摘要:
An ultrasonic treatment apparatus includes an ultrasonic instrument, a fluid irrigation unit, a fluid suction unit, an ultrasonic driving control unit, and an irrigation/suction control unit. The ultrasonic instrument treats a living-body tissue through ultrasonic vibrations. The fluid irrigation unit supplies a cooling fluid for cooling the ultrasonic instrument to the ultrasonic instrument. The fluid suction unit sucks a cooling fluid irrigated by the fluid irrigation unit to the ultrasonic instrument. The ultrasonic driving control unit controls the driving of ultrasonic vibrations of the ultrasonic instrument. The irrigation/suction control unit sequentially controls the driving of the fluid irrigation unit and the driving of the fluid suction unit in accordance with the output of the ultrasonic driving control unit.
摘要:
The icon 348 of a graphic user interface indicates the magnitude of an inputted impact by an impact pointer 348d which moves as the time elapses and receives input of the impact. Magnitude of the impact received by a GUI 34 is retained in the impact data as a product of the moving amount of the impact pointer 348d and a scale factor, of which the value can be switched together with the indication form of a gauge 348c depending on the movement of a slider 348a. Consequently, more realistic regulation of impact, e.g., half shot, can be attained when a ball is hit in a sport simulation game such as a golf game.
摘要:
Pressing an electronic device (2) to be tested to contact terminals (132a and 132b) while bringing a heater (112) having equal or close temperature change characteristics to those of the electronic device to be tested by a test pattern, transmitting a test pattern to the electronic device to be tested in this state, and controlling a power consumption of a heater so that total power of a power consumption of the electronic device to be tested by the test pattern and a power consumption of the heater becomes a constant value.
摘要:
A shock detection optical fiber sensor includes: a plastic fiber; a corrugated plate having a plurality of protrusions arranged in the longitudinal direction of the plastic optical fiber and formed to oppose to the plastic optical fiber; a mold plate covering the plastic optical fiber and the corrugated plate; a light emitting element connected to one end of the plastic optical fiber; and a light receiving element connected to the other end of the plastic optical fiber.
摘要:
A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.
摘要:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.
摘要:
An upper conveyance guide is provided at an apparatus main body. A guide surface of a lower conveyance guide is provided facing a guide surface of the upper conveyance guide, and can be drawn out in the direction intersecting the sheet conveyance direction with respect to the apparatus main body. A cleaning unit is provided on the backside in the drawing-out direction of the lower conveyance guide, moves together with the lower conveyance guide when the lower conveyance guide is drawn out from the apparatus main body, and cleans the guide surface of the upper conveyance guide.
摘要:
An exhaust assembly is described for use in a plasma processing system, whereby secondary plasma is formed in the exhaust assembly between the processing space and chamber exhaust ports in order to reduce plasma leakage to a vacuum pumping system, or improve the uniformity of the processing plasma, or both. The exhaust assembly includes a powered exhaust plate in combination with a ground electrode is utilized to form the secondary plasma surrounding a peripheral edge of a substrate treated in the plasma processing system.
摘要:
In a vehicle bumper structure, an optical fiber sensor (32) is provided in a vehicle width direction on the front surface of a front-bumper reinforcement (30). A front-bumper absorber (28) is provided in front of the optical fiber sensor (32), the front-bumper absorber (28) formed of a soft absorber (54) and a hard absorber (56). The hard absorber is disposed at the bumper center region where the thickness of the bumper is increased. Accordingly, the thickness of the soft absorber (54) becomes substantially uniform in the vehicle width direction, so that a substantially uniform load is inputted to the optical fiber sensor (32) regardless of the collision position of the bumper with an object. As a result, variations in the output of the load-sensing unit are reduced.
摘要:
A semiconductor memory device includes: a memory cell array provided with a plurality of memory cells in a matrix; and a power supply circuit configured to supply an intermediate voltage between a power supply voltage and a ground voltage to each of the plurality of memory cells. The power supply circuit includes: a first intermediate voltage generating circuit configured to generate a first intermediate voltage between the power supply voltage and the ground voltage; a second intermediate voltage generating circuit configured to generate a second intermediate voltage between the power supply voltage and the ground voltage; a first output node to which the first intermediate voltage is supplied; a second output node to which the second intermediate voltage is supplied; and a connection control circuit provided between the first output node and the second output node. The first intermediate voltage generating circuit supplies the first intermediate voltage in response to a first control signal, and the second intermediate voltage generating circuit stops its operation in response to the first control signal. The connection control circuit connects the first output node and the second output node when the second intermediate voltage generating circuit stops its operation.