EXPANDABLE INTERBODY FUSION DEVICE
    41.
    发明申请
    EXPANDABLE INTERBODY FUSION DEVICE 有权
    可扩展的内部融合设备

    公开(公告)号:US20160058570A1

    公开(公告)日:2016-03-03

    申请号:US14939007

    申请日:2015-11-12

    Abstract: An expandable interbody fusion device includes superior and inferior plates that are configured to receive a sequentially inserted stack of expansion members or wafers. The superior and inferior plates include features that at least initially interlock the two plates until the superior plate is dislodged by pressure from the growing wafer stack. The wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. Each wafer also includes features that interlock with the inferior plate until the wafer id dislodged by sequential introduction of another wafer.

    Abstract translation: 可扩展的体内融合装置包括上板和下板,其被构造成接收依次插入的膨胀构件或晶片叠。 上下板包括至少最初互锁两个板的特征,直到上板通过生长的晶片堆的压力移动。 晶片包括其顶表面和底表面上的特征,其以多个自由度将晶片互锁,使得当熔化器件完全膨胀时,晶片堆叠不被破坏。 每个晶片还包括与下板互锁的特征,直到通过顺序引入另一个晶片来移除晶片id。

Patent Agency Ranking