公开(公告)号：US20190157506A1

公开(公告)日：2019-05-23

申请号：US16259478

申请日：2019-01-28

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Mae Yi KIM ,  Jin Woong LEE ,  Yeo Jin YOON ,  Seom Geun LEE ,  Yong Woo RYU ,  Keum Ju Lee

IPC: H01L33/14 ,  H01L33/38 ,  H01L33/32 ,  H01L33/42 ,  H01L33/62

CPC classification number: H01L33/145 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62

Abstract: A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.

公开(公告)号：US20170301826A1

公开(公告)日：2017-10-19

申请号：US15490492

申请日：2017-04-18

Applicant: Seoul Viosys Co., Ltd.

Inventor： Keum Ju LEE ,  Seom Geun LEE ,  Kyoung Wan KIM ,  Yong Woo RYU ,  Mi Na JANG

IPC: H01L33/14 ,  H01L33/42 ,  H01L33/32 ,  H01L33/10 ,  H01L33/06 ,  H01L33/62 ,  H01L27/15

CPC classification number: H01L33/145 ,  H01L27/15 ,  H01L27/156 ,  H01L33/06 ,  H01L33/10 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: A light emitting diode includes: a substrate; a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer and an active layer interposed between the lower semiconductor layer and the upper semiconductor layer, the semiconductor stack having an isolation groove exposing the substrate through the upper semiconductor layer, the active layer and the lower semiconductor layer; a first electrode pad and an upper extension portion electrically connected to the upper semiconductor layer; a second electrode pad and a lower extension portion electrically connected to the lower semiconductor layer; a connecting portion connecting the upper extension portion and the lower extension portion to each other across the isolation groove; a first current blocking layer interposed between the lower extension portion and the lower semiconductor layer; and a second current blocking layer interposed between the second electrode pad and the lower semiconductor layer.

公开(公告)号：US20160247992A1

公开(公告)日：2016-08-25

申请号：US15147619

申请日：2016-05-05

Applicant: Seoul Viosys Co., Ltd.

Inventor： Se Hee OH ,  Mae Yi KIM ,  Seom Geun LEE ,  Myoung Hak YANG ,  Yeo Jin YOON

IPC: H01L33/62 ,  H01L33/42 ,  H01L33/38 ,  H01L33/08

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/14 ,  H01L33/385 ,  H01L33/387 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell separated from each other on a substrate, a first transparent electrode layer electrically connected to the first light emitting cell, an interconnection electrically connecting the first light emitting cell to the second light emitting cell, and a first insulation layer disposed on the first and second light emitting cells. The first transparent electrode layer is disposed on an upper surface of the first light emitting cell and partially covers a side surface of the first light emitting cell. The first insulation layer separates the first transparent electrode layer from the side surface of the first light emitting cell.

Abstract translation: 一种发光二极管，包括在基板上彼此分离的第一发光单元和第二发光单元，与第一发光单元电连接的第一透明电极层，将第一发光单元与第二发光单元电连接的第二 发光单元，以及设置在第一和第二发光单元上的第一绝缘层。 第一透明电极层设置在第一发光单元的上表面上，并且部分地覆盖第一发光单元的侧表面。 第一绝缘层将第一透明电极层与第一发光单元的侧表面分开。