摘要:
Provided is a photolithography apparatus including a photomask. The photomask includes a pattern having a plurality, of features, in an example, dummy line features. The pattern includes a first region being in the form of a localized on-grid array and a second region where at least one of the features has an increased width. The apparatus may include a second photomask which may define an active region. The feature with an increased width may be adjacent, and outside, the defined active region.
摘要:
For a 2-dimensional periodic array of contact holes or islands, a depth-of-focus-enhancement lithographic scheme based on a combination of alternating phase-shifting mask and off-axis illumination is revealed. The scheme is achieved by choosing appropriate off-axis illumination and smaller numerical aperture such that only two diffraction orders, which are of equal distance from the pupil center, are collected in the first exposure. The image of the 2-dimensional periodic array can be formed by superposing a second exposure on the first. In the second exposure, another appropriate off-axis illumination and smaller numerical aperture is chosen such that another two diffraction orders, which are also of equal distance from the pupil center, are collected.
摘要:
A semiconductor photolithography system to improve overlay accuracy is disclosed. Such a system can include an exposure tool, at least one track, and a number of photoresist modules. The exposure tool performs functionality related to both at least a front-end and a back-end wafer. Each track has one or more paths to and from the exposure tool. The photoresist modules each perform functionality related to photoresist, on only either the front-end wafer or the back-end wafer, not both. Each module is located on one of the tracks. More specifically, a two-track system is disclosed, where each track has a path to and from the exposure tool, and a single-track system is disclosed having two paths to and from the exposure tool.
摘要:
A method forming a protective (SiON or PE-Ox) dielectric anti-reflective coating (DARC) over a dielectric layer after a chemical-mechanical polish dielectric layer planarization process and before a chemical-mechanical polish of a conductive layer used in a contact or via plug formation. A dielectric layer is chemical-mechanical polished thereby creating microscratches in the dielectric layer. The invention's protective SiON or PE-OX DARC layer is formed over the dielectric layer whereby the protective SiON or PE-OX DARC layer fills in the microscratches. A first opening is etched in he protective layer and the dielectric layer. A conductive layer is formed over the protective layer and fills the first opening. The conductive layer is chemical-mechanical polished to remove the conductive layer from over the protective layer and to form an interconnect filling the first opening. The protective SiON or PE-OX DARC layer is used as a CMP stop thereby preventing microscratches in the dielectric layer.
摘要:
An embodiment of the instant invention is an optical illumination system for illuminating the mask of an exposure apparatus for transferring the image of the pattern on the mask onto the semiconductor wafer, the optical illumination system comprising: illumination means (illumination means 45 of FIG. 3) comprised of a plurality of light sources for emitting light beams along beam paths; and a lens system (lenses 55 and 57 of FIG. 3) for focusing the light beams to the wafer, the lens system comprising at least one lens element positioned in the beams paths. Preferably, the light sources are individually addressable point like sources, and the optical illumination system further comprising a light control means for operating each of the light sources independently of the others. The plurality of light sources is, preferably, comprised of a matrix addressable array of electro-optic modulators (preferably comprised of LCD modulators); an array of semiconductor lasers (preferably an array of Vertical Cavity Surface Emitting Lasers); or an array of bonded edge emitting DFB lasers.
摘要:
Reducing photoresist shrinkage by plasma treatment is disclosed. A semiconductor wafer having one or more photoresist layers is plasma treated, such as plasma curing, plasma etching, and/or high-density plasma etching the wafer. After plasma treating, one or more critical dimensions on the photoresist layers is measured using an electron beam, such as by using a scanning electron microscope (SEM). The plasma treating of the wafer prior to measuring the critical dimensions using the electron beam decreases shrinkage of the photoresist layer when using the electron beam.
摘要:
A method for forming a photomask and pellicle suitable for use in photolithography with incident electromagnetic radiation in a wavelength range from above 250 nm to below 150 nm. The opaque regions of the photomask are formed directly within a transparent F-doped quartz layer by either gallium ion staining using a focused ion beam (FIB) or by deposition of carbon atoms within trenches formed in the transparent layer, said carbon atom deposition being a result of the interaction of a FIB with styrene molecules. An alignment boundary formed on the resulting mask allows a hard pellicle to be fit directly over it so as to avoid warping.
摘要:
An improved microlithographic imaging system (100) is disclosed. The system comprises a filter (183) substantially aligned with a first image plane, adjacent to an aperture (185). The filter is formed in response to an image projected by a light source (110) through a reticle (160) onto the first image plane. The improved microlithographic imaging system has higher resolution and depth of focus than prior art imaging systems, due to the additional filtering performed by the filter (183). A filter in accordance with the invention can be fabricated easily and inexpensively, using conventional microlithography techniques. A filter in accordance with the invention can also be used to detect or correct flaws in the reticle (160).
摘要:
An embodiment of the instant invention is a mask having a pattern which is transferred to a layer overlying a semiconductor wafer, the mask comprising: a transmissive portion (structure 102 of FIG. 1), the transmissive portion allowing energy which impinges upon the transmission portion to substantially pass through the transmissive portion; a substantially non-transmissive portion (structure 106 of FIG. 1); a semi-transmissive portion (structure 104 of FIG. 1) situated between the transmissive portion and the substantially non-transmissive portion, energy passing through the semi-transmissive portion having a phase; and wherein the phase of energy which passes through the semi-transmissive portion is out of phase with the phase of energy which passes through the transmissive portion. Preferably, the phase of the energy which passes through the semi-transmissive portion is around 180 degrees out of phase with energy which passes through the transmissive portion.
摘要:
Provided is a method of fabricating a memory device. A substrate including an array region and a peripheral region is provided. A first feature and a second feature are formed in the array region. The first feature and the second feature have a first pitch. A plurality of spacers abutting each of the first feature and the second feature are formed. The plurality of spacers have a second pitch. A third feature in the peripheral region and a fourth and fifth feature in the array region are formed concurrently. The forth and fifth feature have the second pitch.