公开(公告)号：US20090213558A1

公开(公告)日：2009-08-27

申请号：US12361761

申请日：2009-01-29

申请人： Hideki OSAKA ,  Yutaka Uematsu

发明人： Hideki OSAKA ,  Yutaka Uematsu

IPC分类号： H05K1/18

CPC分类号： H05K3/0005 ,  H05K1/0231 ,  H05K2201/093

摘要： An orthogonal array is formed by performing electromagnetic field analysis only once and determining a range by using the mount position and type of a capacitor and the number of capacitors as parameters to perform circuit analysis a small number of times. An estimation equation is formed by using as an index a result of the absolute value of the calculated power source impedance, and a capacitor is disposed to reduce noises by using the estimation equation.

摘要翻译： 仅通过执行电磁场分析一次形成正交阵列，并且通过使用电容器的安装位置和类型以及电容器数量作为参数来确定范围以进行电路分析次数少。 通过使用计算的电源阻抗的绝对值的结果作为指标来形成估计方程，并且通过使用估计方程来设置电容器以减少噪声。

公开(公告)号：US20070145559A1

公开(公告)日：2007-06-28

申请号：US11712440

申请日：2007-03-01

申请人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

发明人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

IPC分类号： H01L23/02

CPC分类号： H01L23/642 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/5286 ,  H01L23/647 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2924/19105 ,  H01L2924/3011

摘要： In a prior art, there has been a method in which a power supply line of an output buffer and that of a control circuit are independently provided so that the power supply noise occurring in the control circuit will not affect the output buffer. However, this method has had the problems that it increases both the number of power supply/grounding pins and power feed line inductance. The present invention provides a technique which, without causing the above two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.

摘要翻译： 在现有技术中，存在一种方法，其中独立地提供输出缓冲器的电源线和控制电路的电源线，使得控制电路中出现的电源噪声不会影响输出缓冲器。 然而，该方法存在增加电源/接地引脚数和馈电线电感的问题。 本发明提供一种技术，其不会引起上述两个问题，即（1）增加电源/接地引脚数量和（2）增加的馈电线电感，防止在控制电路中引起问题的噪声 变成路由并感应到输出缓冲区。 更具体地，可以通过以下两种方法之一来实现上述：（A）为控制电路提供片上旁路电容器，并将控制电路的馈电路径与AC类似的输出缓冲器的馈电路径隔离 方式或（B）设计电参数（插入电阻），使得引入馈电路径的任何电参数噪声的振荡模式将变为过阻尼。

公开(公告)号：US06688279B2

公开(公告)日：2004-02-10

申请号：US10266277

申请日：2002-10-08

申请人： Naoya Ishikawa ,  Teruo Nakada ,  Yutaka Uematsu ,  Masato Honda ,  Tetsuya Honma ,  Jin Yokoyama ,  Ryu Hariyoshi

发明人： Naoya Ishikawa ,  Teruo Nakada ,  Yutaka Uematsu ,  Masato Honda ,  Tetsuya Honma ,  Jin Yokoyama ,  Ryu Hariyoshi

IPC分类号： F02B310

CPC分类号： F02D41/0057 ,  F02B3/06 ,  F02D35/023 ,  F02D41/024 ,  F02D41/402 ,  F02D41/403 ,  F02D2041/3881 ,  Y02T10/26 ,  Y02T10/44 ,  Y02T10/47

摘要： A compression-ignition internal combustion engine for conducting pilot injection and main injection beyond the top dead center, wherein pilot injection quantity and timing are optimized. A compression-ignition internal combustion engine, comprising a fuel injection valve for injecting fuel into a combustion chamber in a cylinder, the quantity and timing of the fuel injected through the fuel injection valve being controlled based on engine operating conditions; wherein pilot injection is carried out prior to the top dead center of compression, main injection is then carried out beyond the top dead center of compression, and fuel injection quantity and fuel injection timing of the pilot injection are set such that the maximum rate of heat release induced by the pilot injection is 60 kJ/s or less.

