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60 条记录 (耗时 0.028 秒)

    Backlight unit and method of driving the same
    45.
    发明申请
    Backlight unit and method of driving the same 失效
    背光单元及其驱动方法

    公开(公告)号：US20090072119A1

    公开(公告)日：2009-03-19

    申请号：US12000959

    申请日：2007-12-19

    申请人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

    发明人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

    IPC分类号： G01J1/44

    CPC分类号： G01J5/60 ,  G01J1/32 ,  G01J2001/4252

    摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.

    摘要翻译： 提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED） 具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

    Fanless high-efficiency cooling device using ion wind
    47.
    发明授权
    Fanless high-efficiency cooling device using ion wind 有权
    无风扇高效冷却装置采用离子风

    公开(公告)号：US07190587B2

    公开(公告)日：2007-03-13

    申请号：US10995508

    申请日：2004-11-24

    申请人： Joong El Kim ,  Alexander T. Kynin ,  Jung Kyu Park ,  Si Young Yang

    发明人： Joong El Kim ,  Alexander T. Kynin ,  Jung Kyu Park ,  Si Young Yang

    IPC分类号： H05K7/20 ,  H01J17/28 ,  F28F13/16

    CPC分类号： H05K7/20972 ,  H05K7/20172

    摘要： Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanless high-efficiency cooling device using ion wind comprises a heat sink having a fixing part fixedly attached to a heat-generating part of an electronic product and a plurality of protrusions extending a predetermined height from a bottom surface of the fixing part, a cover that covers the upper part of the heat sink, at least one electric wire for generating ion wind between the corresponding protrusions when high voltage is applied to the electric wire, an electric wire-supporting member that supports both ends of the electric wire, and a power supply that connects a high-voltage terminal to the electric wire and connects a ground terminal to the heat sink to supply high voltage to the electric wire.

    摘要翻译： 这里公开了一种无风扇式高效率冷却装置，其适用于具有等离子体显示面板（PDP）电视机，液晶显示器（LCD）电视机，液晶显示器（LCD））监视器等热源的电子产品。 使用离子风的无风扇式高效冷却装置包括：散热器，其具有固定部，固定部固定在电子产品的发热部上;多个突出部，其从固定部的底面延伸规定的高度;盖 覆盖散热器的上部的至少一个电线，当对电线施加高压时，至少一根电线用于在相应的突起之间产生离子风;支撑电线的两端的电线支撑件，以及 电源，其将高压端子与电线连接，并将接地端子连接到散热器，以向电线提供高电压。

    Light emitting diode device, light emitting apparatus and method of manufacturing light emitting diode device
    48.
    发明授权
    Light emitting diode device, light emitting apparatus and method of manufacturing light emitting diode device 有权

    公开(公告)号：US08460952B2

    公开(公告)日：2013-06-11

    申请号：US12903911

    申请日：2010-10-13

    申请人： Jung Kyu Park

    发明人： Jung Kyu Park

    IPC分类号： H01L21/00

    CPC分类号： H01L33/50 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

    HIGH POWER LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME
    50.
    发明申请
    HIGH POWER LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME 有权
    大功率发光二极管封装及其制造方法

    公开(公告)号：US20090311811A1

    公开(公告)日：2009-12-17

    申请号：US12548565

    申请日：2009-08-27

    申请人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

    发明人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

    IPC分类号： H01L21/56

    CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

    摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。