鸟的喙结构,从而限定硅波导结构的“圆形”边缘。

    Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling
    43.
    发明申请
    Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling 有权
    使用ev逝耦合将多个波长源连接到薄光波导上

    公开(公告)号:US20050094939A1

    公开(公告)日:2005-05-05

    申请号:US10935146

    申请日:2004-09-07

    IPC分类号: G02B20060101 G02B6/34

    摘要: An arrangement for achieving and maintaining high efficiency coupling of light between a multi-wavelength optical signal and a relatively thin (e.g., sub-micron) silicon optical waveguide uses a prism coupler in association with an evanescent coupling layer. A grating structure having a period less than the wavelengths of transmission is formed in the coupling region (either formed in the silicon waveguide, evanescent coupling layer, prism coupler, or any combination thereof) so as to increase the effective refractive index “seen” by the multi-wavelength optical signal in the area where the beam exiting/entering the prism coupler intercepts the waveguide surface (referred to as the “prism coupling surface”). The period and/or duty cycle of the grating can be controlled to modify the effective refractive index profile in the direction away from the coupling region so as to reduce the effective refractive index from the relatively high value useful in multi-wavelength coupling to the lower value associated with maintaining confinement of the optical signals within the surface waveguide structure, thus reducing reflections along the transition region.

    摘要翻译: 用于实现和维持多波长光信号和较薄(例如亚微米)硅光波导之间的高效率耦合的布置使用与渐逝耦合层相关联的棱镜耦合器。 在耦合区域(形成在硅波导,ev逝耦合层,棱镜耦合器或其任何组合中)形成具有小于透射波长的周期的光栅结构,以便通过“看到”来提高有效折射率 离开/进入棱镜耦合器的光束截取波导表面(称为“棱镜耦合表面”)的区域中的多波长光信号。 可以控制光栅的周期和/或占空比以在远离耦合区域的方向上改变有效折射率分布,以便将有效折射率从在多波长耦合中的有用折射率降低到较低的值 与保持表面波导结构内的光信号的限制相关联的值,从而减少沿着过渡区域的反射。

    Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
    47.
    发明申请
    Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors 审中-公开
    使用硅基车削镜的光电组件包装平台

    公开(公告)号:US20130188970A1

    公开(公告)日:2013-07-25

    申请号:US13745773

    申请日:2013-01-19

    IPC分类号: H04B10/12

    摘要: An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

    摘要翻译: 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件,并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征,转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准,其中盖板包括硅侧壁构件,其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖,撞击盖板的转向镜元件,然后沿着纵向轴线重新定向。

    Optical Components Including Bonding Slots For Adhesion Stability
    48.
    发明申请
    Optical Components Including Bonding Slots For Adhesion Stability 有权
    包括粘合槽的光学部件用于粘附稳定性

    公开(公告)号:US20130183010A1

    公开(公告)日:2013-07-18

    申请号:US13742483

    申请日:2013-01-16

    IPC分类号: G02B6/36 B32B37/12 G02B6/32

    摘要: An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

    摘要翻译: 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料(例如焊料或环氧树脂)附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽,多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。

    Coupling between free space and optical waveguide using etched coupling surfaces
    49.
    发明授权
    Coupling between free space and optical waveguide using etched coupling surfaces 有权
    使用蚀刻的耦合表面在自由空间和光波导之间耦合

    公开(公告)号:US08121450B2

    公开(公告)日:2012-02-21

    申请号:US12316540

    申请日:2008-12-11

    IPC分类号: G02B6/32 G02B6/26 G02B6/42

    CPC分类号: G02B6/32 G02B6/305 G02B6/327

    摘要: A plasma-based etching process is used to specifically shape the endface of an optical substrate supporting an optical waveguide into a contoured facet which will improve coupling efficiency between the waveguide and a free space optical signal. The ability to use standard photolithographic techniques to pattern and etch the optical endface facet allows for virtually any desired facet geometry to be formed—and replicated across the surface of a wafer for the entire group of assemblies being fabricated. A lens may be etched into the endface using a properly-defined photolithographic mask, with the focal point of the lens selected with respect to the parameters of the optical waveguide and the propagating free space signal. Alternatively, an angled facet may be formed along the endface, with the angle sufficient to re-direct reflected/scattered signals away from the optical axis.

    摘要翻译: 使用基于等离子体的蚀刻工艺来将支撑光波导的光学基板的端面特别地成形为轮廓刻面,这将提高波导与自由空间光信号之间的耦合效率。 使用标准光刻技术对光学端面小平面进行图案化和刻蚀的能力允许形成任何所需的刻面几何形状,并跨越制造的整组组件在晶片的表面上复制。 可以使用适当限定的光刻掩模将透镜蚀刻到端面中,相对于光波导的参数和传播的自由空间信号选择透镜的焦点。 或者,可以沿着端面形成成角度的小面,其角度足以将反射/散射信号重新引导远离光轴。