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    Semiconductor device and wiring part thereof
    1.
    发明授权
    Semiconductor device and wiring part thereof 有权
    半导体器件及其布线部分

    公开(公告)号：US07990228B2

    公开(公告)日：2011-08-02

    申请号：US12060941

    申请日：2008-04-02

    申请人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

    发明人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

    IPC分类号： H04B3/28

    CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/111 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10734 ,  H01L2924/00

    摘要： A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 μm therebetween.

    摘要翻译： 提供了能够实现半导体器件的安装密度和噪声降低的改进的技术。 安装在印刷电路板上的LSI包括接地BGA球和电源BGA球，以从印刷线路板获得电源，并且接地BGA球和电源BGA球彼此靠近地布置。 去耦电容器安装在印刷电路板上，并具有第一端子和第二端子。 接地BGA球和第一端子通过第一金属电极板连接，电力BGA球和第二端子通过第二金属电极板连接。 第一金属电极板和第二金属电极板之间插入厚度等于或小于1μm的电介质膜。

    Semiconductor device
    2.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20090189293A1

    公开(公告)日：2009-07-30

    申请号：US12318700

    申请日：2009-01-06

    申请人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

    发明人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

    IPC分类号： H01L23/522

    CPC分类号： H01L25/0657 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L25/18 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/15311 ,  H01L2224/05599

    摘要： A semiconductor device having a chip-on-chip structure is constituted of a first semiconductor chip and even-numbered pairs of second semiconductor chips, all of which are laminated together on the surface of an interposer. The first semiconductor chip controls each pair of the second semiconductor chips so as to activate one second semiconductor chip while inactivating another second semiconductor chip. The second semiconductor chips are paired together in such a way that through-vias and electrodes thereof are positioned opposite to each other via bumps. Since drive voltage electrodes supplied with a drive voltage (VDD) and reference potential electrodes supplied with a reference potential (VSS) are mutually connected together between the paired second semiconductor chips, it is possible to increase the overall electrostatic capacitance of each second semiconductor chip so as to substantially reduce feed noise without increasing the overall layout area of the semiconductor device.

    摘要翻译： 具有片上芯片结构的半导体器件由第一半导体芯片和偶数对的第二半导体芯片组成，所有第二半导体芯片在中介层的表面上层压在一起。 第一半导体芯片控制每对第二半导体芯片，以激活一个第二半导体芯片，同时使另一个第二半导体芯片失效。 第二半导体芯片以通孔和电极通过凸块彼此相对定位的方式配对在一起。 由于提供有驱动电压（VDD）的驱动电压电极和提供参考电位（VSS）的参考电位电极在成对的第二半导体芯片之间相互连接在一起，因此可以增加每个第二半导体芯片的总静电电容 以便在不增加半导体器件的整体布局面积的情况下显着降低馈送噪声。

    SEMICONDUCTOR DEVICE AND WIRING PART THEREOF
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND WIRING PART THEREOF 有权
    半导体器件及其接线部分

    公开(公告)号：US20080266031A1

    公开(公告)日：2008-10-30

    申请号：US12060941

    申请日：2008-04-02

    申请人： Yutaka UEMATSU ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

    发明人： Yutaka UEMATSU ,  Hideki Osaka ,  Yoji Nishio ,  Eiichi Suzuki

    IPC分类号： H01P1/00

    CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/111 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10734 ,  H01L2924/00

    摘要： A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 μm therebetween.

    摘要翻译： 提供了能够实现半导体器件的安装密度和噪声降低的改进的技术。 安装在印刷电路板上的LSI包括接地BGA球和电源BGA球，以从印刷线路板获得电源，并且接地BGA球和电源BGA球彼此靠近地布置。 去耦电容器安装在印刷电路板上，并具有第一端子和第二端子。 接地BGA球和第一端子通过第一金属电极板连接，电力BGA球和第二端子通过第二金属电极板连接。 第一金属电极板和第二金属电极板在其间插入厚度等于或小于1μm的电介质膜。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08878351B2

    公开(公告)日：2014-11-04

    申请号：US12318700

    申请日：2009-01-06

    申请人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

    发明人： Eiichi Suzuki ,  Hideki Osaka ,  Yutaka Uematsu ,  Yoji Nishio

    IPC分类号： H01L23/02 ,  H01L23/50 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

    CPC分类号： H01L25/0657 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L25/18 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/15311 ,  H01L2224/05599

    摘要： A semiconductor device having a chip-on-chip structure is constituted of a first semiconductor chip and even-numbered pairs of second semiconductor chips, all of which are laminated together on the surface of an interposer. The first semiconductor chip controls each pair of the second semiconductor chips so as to activate one second semiconductor chip while inactivating another second semiconductor chip. The second semiconductor chips are paired together in such a way that through-vias and electrodes thereof are positioned opposite to each other via bumps. Since drive voltage electrodes supplied with a drive voltage (VDD) and reference potential electrodes supplied with a reference potential (VSS) are mutually connected together between the paired second semiconductor chips, it is possible to increase the overall electrostatic capacitance of each second semiconductor chip so as to substantially reduce feed noise without increasing the overall layout area of the semiconductor device.

