Method for producing metal/ceramic bonding substrate
    43.
    发明申请
    Method for producing metal/ceramic bonding substrate 有权
    金属/陶瓷接合基板的制造方法

    公开(公告)号:US20070227685A1

    公开(公告)日:2007-10-04

    申请号:US11729221

    申请日:2007-03-28

    IPC分类号: B22D19/04 B22D27/04 B22D27/09

    摘要: After a molten metal of aluminum or an aluminum alloy having a temperature, which is higher than the liquidus line temperature of aluminum or the aluminum alloy by 5 to 200° C., is injected into a mold, when the mold is cooled to solidify the molten metal, the molten metal injected into the mold is pressurized at a pressure of 1.0 to 100 kPa from a high-temperature side to a low-temperature side, and the mean cooling rate is set to be 5 to 100° C./minute while the mold is cooled from the liquidus line temperature to 450° C., the temperature gradient formed in the mold being set to be in the range of from 1° C./cm to 50° C./cm.

    摘要翻译: 在铝或铝合金的熔融金属中,当将铝或铝合金的液相线温度高5〜200℃的温度注入模具时,当模具冷却固化时 熔融金属,注入模具中的熔融金属从高温侧至低温侧以1.0〜100kPa的压力加压,平均冷却速度设定为5〜100℃/分钟 当模具从液相线温度冷却到450℃时,模具中形成的温度梯度被设定在1℃/ cm到50℃/ cm的范围内。

    Magnetic head with ferrite between nonmagnetic portions and a nonmagnetic gap
    47.
    发明授权
    Magnetic head with ferrite between nonmagnetic portions and a nonmagnetic gap 失效
    磁头与非磁性部分之间的铁素体和非磁性间隙

    公开(公告)号:US06801391B2

    公开(公告)日:2004-10-05

    申请号:US10119472

    申请日:2002-04-10

    IPC分类号: G11B5127

    摘要: There is provided a magnetic head formed with a pair of magnetic core halves fitted to abut on each other having a nonmagnetic gap therebetween and having a slide contact plane for slide contact with a magnetic recording medium on which an end face of the nonmagnetic gap and the magnetic core halves. In the magnetic head, a nonmagnetic portion formed by filling a glass material is provided at an end portion of the slide contact plane outer than the end face of the magnetic core halves on the slide contact plane. The inventive magnetic head realizes less volume of magnetic body while solving problems in mechanical strength of the magnetic head or in compatibility to a conventional head. Accordingly, a magnetic head with excellent head performance without decreasing productivity can be obtained.

    摘要翻译: 提供一种磁头,形成有一对磁芯半体,它们彼此抵接,彼此之间具有非磁性间隙,并且具有滑动接触平面,用于与非磁性间隙的端面上的磁记录介质滑动接触, 磁芯半部。 在磁头中,通过填充玻璃材料形成的非磁性部分设置在滑动接触平面外侧的滑动接触平面上的磁芯半部的端面外侧。 本发明的磁头在解决磁头的机械强度问题或兼容于常规磁头的同时实现较少体积的磁体。 因此,可以获得具有优异的头部性能而不降低生产率的磁头。

    Process for the production of a coated copper alloy
    48.
    发明授权
    Process for the production of a coated copper alloy 有权
    涂覆铜合金的生产工艺

    公开(公告)号:US06180174B2

    公开(公告)日:2001-01-30

    申请号:US09432675

    申请日:1999-11-02

    IPC分类号: B05D302

    摘要: The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450° C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

    摘要翻译: 本发明提供了一种具有低摩擦系数和高耐磨性的表面的涂覆的Cu合金的制造方法,适用于制造连接器,电动汽车的充电座等。涂覆的Cu合金是通过涂覆 用Sn合金的铜合金的表面,并在100-450℃的温度范围内对涂覆的Cu合金进行热处理0.5-24小时。 涂有Sn的Cu合金由1-41wt%的Zn组成,余量为Cu和杂质。 通过使用涂覆的Cu合金,可以显着提高连接器的插入力,耐磨性和耐腐蚀性。

    Leadframe made of a high-strength, high-electroconductivity copper alloy
    49.
    发明授权
    Leadframe made of a high-strength, high-electroconductivity copper alloy 失效
    引线框由高强度,高导电性铜合金制成

