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公开(公告)号:US20230197153A1
公开(公告)日:2023-06-22
申请号:US17580591
申请日:2022-01-20
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Yen Tseng , Yu-Tse Kuo , Shu-Ru Wang , Chun-Hsien Huang , Hsin-Chih Yu , Meng-Ping Chuang , Li-Ping Huang , Yu-Fang Chen
IPC: G11C15/04
CPC classification number: G11C15/04
Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.
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公开(公告)号:US20230020795A1
公开(公告)日:2023-01-19
申请号:US17952337
申请日:2022-09-26
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Yen Tseng , Shu-Ru Wang , Yu-Tse Kuo , Chang-Hung Chen , Yi-Ting Wu , Shu-Wei Yeh , Ya-Lan Chiou , Chun-Hsien Huang
Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
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公开(公告)号:US20220238158A1
公开(公告)日:2022-07-28
申请号:US17179418
申请日:2021-02-19
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Hsien Huang , Yu-Tse Kuo , Shu-Ru Wang , Chun-Yen Tseng , Chun-Chieh Chang
IPC: G11C15/04
Abstract: A ternary content addressable memory and a two-port SRAM are provided and include a storage cell and two transistors. The storage cell includes a first active region, a second active region, a third active region, and a fourth active region, extending along a first direction, and a first gate line, a second gate line, a third gate line, and a fourth gate line extending along a second direction. The first gate line crosses the third active region and the fourth active region, the second gate line crosses the fourth active region, the third gate line crosses the first active region, and the fourth gate line crosses the first active region and the second active region. The transistors are electrically connected to the storage cell, and the transistors and the storage cell are arranged along the first direction.
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公开(公告)号:US10522551B2
公开(公告)日:2019-12-31
申请号:US15884063
申请日:2018-01-30
Applicant: United Microelectronics Corp.
Inventor: Chun-Hsien Huang , Ching-Cheng Lung , Yu-Tse Kuo , Chang-Hung Chen , Shu-Ru Wang , Wei-Chi Lee , Chun-Yen Tseng
IPC: H01L27/11 , H01L27/092 , G11C11/41 , H01L23/522 , H01L27/02
Abstract: A semiconductor device includes a first circuit structure and a second circuit structure. The first circuit structure has a first line terminal. The second circuit structure has a second line terminal. The first line terminal and the second line terminal are formed in a first circuit layer but separated by a gap. A conductive structure is forming in a second circuit layer above or below the first circuit layer, to electrically connect the first line terminal and the second line terminal.
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公开(公告)号:US10068909B1
公开(公告)日:2018-09-04
申请号:US15795270
申请日:2017-10-27
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Yen Tseng , Ching-Cheng Lung , Yu-Tse Kuo , Chun-Hsien Huang , Chien-Hung Chen
IPC: G11C11/412 , G11C11/40 , H01L27/11 , H01L27/02 , H01L23/528 , G11C11/419 , H01L29/423 , H01L29/08 , H01L27/088
Abstract: The present invention provides a layout pattern of a memory device composed of static random access memory (SRAM), comprising four memory units located on a substrate, each memory unit being located in a non-rectangular region, the four non-rectangular regions combine a rectangular region, wherein each memory unit comprises a first inverter comprising a first pull-up transistor (PL1) and a first pull-down transistor (PD1), a second inverter comprises a second pull-up transistor (PL2) and a second pull-down transistor (PD2), an access transistor (PG) and a switching transistor (SW), wherein the source of the PG is coupled to an input terminal of the first inverter and a drain of the SW, a source of the SW is coupled to an output of the second inverter, wherein the PD1, the PD2, the SW, and the PG comprise a first diffusion region, the PL1 and the PL2 comprise a second diffusion region.
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公开(公告)号:US10026726B2
公开(公告)日:2018-07-17
申请号:US15604685
申请日:2017-05-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ching-Wen Hung , Chih-Sen Huang , Shih-Fang Tzou , Yi-Wei Chen , Yung-Feng Cheng , Li-Ping Huang , Chun-Hsien Huang , Chia-Wei Huang , Yu-Tse Kuo
IPC: H01L21/8238 , H01L21/768 , H01L27/11 , H01L29/78 , H01L29/66 , H01L27/092 , H01L27/02
Abstract: Semiconductor devices and method of manufacturing such semiconductor devices are provided for improved FinFET memory cells to avoid electric short often happened between metal contacts of a bit cell, where the meal contacts are positioned next to a dummy gate of a neighboring dummy edge cell. In one embodiment, during the patterning of a gate layer on a substrate surface, an improved gate slot pattern is used to extend the lengths of one or more gate slots adjacent bit lines so as to pattern and sectionalize a dummy gate line disposed next to metal contacts of an active memory cell. In another embodiment, during the patterning of gate lines, the distances between one or more dummy gates lines disposed adjacent an active memory cell are adjusted such that their locations within dummy edge cells are shifted in position to be away from metal contacts of the active memory cell.
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公开(公告)号:US10020049B1
公开(公告)日:2018-07-10
申请号:US15413436
申请日:2017-01-24
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Yen Tseng , Ching-Cheng Lung , Yu-Tse Kuo , Chun-Hsien Huang , Chih-Wei Tsai
IPC: G11C11/419 , G11C11/418
Abstract: The present invention provides a six transistor static random-access memory (6T-SRAM) cell, the 6T-SRAM cell includes a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor.
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公开(公告)号:US20180190344A1
公开(公告)日:2018-07-05
申请号:US15413436
申请日:2017-01-24
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Yen Tseng , Ching-Cheng Lung , Yu-Tse Kuo , Chun-Hsien Huang , Chih-Wei Tsai
IPC: G11C11/419 , G11C11/418
CPC classification number: G11C11/419 , G11C11/412 , G11C11/418
Abstract: The present invention provides a six transistor static random-access memory (6T-SRAM) cell, the 6T-SRAM cell includes a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor.
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公开(公告)号:US09953988B2
公开(公告)日:2018-04-24
申请号:US15635165
申请日:2017-06-27
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Hsien Huang , Yu-Tse Kuo , Shu-Ru Wang
IPC: H01L21/336 , H01L27/11 , H01L29/78 , H01L29/66
CPC classification number: H01L29/6681 , H01L27/1104 , H01L27/1116 , H01L29/785
Abstract: A static random-access memory (SRAM) cell array forming method includes the following steps. A plurality of fin structures are formed on a substrate, wherein the fin structures include a plurality of active fins and a plurality of dummy fins, each PG (pass-gate) FinFET shares at least one of the active fins with a PD (pull-down) FinFET, and at least one dummy fin is disposed between the two active fins having two adjacent pull-up FinFETs thereover in a static random-access memory cell. At least a part of the dummy fins are removed. The present invention also provides a static random-access memory (SRAM) cell array formed by said method.
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公开(公告)号:US20170373073A1
公开(公告)日:2017-12-28
申请号:US15686169
申请日:2017-08-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chun-Hsien Huang , Yu-Tse Kuo , Shu-Ru Wang
CPC classification number: H01L29/6681 , H01L27/1104 , H01L27/1116 , H01L29/785
Abstract: A static random-access memory (SRAM) cell array forming method includes the following steps. A plurality of fin structures are formed on a substrate, wherein the fin structures include a plurality of active fins and a plurality of dummy fins, each PG (pass-gate) FinFET shares at least one of the active fins with a PD (pull-down) FinFET, and at least one dummy fin is disposed between the two active fins having two adjacent pull-up FinFETs thereover in a static random-access memory cell. At least a part of the dummy fins are removed. The present invention also provides a static random-access memory (SRAM) cell array formed by said method.
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