Abstract:
Mercury is removed from a liquid hydrocarbon fraction by effecting high-temperature heat treatment to convert an organic mercury compound into an inorganic mercury compound or elemental mercury, removing a higher molecular weight component from the fraction, removing water from the fraction, and thereafter contacting the fraction with an adsorbent in the form of active carbon having calcium or a calcium compound supported thereon. Although only a minor amount of mercury is contained in the liquid hydrocarbon fraction, mercury can be efficiently removed at low cost on an industrial large scale, achieving an extremely low mercury concentration.
Abstract:
A cooling liquid temperature control system for an internal combustion engine cooled by a cooling liquid which in turn is cooled by a heat exchanger, wherein a primary bypass opened and closed by a low operating temperature thermostat valve and a secondary bypass opened and closed by a control valve are branched from a cooling liquid outlet passage connected between an engine jacket and the heat exchanger. The control valve can be opened depending on the degree of the opening of the throttle valve. The secondary bypass is branched from the cooling liquid outlet passage. The two passages are respectively opened and closed by a high operating temperature thermostat valve. The secondary bypass is communicated with the primary bypass and the other passage communicated with the heat exchanger. During normal engine operation with small throttle opening, the cooling liquid flows from the secondary bypass to the primary bypass through one passage, to be returned to the engine jacket while being kept at high temperature. At large throttle opening range, the cooling liquid flows to the heat exchanger through the other passage while the secondary bypass is closed, and has its temperature reduced before being returned to the engine jacket.
Abstract:
A multi-wavelength semiconductor laser device includes a plate stem; a prism shaped submount with a bottom face on a face of the stem; laser diodes having emission wavelengths different from each other are mounted on lateral sides of the submount so that their respective emission points are positioned at substantially the same distance from a center axis of the stem; and lead pins penetrating the stem are located along and opposite edge lines between adjacent pairs of the lateral sides of the submount.
Abstract:
The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 Ω·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.
Abstract:
A semiconductor laser device can suppress electrode-to-electrode resonance of laser light emitted from an active layer, increasing electrical conversion efficiency. The semiconductor laser device has a substrate and an active layer. The energy of the laser light emitted from the active layer is smaller than the band gap energy of the substrate, and the carrier concentration of the substrate is at least 2.2×1018 cm−3.
Abstract translation:半导体激光器件可以抑制从有源层发射的激光的电极到电极的共振,从而提高电转换效率。 半导体激光器件具有衬底和有源层。 从有源层发射的激光的能量小于衬底的带隙能量,衬底的载流子浓度至少为2.2×10 18 cm -3。
Abstract:
A method for manufacturing a nitride semiconductor light-emitting element comprises: forming a semiconductor laminated structure wherein an n-type nitride semiconductor epitaxial layer, an active layer, and a p-type nitride semiconductor epitaxial layer are laminated on a substrate; forming a p-type electrode having a first electrode layer containing Pd and a second electrode layer containing Ta on the p-type nitride semiconductor epitaxial layer; heat treating at a temperature between 400° C. and 600° C. in ambient containing oxygen after forming the p-type electrode; and forming a pad electrode containing Au on the p-type electrode after the heat treating.
Abstract:
A semiconductor laser device can suppress electrode-to-electrode resonance of laser light emitted from an active layer, increasing electrical conversion efficiency. The semiconductor laser device has a substrate and an active layer. The energy of the laser light emitted from the active layer is smaller than the band gap energy of the substrate, and the carrier concentration of the substrate is at least 2.2×1018 cm−3.
Abstract translation:半导体激光器件可以抑制从有源层发射的激光的电极到电极的共振,从而提高电转换效率。 半导体激光器件具有衬底和有源层。 从有源层发射的激光的能量小于衬底的带隙能量,衬底的载流子浓度至少为2.2×10 18 cm -3。
Abstract:
A method for manufacturing a nitride semiconductor device, comprises: epitaxially growing a semiconductor layer of a GaN-based material on the Ga surface of a GaN substrate while the GaN substrate is mounted on a substrate holder the substrate warping during the epitaxial growth so that a epitaxial deposit is deposited on the N surface of the substrate; and subjecting the N surface of the GaN substrate to vacuum suction after the epitaxial growth of the semiconductor layer; removing the epitaxial deposit from the N side of the GaN substrate after the semiconductor layer has been epitaxially grown, and before the N surface of the n-type GaN substrate is subjected to vacuum suction.
Abstract:
A method of manufacturing semiconductor laser device including a GaN wafer includes forming a semiconductor layer on the GaN wafer and on which ridge portions are formed. Grooves are formed in the semiconductor layer such that each groove is disposed in line with the scribe marks, between each of the ridge portions and an upstream scribe mark. The grooves are curved and convex outwardly towards a downstream side, and each groove has an apex on a cleavage line. The side extending from the apex preferably does not form an angle of 60 degrees with respect to a cleavage direction or the cleavage line.
Abstract:
A communication controller of the present invention includes a descriptor cache mechanism which makes a virtual descriptor gather list from the descriptor indicted from a host, and which allows a processor to refer to a portion of the virtual descriptor gather list in a descriptor cache window. Another communication controller of the present invention includes a second processor which allocates any communication process related with a first communication unit of the communication processes to the first one of a first processors and any communication process related with a second communication unit of the communication processes to the second one of the first processors. Another communication controller includes a first memory which stores control information. The first memory includes a first area accessed by the associated one of processors to refer to the control information and a second area which stores the control information during the access.