公开(公告)号：US20240282803A1

公开(公告)日：2024-08-22

申请号：US18600228

申请日：2024-03-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62

Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.

公开(公告)号：US20240105686A1

公开(公告)日：2024-03-28

申请号：US18535545

申请日：2023-12-11

Applicant: Seoul Viosys Co., Ltd.

Inventor： Seong Kyu JANG ,  Seom Geun LEE ,  Chan Seob SHIN ,  Ho Joon LEE

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0093 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.

公开(公告)号：US20200343227A1

公开(公告)日：2020-10-29

申请号：US16855258

申请日：2020-04-22

Applicant: Seoul Viosys Co., Ltd

Inventor： Seong Kyu JANG ,  Seom Geun LEE ,  Chan Seob SHIN ,  Ho Joon LEE

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00

Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board, and a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices

公开(公告)号：US20200176641A1

公开(公告)日：2020-06-04

申请号：US16705770

申请日：2019-12-06

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Chan Seob SHIN ,  Myeong Hak YANG ,  Jin Woong LEE

IPC: H01L33/40 ,  H01L33/62 ,  H01L25/075

Abstract: A light emitting diode includes a first conductivity type semiconductor layer and a mesa disposed on the first conductivity type semiconductor layer wherein the mesa is a semiconductor stack including an active layer and a second conductivity type semiconductor layer; a ZnO layer disposed on the second conductivity type semiconductor layer; a lower insulation layer covering the ZnO layer and the mesa, and including an opening exposing the ZnO layer; a first pad metal layer disposed on the lower insulation layer, and electrically connected to the first conductivity type semiconductor layer; a second pad metal layer electrically connected to the ZnO layer through the opening of the lower insulation layer, and an upper insulation layer covering the first pad metal layer and the second pad metal layer.

公开(公告)号：US20170331020A1

公开(公告)日：2017-11-16

申请号：US15663219

申请日：2017-07-28

Applicant: Seoul Viosys Co., Ltd.

Inventor： Se Hee OH ,  Mae Yi KIM ,  Seom Geun LEE ,  Myoung Hak YANG ,  Yeo Jin YOON

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/38 ,  H01L33/08 ,  H01L33/42 ,  H01L33/14

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/14 ,  H01L33/385 ,  H01L33/387 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell separated from each other on a substrate, a first transparent electrode layer electrically connected to the first light emitting cell, an interconnection electrically connecting the first light emitting cell to the second light emitting cell, and a first insulation layer. The first transparent electrode layer is disposed on an upper surface of the first light emitting cell and partially covers a side surface of the first light emitting cell. The first insulation layer separates the first transparent electrode layer from the side surface of the first light emitting cell, and includes an opening to expose a lower semiconductor layer of the first light emitting cell.

公开(公告)号：US20160254314A1

公开(公告)日：2016-09-01

申请号：US15150863

申请日：2016-05-10

Applicant: Seoul Viosys Co., Ltd.

Inventor： Seom Geun LEE ,  Jong Kyu Kim ,  Yeo Jin Yoon ,  Jae Kwon Kim ,  Mae Yi Kim

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/42 ,  H01L33/00 ,  H01L33/10 ,  H01L33/32 ,  H01L33/06 ,  H01L33/62 ,  H01L33/14

CPC classification number: H01L27/15 ,  H01L27/156 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/08 ,  H01L33/10 ,  H01L33/14 ,  H01L33/145 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other to expose a surface of the substrate, a first transparent layer disposed on and electrically connected to the first light emitting cell, first connection section disposed on a portion of the first light emitting cell, a second connection section disposed on a portion of the second light emitting cell, a first interconnection and a second interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the first and second interconnections and a side surface of the first light emitting cell.

Abstract translation: 一种发光二极管，包括第一发光单元和设置在基板上并彼此间隔开以暴露基板的表面的第二发光单元，设置在第一发光单元上并电连接到第一发光单元的第一透明层， 设置在第一发光单元的一部分上的第一连接部，设置在第二发光单元的一部分上的第二连接部，电连接第一发光单元和第二发光单元的第一互连和第二互连， 以及设置在第一和第二互连之间的绝缘层和第一发光单元的侧表面。

公开(公告)号：US20250062295A1

公开(公告)日：2025-02-20

申请号：US18936534

申请日：2024-11-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Kyu JANG ,  Yong Woo RYU ,  Seom Geun LEE ,  Cha E KIM

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L33/00 ,  H01L33/32 ,  H01L33/38 ,  H01L33/46

Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.

公开(公告)号：US20230387085A1

公开(公告)日：2023-11-30

申请号：US18231614

申请日：2023-08-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L24/16 ,  H01L2224/16505 ,  H01L2224/16227

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20220367427A1

公开(公告)日：2022-11-17

申请号：US17866249

申请日：2022-07-15

Applicant: Seoul Viosys Co., Ltd

Inventor： Seong Kyu JANG ,  Seom Geun LEE ,  Chan Seob SHIN ,  Ho Joon LEE

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/00 ,  H01L33/62

Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.

公开(公告)号：US20220336428A1

公开(公告)日：2022-10-20

申请号：US17722369

申请日：2022-04-17

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Seong Kyu JANG ,  Yong Woo RYU ,  Seom Geun LEE ,  Cha E KIM

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46 ,  H01L33/38

Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.