    摘要翻译： 具有片上芯片结构的半导体器件由第一半导体芯片和偶数对的第二半导体芯片组成，所有第二半导体芯片在中介层的表面上层压在一起。 第一半导体芯片控制每对第二半导体芯片，以激活一个第二半导体芯片，同时使另一个第二半导体芯片失效。 第二半导体芯片以通孔和电极通过凸块彼此相对定位的方式配对在一起。 由于提供有驱动电压（VDD）的驱动电压电极和提供参考电位（VSS）的参考电位电极在成对的第二半导体芯片之间相互连接在一起，因此可以增加每个第二半导体芯片的总静电电容 以便在不增加半导体器件的整体布局面积的情况下显着降低馈送噪声。

    Information processing system, and its power-saving control method and device
    7.
    发明授权
    Information processing system, and its power-saving control method and device 有权
    信息处理系统及其省电控制方法和装置

    公开(公告)号：US09507392B2

    公开(公告)日：2016-11-29

    申请号：US13548536

    申请日：2012-07-13

    申请人： Tohru Nojiri ,  Jun Okitsu ,  Yuki Kuroda ,  Eiichi Suzuki ,  Takeshi Kato ,  Tatsuya Saito

    发明人： Tohru Nojiri ,  Jun Okitsu ,  Yuki Kuroda ,  Eiichi Suzuki ,  Takeshi Kato ,  Tatsuya Saito

    IPC分类号： G06F9/46 ,  G06F1/20 ,  G06F1/32 ,  G06F9/50 ,  G06F3/06 ,  H04L29/08 ,  G06F9/455

    CPC分类号： G06F1/206 ,  G06F1/3203 ,  G06F3/0625 ,  G06F9/45558 ,  G06F9/5094 ,  G06F2009/4557 ,  G06F2009/45591 ,  H04L67/1008 ,  Y02D10/154 ,  Y02D10/16 ,  Y02D10/22

    摘要： Pieces of working information on workloads, positions of the workloads, pieces of environmental information on cooling facilities, and positions of the cooling facilities are stored as arrangement information. The pieces of working information on the workloads are estimated, and allocation of tentative workloads is deduced for fear the pieces of working information may exceed the performances of a group of information processing devices. Tentative power consumptions and arrangement information resulting from the allocation of the tentative workloads, and tentative power consumptions and arrangement information necessary for the allocation of the tentative workloads are calculated. Tentative cooling powers required to control the cooling facilities are calculated. Allocation of the tentative workloads minimizing the sum total of the tentative power consumptions of the information processing devices and the tentative cooling powers of the cooling facilities is searched. Based on the searched allocation, the workloads are allocated to the information processing devices.

    摘要翻译： 关于工作负载的工作信息，工作负载的位置，冷却设施的环境信息以及冷却设施的位置的部分被存储为布置信息。 对工作量的工作信息进行估计，推测工作量的分配是因为担心工作信息可能会超过一组信息处理设备的性能。 计算由暂定工作负荷的分配产生的暂时功耗和安排信息，以及暂时性工作负荷分配所需的暂时功耗和安排信息。 计算控制冷却设施所需的暂时冷却功率。 搜索最小化信息处理设备的暂时功耗和冷却设施的暂时冷却功率的总和的暂时工作负荷的分配。 基于搜索到的分配，工作量被分配给信息处理设备。

    Water treatment method and apparatus
    8.
    发明授权
    Water treatment method and apparatus 失效
    水处理方法和装置

    公开(公告)号：US07455775B2

    公开(公告)日：2008-11-25

    申请号：US11594970

    申请日：2006-11-09

    申请人： Eiichi Suzuki ,  Yukio Doi ,  Hayato Kurokawa ,  Yosuke Tabata ,  Toshiyuki Iwama

    发明人： Eiichi Suzuki ,  Yukio Doi ,  Hayato Kurokawa ,  Yosuke Tabata ,  Toshiyuki Iwama

    IPC分类号： C02F3/00

    CPC分类号： C02F3/02 ,  C02F1/76 ,  C02F3/06 ,  C02F3/2806 ,  C02F2209/11 ,  Y02W10/15

    摘要： It is an object of the invention to provide an effective technique for detecting the quality of water with high accuracy. A representative water treatment apparatus includes an aerobic treatment region that treats water aerobically, a downstream region in which the water aerobically treated in the aerobic treatment region flows, a water quality sensor that is submerged in the downstream region and detects the water quality and a sensor washing arrangement that washes the water quality sensor by supplying the water of the downstream region to the water quality sensor at a flow rate higher than water flowing around the water quality sensor. As a result, sludge generated due to aerobic treatment can be prevented from being deposited on the water quality sensor and/or deposited sludge can be removed, so that the accuracy of water quality detection of the water quality sensor can be enhanced.

    摘要翻译： 本发明的目的是提供一种高精度检测水质的有效技术。 代表性的水处理装置包括：有氧处理水的好氧处理区域，在需氧处理区域中经过有氧处理的水流动的下游区域，浸没在下游区域中的水质传感器，检测水质;以及传感器 洗涤装置，其通过以比流过水质传感器的水流量高的流量向水质传感器供给下游区域的水来洗涤水质量传感器。 结果，可以防止由于需氧处理而产生的污泥沉积在水质传感器上，和/或沉积的污泥可以被去除，从而可以提高水质传感器的水质检测精度。