    公开(公告)号:US6132529A

    公开(公告)日:2000-10-17

    申请号:US827664

    申请日:1997-04-10

    摘要: A leadframe of a single frame structure for supporting leads on IC chips. The leadframe is made of a high-strength, high-electroconductivity copper alloy. The copper alloy is produced by preparing an ingot of a copper alloy of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, and optionally a total of 0.03-0.50 wt. % of either Sn or Zn or both and a total of 0.05-0.50 wt. % of at least one element of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above down to 300.degree. C. or below at a cooling rate of at least 1.degree. C./seconds, heat treating the quenched material at 380 to 520.degree. C. for 60-600 minutes without cold working, and subsequently carrying out cold working and heat treating at 450.degree. C. or below, whereby an Fe--Ni--P system intermetallic compound is precipitated in the Cu matrix as uniform and fine grains not larger than 50 nm.

    摘要翻译: 用于支持IC芯片上的引线的单个框架结构的引线框架。 引线框架由高强度,高导电性铜合金制成。 铜合金通过制备0.05-0.40重量%的铜合金锭, %Fe,0.05-0.40重量% %Ni,0.01-0.30wt。 %P,任选地总计为0.03-0.50wt。 Sn或Zn或两者的%,总共0.05-0.50wt。 Ag,Co,B,Mn,Cr,Si,Ti和Zr中的至少一种元素的%,余量为Cu和偶然杂质,将锭加热至800-950℃,并将锭热加工至还原 比例为50%以上,将热加工材料从600℃以上淬火至300℃以下,冷却速度为1℃/秒以上,将淬火后的材料在380〜520℃下进行热处理 ℃,60〜600分钟,不进行冷加工,随后在450℃以下进行冷加工和热处理,由此将Fe-Ni-P系金属间化合物在Cu基体中沉淀为均匀且细小的颗粒 不大于50nm。

    Process for producing high-strength, high-electroconductivity
copper-base alloys
    50.
    发明授权
    Process for producing high-strength, high-electroconductivity copper-base alloys 失效
    生产高强度,高导电性铜基合金的方法

    公开(公告)号:US5814168A

    公开(公告)日:1998-09-29

    申请号:US662695

    申请日:1996-06-13

    摘要: High-strength, high-electroconductivity copper alloys are produced by preparing an ingot of a copper alloy containing 0.05-0.40 wt % Fe, 0.05-0.40 wt % Ni, 0.01-0.30 wt % P, and optionally a total of 0.03-0.50 wt % of either Sn or Zn or both and a total of 0.05-0.50 wt % of at least one element of Ag, B, Mn, Cr, Si, Ti or Zr, with the balance being Cu and incidental impurities, heating the ingot to 800.degree. to 950.degree. C. and hot working it by a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above to 300.degree. C. or below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched material at 380.degree. to 520.degree. C. for 60 to 600 minutes without performing cold working, and cold working and heat treating it at 450.degree. C. or below, to precipitate an Fe--Ni--P system intermetallic compound in the Cu matrix as uniform and fine grains not larger than 50 nanometers. The copper alloys thus produced are superior in hardness, tensile strength, electrical conductivity and amenability to bending. The copper alloys are useful for making electric and electronic components, such as leadframes.

    摘要翻译: 通过制备含有0.05-0.40重量%Fe,0.05-0.40重量%Ni,0.01-0.30重量%P和任选总计0.03-0.50重量%的铜合金锭,制得高强度,高导电性铜合金 Sn或Zn或两者的%,以及总量为0.05-0.50重量%的Ag,B,Mn,Cr,Si,Ti或Zr中的至少一种元素,余量为Cu和偶然杂质,将锭加热至 800℃〜950℃,通过减压比50%以上进行热加工,将热加工材料从600℃以上淬火至300℃以下,冷却速度为1℃以上 ./sec,在380〜520℃下对骤冷材料进行热处理60〜600分钟,不进行冷加工,冷加工,在450℃以下进行热处理,析出Fe-Ni-P Cu基体中的系统金属间化合物为均匀且细晶粒不大于50纳米。 这样制造的铜合金的硬度,拉伸强度,导电性和弯曲性都优异。 铜合金可用于制造电子和电子部件,例如引线框架。