公开(公告)号：US20100129963A1

公开(公告)日：2010-05-27

申请号：US12694239

申请日：2010-01-26

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L21/60

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

公开(公告)号：US20090097119A1

公开(公告)日：2009-04-16

申请号：US12143943

申请日：2008-06-23

申请人： Chen Peng ,  William Wang ,  Chung-Cheng Chou ,  Fung-Hsu Wu ,  Long Hsu ,  Cheng-Hsien Liu ,  Sheng-Yang Tseng

发明人： Chen Peng ,  William Wang ,  Chung-Cheng Chou ,  Fung-Hsu Wu ,  Long Hsu ,  Cheng-Hsien Liu ,  Sheng-Yang Tseng

IPC分类号： G02B27/42

CPC分类号： G02B21/32 ,  G02B27/42 ,  G02B27/4233

摘要： A diffraction micro flow structure and optical tweezers using the same are provided. The diffraction micro flow structure comprises a substrate and a diffraction part. The substrate comprises at least a flow path. The diffraction part is disposed on the substrate. The diffraction part comprises a diffraction optical element. After light passes through the diffraction optical element, the light is focused in the flow path and forms an optical field.

摘要翻译： 提供衍射微流结构和使用其的光学镊子。 衍射微流结构包括基底和衍射部分。 衬底包括至少一个流动路径。 衍射部分设置在基板上。 衍射部分包括衍射光学元件。 光通过衍射光学元件后，光在流路中聚焦并形成光场。

公开(公告)号：US20120033211A1

公开(公告)日：2012-02-09

申请号：US13204132

申请日：2011-08-05

申请人： William Wang ,  Chung-Cheng Chou ,  Che-Liang Tsai

发明人： William Wang ,  Chung-Cheng Chou ,  Che-Liang Tsai

IPC分类号： G01N21/55 ,  G01J3/28

CPC分类号： G01N21/4795 ,  A61B5/0066 ,  A61B5/0073 ,  G01B9/02019 ,  G01B9/02027 ,  G01B9/02091 ,  G01B2290/45

摘要： A large area optical diagnosis apparatus and the operating method thereof are disclosed. The large area optical diagnosis apparatus includes a light source, a light path structure, and a sensing module. The light source is used to at least emit a coherent light. The light path structure includes a plurality of optical units used for dividing the coherent light into a plurality of first incident lights and a plurality of second incident lights. The plurality of first incident lights are emitted toward an object to be diagnosed and the plurality of second incident lights are emitted toward a reference end. The object to be diagnosed and the reference end reflect the plurality of first incident lights and the plurality of second incident lights to be a plurality of reflected lights. The sensing module senses the plurality of reflected lights to generate a sensing result related to the object to be diagnosed.

摘要翻译： 公开了一种大面积光诊断装置及其操作方法。 大面积光诊断装置包括光源，光路结构和感测模块。 光源用于至少发出相干光。 光路结构包括用于将相干光分为多个第一入射光和多个第二入射光的多个光学单元。 多个第一入射光朝向被诊断对象发射，并且多个第二入射光朝向参考端发射。 要诊断的对象和参考端将多个第一入射光和多个第二入射光反射成多个反射光。 感测模块​​感测多个反射光以产生与被诊断对象相关的感测结果。

公开(公告)号：US20110306835A1

公开(公告)日：2011-12-15

申请号：US13157832

申请日：2011-06-10

申请人： Chung-Cheng Chou ,  William Wang

发明人： Chung-Cheng Chou ,  William Wang

IPC分类号： A61B1/005

CPC分类号： A61B1/008 ,  A61B1/0051 ,  A61B1/0125

摘要： An endoscopy apparatus having high degree of motion freedom and the operating method thereof are disclosed. The endoscopy apparatus having high degree of motion freedom includes a multi-stage endoscopy module and a control module. The multi-stage endoscopy module includes at least a first endoscopy unit and a second endoscopy unit. The first endoscopy unit and the second endoscopy unit can provide a first bending and a second bending respectively. The second bending is larger than the first bending. When the multi-stage endoscopy module moves to a region near a target observing position, the control module will control the second endoscopy unit to generate slight deformation to observe a real-time state of the target observing position.

摘要翻译： 公开了具有高自由度的内窥镜装置及其操作方法。 具有高度运动自由度的内窥镜检查装置包括多级内窥镜检查模块和控制模块。 所述多级内窥镜检查模块至少包括第一内窥镜检查单元和第二内窥镜检查单元。 第一内镜检查单元和第二内窥镜检查单元可以分别提供第一弯曲和第二弯曲。 第二次弯曲大于第一次弯曲。 当多级内窥镜模块移动到目标观察位置附近的区域时，控制模块将控制第二内窥镜单元产生轻微的变形以观察目标观察位置的实时状态。

公开(公告)号：US07829388B2

公开(公告)日：2010-11-09

申请号：US12694239

申请日：2010-01-26

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L21/00

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

公开(公告)号：US07804169B2

公开(公告)日：2010-09-28

申请号：US12102439

申请日：2008-04-14

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L23/10

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

公开(公告)号：US20090179326A1

公开(公告)日：2009-07-16

申请号：US12106148

申请日：2008-04-18

申请人： Ko-Yang Tso ,  Chung-Cheng Chou ,  William Wang ,  Chia-Hung Hsu

发明人： Ko-Yang Tso ,  Chung-Cheng Chou ,  William Wang ,  Chia-Hung Hsu

IPC分类号： H01L23/49

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides a semiconductor device package. The package includes a chip disposed on a supported board and a conductive path formed between the chip and the supported board, on the backside of the supported board, or on the chip, so that the conductive path does not have to go around a region where the chip is located. Accordingly, the dimensions of the semiconductor device package are reduced.