摘要翻译： 一种用于先导喷射和主喷射超过上止点的压燃式内燃机，其中引燃喷射量和定时被优化。 一种压燃式内燃机，包括用于将燃料喷射到气缸中的燃烧室中的燃料喷射阀，通过燃料喷射阀喷射的燃料的量和正时基于发动机工作条件进行控制; 其中先导喷射在压缩的上止点之前进行，然后主喷射超过压缩上止点，并且引燃喷射的燃料喷射量和燃料喷射正时被设定为使得最大热量 由引燃喷射引起的释放为60kJ / s以下。

公开(公告)号：US5377291A

公开(公告)日：1994-12-27

申请号：US451234

申请日：1989-12-15

申请人： Genichi Hatakoshi ,  Masaki Okajima ,  Kazutaka Terashima ,  Yutaka Uematsu

发明人： Genichi Hatakoshi ,  Masaki Okajima ,  Kazutaka Terashima ,  Yutaka Uematsu

IPC分类号： G02B6/124 ,  G02B6/32 ,  G02B6/34 ,  G02B27/44 ,  G02F1/37 ,  G02F1/377 ,  G02F1/383

CPC分类号： G02F1/377 ,  G02B27/4233 ,  G02B6/124 ,  G02B6/32 ,  G02B6/34 ,  G02B27/0944 ,  G02F1/383 ,  G02F2001/372 ,  G02F2001/374

摘要： A wavelength converting optical device includes an optical waveguide which has a waveguide portion and a cladding portion, at least one of which is formed of a nonlinear optical material. A fundamental wave, incident on the waveguide portion from an input end face of the waveguide, is converted into an optical second harmonic wave by Cerenkov radiation and is radiated into the cladding portion. The radiated second harmonic wave is output from an output end face of the waveguide. A reflecting film is provided on the emerging end face of the waveguide. The reflecting film includes a high reflectivity with respect to the fundamental wave of a guide mode and a low reflectivity with respect to the optical second harmonic wave. A wave front converting element is arranged to oppose the reflecting film. The converting element has a diffraction grating for converting the second harmonic wave, emerging from the output end face of the waveguide, into a plane wave.

公开(公告)号：US4176367A

公开(公告)日：1979-11-27

申请号：US885128

申请日：1978-03-10

申请人： Yutaka Uematsu

发明人： Yutaka Uematsu

IPC分类号： H04B10/00 ,  G02B6/42 ,  H01L31/04 ,  H01L31/12 ,  H01L33/00 ,  H01L33/14 ,  H01L33/20 ,  H01L33/30 ,  H01L33/38 ,  H04B10/43

CPC分类号： G02B6/4246 ,  H01L31/125 ,  H04B10/43

摘要： A semiconductor optical device includes a semiconductor body, a light emitting layer formed on the body to form a pn junction therebetween, a semiconductor layer formed on the light emitting layer and a diffusing region formed in the semiconductor layer to define a pn junction therebetween and electrically connected to the light emitting layer. Three electrodes are respectively provided on the semiconductor body, semiconductor layer and diffusing region, which are selectively operated.

摘要翻译： 半导体光学器件包括半导体本体，形成在主体上以在其间形成pn结的发光层，形成在发光层上的半导体层和形成在半导体层中的扩散区域，以在其间限定pn结，并且电 连接到发光层。 三个电极分别设置在半导体本体，半导体层和扩散区域上，这些电极被选择性地操作。

公开(公告)号：US08981790B2

公开(公告)日：2015-03-17

申请号：US13375742

申请日：2010-05-26

申请人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

发明人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

IPC分类号： G01R29/26 ,  G01R31/08 ,  G01R31/00 ,  G01R31/28 ,  H05K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32

CPC分类号： G01R31/001 ,  G01R29/26 ,  G01R31/281 ,  H05K1/0215 ,  H05K1/0234 ,  H05K1/141 ,  H05K3/325 ,  H05K9/0039 ,  H05K9/0069 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/2036

