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公开(公告)号:US20190319365A1
公开(公告)日:2019-10-17
申请号:US16380512
申请日:2019-04-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunjin KIM , Seungtae KO , Yoongeon KIM , Youngju LEE
Abstract: An antenna device and a unit-cell structure for an electronic device are provided. The antenna device includes at least one unit-cell that includes a dielectric body having a member with a degree of permittivity, and a perforated unit penetrating upper and lower surfaces of the dielectric body.
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公开(公告)号:US20190252788A1
公开(公告)日:2019-08-15
申请号:US16331131
申请日:2017-08-23
Applicant: Samsung Electronics Co., Ltd
Inventor: Yoongeon KIM , Seungtae KO , Sangho LIM
CPC classification number: H01Q13/10 , H01Q1/22 , H01Q1/3283 , H01Q13/106 , H01Q19/13
Abstract: Disclosed are an antenna device and a method for operating same according to various embodiments, wherein the antenna device includes: a slot formed by a first ground pattern, a second ground pattern, a third ground pattern, and a fourth ground pattern; a power supply part formed on a different surface from the surface in which the slot is formed; and a metal pattern disposed extending a predetermined distance from the power supply part and forming a vertically polarized wave. The metal pattern may be disposed at a predetermined angle to the surface in which the slot is formed. Accordingly, the antenna device may emit an electric wave even in a narrow mounting area of the antenna.
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公开(公告)号:US20180175901A1
公开(公告)日:2018-06-21
申请号:US15834627
申请日:2017-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinsu HEO , Seungtae KO , Sangho LIM
CPC classification number: H04B1/40 , H05K1/0219 , H05K1/0243 , H05K1/025 , H05K1/0251 , H05K1/0298 , H05K2201/0715 , H05K2201/09618 , H05K2201/09672 , H05K2201/0979 , H05K2201/10098
Abstract: A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.
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公开(公告)号:US20180138587A1
公开(公告)日:2018-05-17
申请号:US15796103
申请日:2017-10-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoongeon KIM , Seungtae KO , Taesik YANG , Juneyong YOUNG
CPC classification number: H01Q1/3266 , H01Q1/42 , H01Q5/30 , H01Q9/0407 , H01Q15/0013 , H01Q19/06 , H01Q19/104 , H04B7/043 , H04B7/0617
Abstract: A beamforming antenna assembly is provided. The beamforming antenna assembly includes a mirror glass coated with a material, and a beamforming antenna disposed on a portion of the mirror glass. A pattern is formed on the portion of the mirror glass so that a beam radiated from the beamforming antenna passes therethrough.
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公开(公告)号:US20250038426A1
公开(公告)日:2025-01-30
申请号:US18918817
申请日:2024-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seokmin LEE , Yoongeon KIM , Seungho CHOI , Seungtae KO , Jungyub LEE , Jun HUR
Abstract: An electronic device is provided. The electronic device includes an antenna substrate and an antenna array comprising a sub array, the sub array includes a plurality of antenna elements, feeding network circuitry including a first power divider for first polarization and a second power divider for second polarization, which differs from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the sub array is disposed on a first surface of the antenna substrate, and wherein the feeding network circuitry disposed on the first side or a second side opposite to the first side of the antenna substrate, and wherein the network circuitry for decoupling is disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.
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公开(公告)号:US20230198161A1
公开(公告)日:2023-06-22
申请号:US18102497
申请日:2023-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungmin PARK , Hyunjin KIM , Seungtae KO , Yoongeon KIM , Bumhee LEE , Jungi JEONG
CPC classification number: H01Q21/0006 , H01Q5/307 , H01Q1/246 , H01Q9/0421 , H01Q21/26
Abstract: An antenna module includes: a first antenna unit, a second antenna unit, and a third antenna unit, each of the first antenna unit, the second antenna unit, and the third antenna unit including a first antenna element and a second antenna element that are crossed diagonally with each other; a first signal distributor configured to distribute a first radio frequency (RF) signal to the first antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; a second signal distributor configured to distribute a second RF signal to the second antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; and first stub circuits connected to line tracks of the first signal distributor connected to the first antenna unit, the second antenna unit, and the third antenna unit.
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公开(公告)号:US20230198138A1
公开(公告)日:2023-06-22
申请号:US18109476
申请日:2023-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungi JEONG , Seungtae KO , Jongmin LEE , Yoongeon KIM , Bumhee LEE , Youngju LEE , Seungho CHOI
CPC classification number: H01Q1/42 , H01Q1/246 , H01Q9/0407 , H01Q21/06
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the present disclosure, an electronic device may include: a printed circuit board (PCB); an antenna; a radome; and a coupling structure, the antenna may be disposed to be positioned at a first height from a first surface of the PCB, the coupling structure may be physically connected with the radome, and the coupling structure may be disposed to have a second height lower than or equal to the first height, with respect to the first surface of the PCB.
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公开(公告)号:US20230112285A1
公开(公告)日:2023-04-13
申请号:US18075850
申请日:2022-12-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumhee LEE , Seungtae KO , Junsig KUM , Yoongeon KIM , Seokmin LEE , Youngju LEE , Jongmin LEE , Seungho CHOI
Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.
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公开(公告)号:US20210344120A1
公开(公告)日:2021-11-04
申请号:US17373000
申请日:2021-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号:US20210126379A1
公开(公告)日:2021-04-29
申请号:US17062990
申请日:2020-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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