摘要翻译： 本发明提供一种半导体器件封装。 该封装包括设置在支撑板上的芯片和形成在芯片和支撑板之间，支撑板的背面或芯片上的导电路径，使得导电路径不必绕过 芯片位于。 因此，半导体器件封装的尺寸减小。

公开(公告)号：US20080302664A1

公开(公告)日：2008-12-11

申请号：US12155274

申请日：2008-06-02

申请人： Cheng-Hsien Liu ,  Long Hsu ,  Kuang-Han Chu ,  William Wang ,  Chung-Cheng Chou

发明人： Cheng-Hsien Liu ,  Long Hsu ,  Kuang-Han Chu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： C02F1/469

CPC分类号： G01N27/44713 ,  C02F1/469 ,  C02F2001/46152 ,  C02F2201/4613 ,  G01N2030/285

摘要： An apparatus for driving a fluid includes a substrate, at least one electrode group and a controlling unit. The substrate has at least one plane. The electrode group is disposed on the substrate and includes a first electrode, a second electrode and a third electrode. A projecting position of the second electrode on the plane is disposed between that of the first electrode and that of the third electrode. The controlling unit electrically connected to electrode group is for driving the first to third electrodes. When the controlling unit drives the first to third electrodes to make the first and third electrodes have opposite polarities and to make the second and third electrodes have the same polarity, an electric field produced by the electrode group enables the fluid on the substrate to flow from the first electrode to the third electrode.

摘要翻译： 用于驱动流体的装置包括基板，至少一个电极组和控制单元。 衬底具有至少一个平面。 电极组设置在基板上，并且包括第一电极，第二电极和第三电极。 平面上的第二电极的突出位置设置在第一电极和第三电极的突出位置之间。 电连接到电极组的控制单元用于驱动第一至第三电极。 当控制单元驱动第一至第三电极以使第一和第三电极具有相反的极性并且使得第二和第三电极具有相同的极性时，由电极组产生的电场使得基板上的流体能够从 第一电极到第三电极。

公开(公告)号：US20070091133A1

公开(公告)日：2007-04-26

申请号：US11536148

申请日：2006-09-28

申请人： Chung-Cheng Chou ,  William Wang ,  Chen Peng

发明人： Chung-Cheng Chou ,  William Wang ,  Chen Peng

IPC分类号： B41J29/38

CPC分类号： B41J29/393 ,  B41J2/14137 ,  B41J2/14153 ,  B41J2/1606

摘要： The invention provides a microinjection apparatus for a fluid. The microinjection apparatus comprises a substrate, a manifold, at least one fluid chamber, and at least one thermal sensing film. The manifold is formed on the substrate for containing the fluid therein. The at least one fluid chamber is also formed on the substrate and in communication with the manifold. Furthermore, the fluid chamber has a respective orifice and a respective heater disposed adjacent to the orifice. In addition, the thermal sensing film corresponds to the fluid chamber and is formed on a surface adjacent to the orifice. It should be noticed that the thermal sensing film has a respective color changeable in response to a heat generated during operation of the corresponding heater.

摘要翻译： 本发明提供一种用于流体的显微注射装置。 显微注射装置包括基板，歧管，至少一个流体室和至少一个热敏膜。 歧管形成在基板上，用于在其中容纳流体。 至少一个流体室也形成在基板上并与歧管连通。 此外，流体室具有相应的孔口和邻近孔口设置的相应加热器。 此外，热敏膜对应于流体室，并且形成在与孔口相邻的表面上。 应该注意的是，热敏膜具有响应于相应加热器的操作期间产生的热而可以变化的相应颜色。

公开(公告)号：US08258461B2

公开(公告)日：2012-09-04

申请号：US12219871

申请日：2008-07-30

申请人： Long Hsu ,  Cheng-Hsien Liu ,  Sheng-Yang Tseng ,  William Wang ,  Chung-Cheng Chou ,  Fung-Hsu Wu ,  Chen Peng ,  Ta-Yuan Lee

发明人： Long Hsu ,  Cheng-Hsien Liu ,  Sheng-Yang Tseng ,  William Wang ,  Chung-Cheng Chou ,  Fung-Hsu Wu ,  Chen Peng ,  Ta-Yuan Lee

IPC分类号： B01D21/01

CPC分类号： G02B21/32 ,  Y10T436/25375

摘要： An apparatus of generating an optical tweezers with momentum and method thereof and an optical tweezers photo-image for guiding particles are provided. The apparatus generates at least one optical tweezers on an examined object that carries at least one particle. The apparatus includes a laser source, a diffractive optical element and a convergent lens. The laser beam from the laser source passes through the diffractive optical element to produce a diffractive pattern. The laser beam is then received by the convergent lens and then to be focused on a plane of the examined object. The optic axis of the convergent lens is substantially not perpendicular to the plane of the examined object, so that the laser beam is projected onto the plane of the examined object in a skewed manner for providing a lateral momentum to move the particle.

摘要翻译： 提供了一种用于产生具有动量及其方法的光学镊子的装置和用于引导颗粒的光学镊子照片。 该装置在携带至少一个颗粒的被检查物体上产生至少一个光学镊子。 该装置包括激光源，衍射光学元件和会聚透镜。 来自激光源的激光束通过衍射光学元件以产生衍射图案。 然后激光束被会聚透镜接收，然后被聚焦在被检查物体的平面上。 会聚透镜的光轴基本上不垂直于被检查物体的平面，使得激光束以倾斜的方式投影到被检查物体的平面上，以提供横向动量来移动颗粒。