摘要： A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

摘要翻译： 通过其中安装有电子部件的基板的噪声电流被抑制在壳体中，以提供电子设备的故障。 其上安装有电子部件的基板（103）通过金属间隔件（108）和螺钉（104）固定到壳体（102）。 主要由绝缘物质组成的噪声控制构件（100）设置在金属间隔件（108）和基板（103）之间。 第一导电膜形成在噪声控制部件（100）的金属间隔件侧上，第二导电膜形成在噪声控制部件（100）的基板侧。 电阻构件（101）设置在第一导电膜和第二导电膜之间。 可以通过电阻元件来抑制从外壳引入基板的噪声电流。

公开(公告)号：US08878351B2

公开(公告)日：2014-11-04

申请号：US12318700

申请日：2009-01-06

申请人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

发明人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

IPC分类号： H01L23/02 ,  H01L23/50 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L25/0657 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L25/18 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/15311 ,  H01L2224/05599

摘要： A semiconductor device having a chip-on-chip structure is constituted of a first semiconductor chip and even-numbered pairs of second semiconductor chips, all of which are laminated together on the surface of an interposer. The first semiconductor chip controls each pair of the second semiconductor chips so as to activate one second semiconductor chip while inactivating another second semiconductor chip. The second semiconductor chips are paired together in such a way that through-vias and electrodes thereof are positioned opposite to each other via bumps. Since drive voltage electrodes supplied with a drive voltage (VDD) and reference potential electrodes supplied with a reference potential (VSS) are mutually connected together between the paired second semiconductor chips, it is possible to increase the overall electrostatic capacitance of each second semiconductor chip so as to substantially reduce feed noise without increasing the overall layout area of the semiconductor device.

摘要翻译： 具有片上芯片结构的半导体器件由第一半导体芯片和偶数对的第二半导体芯片组成，所有第二半导体芯片在中介层的表面上层压在一起。 第一半导体芯片控制每对第二半导体芯片，以激活一个第二半导体芯片，同时使另一个第二半导体芯片失效。 第二半导体芯片以通孔和电极通过凸块彼此相对定位的方式配对在一起。 由于提供有驱动电压（VDD）的驱动电压电极和提供参考电位（VSS）的参考电位电极在成对的第二半导体芯片之间相互连接在一起，因此可以增加每个第二半导体芯片的总静电电容 以便在不增加半导体器件的整体布局面积的情况下显着降低馈送噪声。

公开(公告)号：US08866282B2

公开(公告)日：2014-10-21

申请号：US13586104

申请日：2012-08-15

申请人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H01L23/52 ,  H04L25/02 ,  H05K1/02 ,  H01L49/02 ,  H01L23/12

CPC分类号： H01L28/20 ,  H01L23/12 ,  H01L23/5228 ,  H01L2224/16225 ,  H04L25/02 ,  H04L25/0272 ,  H04L25/0288 ,  H05K1/02 ,  H05K1/0234 ,  H05K1/0246 ,  H05K1/025 ,  H05K2201/10022 ,  H05K2201/10159

摘要： A slew rate of a signal transmitted between a semiconductor device having a small load capacitance and a semiconductor device having a large load capacitance is improved. When a signal is transmitted to the semiconductor device (for example, a memory device) having the large load capacitance, pre-emphasis is performed, and when a signal is transmitted to the semiconductor device (for example, a memory controller) having the small load capacitance, pre-emphasis is not performed or is slightly performed. By this, when the signal is transmitted to the memory device, blunting in signal rising due to the load capacitance is suppressed, and when the signal is transmitted to the memory controller, ringing due to the reflection of the signal is suppressed, and the slew rate of the data transmission is improved.

摘要翻译： 在具有小负载电容的半导体器件和具有大负载电容的半导体器件之间传输的信号的转换速率得到改善。 当信号被发送到具有大的负载电容的半导体器件（例如，存储器件）时，执行预加重，并且当信号被发送到具有小的负载电容的半导体器件（例如，存储器控制器） 负载电容，预加重不执行或略微执行。 由此，当信号被发送到存储装置时，由于负载电容而导致的信号上升的钝化被抑制，并且当信号被发送到存储器控制器时，由于信号的反射而被抑制的振铃 数据传输速率提高。

