公开(公告)号：US09780083B1

公开(公告)日：2017-10-03

申请号：US15392755

申请日：2016-12-28

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L27/02 ,  H01L21/66 ,  H01L29/06 ,  G06F17/50 ,  G06F11/07

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one TS-short-related failure mode, one metal-short-related failure mode, and one AA-short-related failure mode.

公开(公告)号：US09748153B1

公开(公告)日：2017-08-29

申请号：US15475194

申请日：2017-03-31

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L29/417 ,  H01L29/06 ,  G06F11/07 ,  G06F17/50

CPC classification number: H01L22/26 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/14 ,  H01L22/20 ,  H01L22/34 ,  H01L23/528 ,  H01L27/0207 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725

Abstract: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of side-to-side shorts, and the second DOE contains fill cells configured to enable NC detection of tip-to-side shorts. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09741703B1

公开(公告)日：2017-08-22

申请号：US15391884

申请日：2016-12-28

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L27/02 ,  H01L21/66 ,  H01L29/417 ,  H01L29/06 ,  H01L23/528 ,  G06F17/50 ,  G06F11/07

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one GATE-short-related failure mode, one TS-short-related failure mode, and one AA-short-related failure mode.

公开(公告)号：US09728553B1

公开(公告)日：2017-08-08

申请号：US15371955

申请日：2016-12-07

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L27/02 ,  H01L27/118 ,  H01L23/528 ,  H01L23/522 ,  H01L29/45 ,  G01R31/28

CPC classification number: H01L22/26 ,  G01R31/2884 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/20 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/11803 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11885 ,  H01L2027/11887

Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one TS-short-related failure mode.

公开(公告)号：US20150270181A1

公开(公告)日：2015-09-24

申请号：US14612841

申请日：2015-02-03

Applicant: PDF Solutions, Inc.

Inventor： Indranil De ,  Dennis J. Ciplickas ,  Stephen Lam ,  Jonathan Haigh ,  Vyacheslav V. Rovner ,  Christopher Hess ,  Tomasz W. Brozek ,  Andrzej J. Strojwas ,  Kelvin Doong ,  John K. Kibarian ,  Sherry F. Lee ,  Kimon W. Michaels ,  Marcin A. Strojwas ,  Conor O'Sullivan ,  Mehul Jain

IPC: H01L21/66 ,  G01R31/26

CPC classification number: H01J37/222 ,  G01N23/2251 ,  G01R31/26 ,  G01R31/2644 ,  H01J37/147 ,  H01J37/20 ,  H01J37/285 ,  H01J2237/24592 ,  H01L22/12 ,  H01L22/20 ,  H01L22/30

Abstract: Product ICs/wafers include additional diagnostic, test, or monitoring structures opportunistically placed in filler cell positions, within tap cells, within decap cells, within scribe line areas, and/or within dummy fill regions. Improved fabrication processes utilize data from such structure(s) in wafer disposition decisions, rework decisions, process control, yield learning, or fault diagnosis.

Abstract translation: 产品IC /晶片包括机会性放置在填充单元位置，抽头单元内，分解单元内，划线区域内和/或虚拟填充区域内的附加诊断，测试或监视结构。 改进的制造工艺利用晶片配置决定，返工决定，过程控制，产量学习或故障诊断中的这种结构的数据。

公开(公告)号：US12038476B2

公开(公告)日：2024-07-16

申请号：US18144146

申请日：2023-05-05

Applicant: PDF SOLUTIONS, INC.

Inventor： Indranil De ,  Marian Mankos ,  Dennis Ciplickas ,  Christopher Hess ,  Jeremy Cheng ,  Balasubramanian Murugan ,  Qi Hu

IPC: G01R31/306 ,  G01R31/265 ,  G01R31/302

CPC classification number: G01R31/306 ,  G01R31/2653 ,  G01R31/3025

Abstract: Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.

公开(公告)号：US11075194B1

公开(公告)日：2021-07-27

申请号：US16458088

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  H01L21/8234 ,  H01J37/26 ,  H03K19/0944 ,  G01R31/28 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US10290552B1

公开(公告)日：2019-05-14

申请号：US16024054

申请日：2018-06-29

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L21/66 ,  H01L23/58 ,  H01L27/02 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.

公开(公告)号：US10211112B1

公开(公告)日：2019-02-19

申请号：US15936759

申请日：2018-03-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/58 ,  H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas.

公开(公告)号：US10199286B1

公开(公告)日：2019-02-05

申请号：US15942470

申请日：2018-03-31

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  H01L27/118 ,  H01L29/417 ,  H01L27/02 ,  H01L23/528 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, chamfer short, and corner short test areas.