公开(公告)号：US20130207234A1

公开(公告)日：2013-08-15

申请号：US13586104

申请日：2012-08-15

申请人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H01L49/02

CPC分类号： H01L28/20 ,  H01L23/12 ,  H01L23/5228 ,  H01L2224/16225 ,  H04L25/02 ,  H04L25/0272 ,  H04L25/0288 ,  H05K1/02 ,  H05K1/0234 ,  H05K1/0246 ,  H05K1/025 ,  H05K2201/10022 ,  H05K2201/10159

摘要： A slew rate of a signal transmitted between a semiconductor device having a small load capacitance and a semiconductor device having a large load capacitance is improved. When a signal is transmitted to the semiconductor device (for example, a memory device) having the large load capacitance, pre-emphasis is performed, and when a signal is transmitted to the semiconductor device (for example, a memory controller) having the small load capacitance, pre-emphasis is not performed or is slightly performed. By this, when the signal is transmitted to the memory device, blunting in signal rising due to the load capacitance is suppressed, and when the signal is transmitted to the memory controller, ringing due to the reflection of the signal is suppressed, and the slew rate of the data transmission is improved.

摘要翻译： 在具有小负载电容的半导体器件和具有大负载电容的半导体器件之间传输的信号的转换速率得到改善。 当信号被发送到具有大的负载电容的半导体器件（例如，存储器件）时，执行预加重，并且当信号被发送到具有小的负载电容的半导体器件（例如，存储器控制器） 负载电容，预加重不执行或略微执行。 由此，当信号被发送到存储装置时，由于负载电容而导致的信号上升的钝化被抑制，并且当信号被发送到存储器控制器时，由于信号的反射而被抑制的振铃 数据传输速率提高。

公开(公告)号：US20130199217A1

公开(公告)日：2013-08-08

申请号：US13877786

申请日：2011-09-27

申请人： Fuijo Arai ,  Yutaka Uematsu

发明人： Fuijo Arai ,  Yutaka Uematsu

IPC分类号： F25B30/02

CPC分类号： F25B30/02 ,  B60H1/00278 ,  B60H1/00492 ,  B60H1/00921 ,  B60H1/3211 ,  B60H1/3213 ,  B60H1/323 ,  B60H2001/00307 ,  B60H2001/3258 ,  B60H2001/3261 ,  B60L1/003 ,  B60L11/14 ,  B60L11/1874 ,  B60L11/1875 ,  B60L11/1887 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/662 ,  B60L2270/46 ,  F25B5/02 ,  F25B2341/066 ,  F25B2600/2513 ,  H01M10/486 ,  H01M10/625 ,  H01M10/663 ,  Y02T10/70 ,  Y02T10/705 ,  Y02T10/7077 ,  Y02T10/7291 ,  Y02T90/16 ,  Y02T90/34

摘要： An air conditioner for a vehicle includes: a compressor (21); an internal heat exchanger (22, 24) which exchanges heat between the refrigerant and air in an interior space; an external heat exchanger (23) which exchanges heat between the refrigerant and outside air; a battery (5): a battery heat exchanger (29) which exchanges heat between the refrigerant and the battery by causing the refrigerant, which travels to the compressor from the external heat exchanger, to go through the battery heat exchanger; a throttle adjusting part (30) which is arranged in a refrigerant flow passage on an upstream side of the battery heat exchanger; and a control unit (40). The control unit (40) controls the flow of the refrigerant through the throttle adjusting part based on an extra heat exchange capacity that is an extra capacity of the external heat exchanger with respect to the internal heat exchanger.

摘要翻译： 一种用于车辆的空调器包括：压缩机（21）; 内部热交换器（22,24），其在内部空间中在制冷剂和空气之间交换热量; 外部热交换器（23），其在制冷剂和外部空气之间交换热量; 电池（5）：通过使来自外部热交换器的压缩机行进的制冷剂通过电池热交换器而在制冷剂与电池之间进行热交换的电池热交换器（29） 节流调节部（30），其配置在电池热交换器的上游侧的制冷剂流路中; 和控制单元（40）。 控制单元40基于作为外部热交换器相对于内部热交换器的额外容量的额外的热交换容量来控制通过节气门调节部的制冷剂的流动。